Patents by Inventor Nalini Muppala

Nalini Muppala has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System-in-package cellular assembly
    Patent number: 11765823
    Abstract: A system-in-package cellular assembly is disclosed. The assembly may include a main board including a multi-layer printed circuit board. The main board may include one or more through holes and be detachably connectable to an end-product via the one or more through holes and one or more connecting members. The main board may be reversibly, electrically couplable to the end-product via the one or more through holes and the one or more connecting members. The assembly may include an add-on board including one or more through holes and be detachably connectable to the main board via one or more connectors. The add-on board may be reversibly, electrically couplable to the main board via one or more main board surface mount connectors and one or more add-on board surface mount connectors. The add-on board may include at least one of one or more sensors or one or more sensor through holes.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: September 19, 2023
    Assignee: Signetik, LLC
    Inventors: Steven Poulsen, Christopher Lawson, Nalini Muppala
  • System-in-package cellular assembly
    Patent number: 11357103
    Abstract: A system-in-package cellular assembly is disclosed. The assembly may include a main board including a multi-layer printed circuit board. The main board may include one or more through holes and be detachably connectable to an end-product via the one or more through holes and one or more connecting members. The main board may be reversibly, electrically couplable to the end-product via the one or more through holes and the one or more connecting members. The assembly may include an add-on board including one or more through holes and be detachably connectable to the main board via one or more connectors. The add-on board may be reversibly, electrically couplable to the main board via one or more main board surface mount connectors and one or more add-on board surface mount connectors. The add-on board may include at least one of one or more sensors or one or more sensor through holes.
    Type: Grant
    Filed: January 21, 2021
    Date of Patent: June 7, 2022
    Assignee: Signetik, LLC
    Inventors: Steven Poulsen, Christopher Lawson, Nalini Muppala