Patents by Inventor Nakano Liu

Nakano Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroless plating apparatus and method
    Patent number: 8911551
    Abstract: An electroless plating apparatus and method designed specifically for plating at least one semiconductor wafer are disclosed. The apparatus comprises a container, a wafer holder, an electrolyte supplying unit, and an ultrasonic-vibration unit. The container is provided with at least an inlet and used for containing electrolyte. The wafer holder is provided within the container. The electrolyte supplying unit is used to supply the electrolyte into the container via the inlet. The ultrasonic-vibration unit consisting of at least one frequency ultrasonic transducer is disposed in the container for producing a uniform flow of electrolyte in the container. Thereby, the wafers can be uniformly plated, especially for wafers with fine via-holes or trench structures.
    Type: Grant
    Filed: August 2, 2011
    Date of Patent: December 16, 2014
    Assignee: Win Semiconductor Corp.
    Inventors: Jason Chen, Nakano Liu, Winson Shao, Wen Chu, Chang-Hwang Hua
  • ELECTROLESS PLATING APPARATUS AND METHOD
    Publication number: 20130034959
    Abstract: An electroless plating apparatus and method designed specifically for plating at least one semiconductor wafer are disclosed. The apparatus comprises a container, a wafer holder, an electrolyte supplying unit, and an ultrasonic-vibration unit. The container is provided with at least an inlet and used for containing electrolyte. The wafer holder is provided within the container. The electrolyte supplying unit is used to supply the electrolyte into the container via the inlet. The ultrasonic-vibration unit consisting of at least one frequency ultrasonic transducer is disposed in the container for producing a uniform flow of electrolyte in the container. Thereby, the wafers can be uniformly plated, especially for wafers with fine via-holes or trench structures.
    Type: Application
    Filed: August 2, 2011
    Publication date: February 7, 2013
    Inventors: Jason CHEN, Nakano Liu, Winson Shao, Wen Chu, Chang-Hwang Hua