Patents by Inventor Nakul Midha

Nakul Midha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9961174
    Abstract: System, methods and apparatus are described that model analog behavior in a multi-wire, multi-phase communications link. A digital signal representative of a physical connection in a communications link and a virtual signal characterizing a three-phase signal transmitted over the physical connection are generated. The virtual signal may be configured to model one or more analog characteristics of the physical connection. The analog characteristics may include voltage states defining the three-phase signal. The analog characteristics of the physical connection include at least three voltage states corresponding to signaling states of the three-phase signal.
    Type: Grant
    Filed: January 15, 2014
    Date of Patent: May 1, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Xiang Li, Nakul Midha, Varun Radhakrishnan, Chulkyu Lee
  • Publication number: 20180115637
    Abstract: System, methods and apparatus are described that model analog behavior in a multi-wire, multi-phase communications link A digital signal representative of a physical connection in a communications link and a virtual signal characterizing a three-phase signal transmitted over the physical connection are generated. The virtual signal may be configured to model one or more analog characteristics of the physical connection. The analog characteristics may include voltage states defining the three-phase signal. The analog characteristics of the physical connection include at least three voltage states corresponding to signaling states of the three-phase signal.
    Type: Application
    Filed: December 21, 2017
    Publication date: April 26, 2018
    Inventors: Xiang Li, Nakul Midha, Varun Radhakrishnan, Chulkyu Lee
  • Publication number: 20150201052
    Abstract: System, methods and apparatus are described that model analog behavior in a multi-wire, multi-phase communications link. A digital signal representative of a physical connection in a communications link and a virtual signal characterizing a three-phase signal transmitted over the physical connection are generated. The virtual signal may be configured to model one or more analog characteristics of the physical connection. The analog characteristics may include voltage states defining the three-phase signal. The analog characteristics of the physical connection include at least three voltage states corresponding to signaling states of the three-phase signal.
    Type: Application
    Filed: January 15, 2014
    Publication date: July 16, 2015
    Applicant: QUALCOMM Incorporated
    Inventors: Xiang Li, Nakul Midha, Varun Radhakrishnan, Chulkyu Lee