Patents by Inventor Naing Tun Thet

Naing Tun Thet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12053552
    Abstract: The invention relates to a functional wound dressing being able to detect and indicate the state of the wound, in particular with regard to infections for example caused by toxins produced by bacteria such Staphylococcus aureus and Pseudomonas aeruginosa. The present wound dressing can be used in moist wound healing and contains a substance being able to absorb wound exudate from the wound and to provide moisture to the wound.
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: August 6, 2024
    Assignee: PAUL HARTMANN AG
    Inventors: Markus Kettel, Andrew Tobias Jenkins, Naing Tun Thet
  • Publication number: 20210361822
    Abstract: The invention relates to a functional wound dressing being able to detect and indicate the state of the wound, in particular with regard to infections for example caused by toxins produced by bacteria such Staphylococcus aureus and Pseudomonas aeruginosa. The present wound dressing can be used in moist wound healing and contains a substance being able to absorb wound exudate from the wound and to provide moisture to the wound.
    Type: Application
    Filed: May 13, 2019
    Publication date: November 25, 2021
    Inventors: Markus KETTEL, Andrew Tobias JENKINS, Naing Tun THET
  • Patent number: 8420530
    Abstract: A method for forming interconnects in a substrate, the substrate comprising a semiconductor layer on an oxide layer forming a silicon-on-oxide substrate, the method comprising forming a plurality of holes into the substrate to the semiconductor layer, and metalizing the plurality of holes to form the interconnects.
    Type: Grant
    Filed: August 10, 2007
    Date of Patent: April 16, 2013
    Assignee: Agency for Science, Technology and Research
    Inventors: Naing Tun Thet, Christian Joachim, Natarajan Chandrasekhar
  • Publication number: 20110018138
    Abstract: A method for forming interconnects in a substrate, the substrate comprising a semiconductor layer on an oxide layer forming a silicon-on-oxide substrate, the method comprising forming a plurality of holes into the substrate to the semiconductor layer, and metalizing the plurality of holes to form the interconnects.
    Type: Application
    Filed: August 10, 2007
    Publication date: January 27, 2011
    Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
    Inventors: Naing Tun Thet, Christian Joachim, N. Chandrasekhar