Patents by Inventor Nakano Liu

Nakano Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200160230
    Abstract: A computer-implemented method is presented for automatically generating alerting rules. The method includes identifying, via offline analytics, abnormal patterns and normal patterns from history logs based on machine learning, statistical analysis and deep learning, the history logs stored in a history log database, automatically generating the alerting rules based on the identified abnormal and normal patterns, and transmitting the alerting rules to an alerting engine for evaluation. The method further includes receiving a plurality of online log messages from a plurality of computing devices connected to a network, augmenting the plurality of online log messages, and extracting information from the plurality of augmented online log messages to be provided to the alerting engine, the alerting engine configured to approve and enforce the alerting rules automatically generated by the offline analytics processing.
    Type: Application
    Filed: November 19, 2018
    Publication date: May 21, 2020
    Inventors: Yuan Wang, Lin Yang, Xiao Xi Liu, Fan Jing Meng, Jing Min Xu, William V. Da Palma, Sandhya Kapoor, Takayuki Kushida, Hiroki Nakano
  • Patent number: 8911551
    Abstract: An electroless plating apparatus and method designed specifically for plating at least one semiconductor wafer are disclosed. The apparatus comprises a container, a wafer holder, an electrolyte supplying unit, and an ultrasonic-vibration unit. The container is provided with at least an inlet and used for containing electrolyte. The wafer holder is provided within the container. The electrolyte supplying unit is used to supply the electrolyte into the container via the inlet. The ultrasonic-vibration unit consisting of at least one frequency ultrasonic transducer is disposed in the container for producing a uniform flow of electrolyte in the container. Thereby, the wafers can be uniformly plated, especially for wafers with fine via-holes or trench structures.
    Type: Grant
    Filed: August 2, 2011
    Date of Patent: December 16, 2014
    Assignee: Win Semiconductor Corp.
    Inventors: Jason Chen, Nakano Liu, Winson Shao, Wen Chu, Chang-Hwang Hua
  • Publication number: 20130034959
    Abstract: An electroless plating apparatus and method designed specifically for plating at least one semiconductor wafer are disclosed. The apparatus comprises a container, a wafer holder, an electrolyte supplying unit, and an ultrasonic-vibration unit. The container is provided with at least an inlet and used for containing electrolyte. The wafer holder is provided within the container. The electrolyte supplying unit is used to supply the electrolyte into the container via the inlet. The ultrasonic-vibration unit consisting of at least one frequency ultrasonic transducer is disposed in the container for producing a uniform flow of electrolyte in the container. Thereby, the wafers can be uniformly plated, especially for wafers with fine via-holes or trench structures.
    Type: Application
    Filed: August 2, 2011
    Publication date: February 7, 2013
    Inventors: Jason CHEN, Nakano Liu, Winson Shao, Wen Chu, Chang-Hwang Hua