Patents by Inventor Nam-Boo Cho

Nam-Boo Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10178773
    Abstract: Provided is a method for manufacturing a metal printed circuit board, the method including: printing a circuit pattern on a release film; applying a heat conductive insulating layer on the circuit pattern; laminating a heat conductive base layer on the heat conductive insulating layer and hot pressing the laminated heat conductive base layer and the heat conductive insulating layer; and removing the release film therefrom.
    Type: Grant
    Filed: December 24, 2012
    Date of Patent: January 8, 2019
    Assignee: INKTEC CO., LTD.
    Inventors: Kwang-Choon Chung, Nam Boo Cho, Young-Koo Han, Myung Bong Yoo, Woong Ku On
  • Patent number: 9832882
    Abstract: Provided herein is a conductive pattern making method and conductive pattern, the method including forming a groove such that its width in an inlet area is bigger than its width in an inner area; filling the groove with a conductive ink composition; and drying the conductive ink composition so that a solvent contained in the conductive ink composition inside the groove is volatilized to reduce the volume of the conductive ink composition.
    Type: Grant
    Filed: September 8, 2014
    Date of Patent: November 28, 2017
    Assignee: INKTEC CO., LTD.
    Inventors: Kwang-Choon Chung, Ji Hoon Yoo, Joonki Seong, Dae Sang Han, Nam-Boo Cho
  • Patent number: 9788418
    Abstract: Provided herein is a method for manufacturing a conductive transparent substrate, the method including forming a plurality of main electrodes on the substrate such that the main electrodes are distanced from one another; and forming a connecting electrode that electrically connects two or more main electrodes such that the plurality of main electrodes are grouped into a plurality of group electrodes that are electrically disconnected from one another, thereby producing a conductive transparent substrate with excellent transmittance in a process of high yield.
    Type: Grant
    Filed: July 7, 2014
    Date of Patent: October 10, 2017
    Assignee: INKTEC CO., LTD.
    Inventors: Kwang-Choon Chung, Ji Hoon Yoo, Joonki Seong, Byung Hun Kim, Nam-Boo Cho, Myung-Bong Yoo
  • Publication number: 20160192477
    Abstract: Provided herein is a method for manufacturing a conductive transparent substrate, the method including forming a plurality of main electrodes on the substrate such that the main electrodes are distanced from one another; and forming a connecting electrode that electrically connects two or more main electrodes such that the plurality of main electrodes are grouped into a plurality of group electrodes that are electrically disconnected from one another, thereby producing a conductive transparent substrate with excellent transmittance in a process of high yield.
    Type: Application
    Filed: July 7, 2014
    Publication date: June 30, 2016
    Inventors: Kwang-Choon Chung, Ji Hoon Yoo, Joonki Seong, Byung Hun Kim, Nam Boo Cho, Myung-Bong Yoo
  • Patent number: 9313900
    Abstract: Disclosed is a method for manufacturing a double-sided printed circuit board (PCB) having a circuit pattern by printing a conductive paste. According to the method of the present invention, a circuit pattern that is precise and highly conductive can be formed, and a reduction in raw materials and the simplification of processes are made possible. Also, due to the printing of the conductive paste, short-circuit can be prevented even when a conductive layer is bent or exposed to heat or physical impact.
    Type: Grant
    Filed: April 2, 2010
    Date of Patent: April 12, 2016
    Assignees: Inktec Co., Ltd., Haeun Chemtec Co., Ltd.
    Inventors: Kwang Choon Chung, Young-Koo Han, Myung-Bong Yoo, Nam-Boo Cho, Young-Ho Han, Kyong-Min Lee, Kwang-Baek Yoon, Hee-Yong Ahn, Su-Han Kim
  • Patent number: 9167735
    Abstract: Provided is a method for manufacturing an electromagnetic interference (EMI) shielding film, including: (a) providing a single insulating layer on a first protective film, the insulating layer being made of an insulating layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and at least one filler selected from a flame-retardant filler and an abrasion-resistant filler; (b) providing a metal layer on the insulating layer; (c) providing a conductive adhesive layer on the metal layer, the conductive adhesive layer being made from a conductive adhesive layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and a conductive filler; and (d) providing a second protective film on the conductive adhesive layer, and an EMI shielding film manufactured by the method.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: October 20, 2015
    Assignee: Inktec Co., Ltd.
    Inventors: Kwang Choon Chung, Hyun Nam Cho, Myung Bong Yoo, Nam-Boo Cho, Seok Pil Jin, Seong Hoon No
  • Publication number: 20150068787
    Abstract: Provided herein is a conductive pattern making method and conductive pattern, the method including forming a groove such that its width in an inlet area is bigger than its width in an inner area; filling the groove with a conductive ink composition; and drying the conductive ink composition so that a solvent contained in the conductive ink composition inside the groove is volatilized to reduce the volume of the conductive ink composition.
    Type: Application
    Filed: September 8, 2014
    Publication date: March 12, 2015
    Inventors: Kwang-Choon Chung, Ji Hoon Yoo, Joonki Seong, Dae Sang Han, Nam-Boo Cho
  • Publication number: 20140338192
    Abstract: Provided is a method for manufacturing a metal printed circuit board, the method including: printing a circuit pattern on a release film; applying a heat conductive insulating layer on the circuit pattern; laminating a heat conductive base layer on the heat conductive insulating layer and hot pressing the laminated heat conductive base layer and the heat conductive insulating layer; and removing the release film therefrom.
    Type: Application
    Filed: December 24, 2012
    Publication date: November 20, 2014
    Inventors: Kwang-Choon Chung, Nam Boo Cho, Young-Koo Han, Myung Bong Yoo, Woong Ku On
  • Publication number: 20130206315
    Abstract: Provided is a method for manufacturing an electromagnetic interference (EMI) shielding film, including: (a) providing a single insulating layer on a first protective film, the insulating layer being made of an insulating layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and at least one filler selected from a flame-retardant filler and an abrasion-resistant filler; (b) providing a metal layer on the insulating layer; (c) providing a conductive adhesive layer on the metal layer, the conductive adhesive layer being made from a conductive adhesive layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and a conductive filler; and (d) providing a second protective film on the conductive adhesive layer, and an EMI shielding film manufactured by the method.
    Type: Application
    Filed: November 12, 2010
    Publication date: August 15, 2013
    Applicant: INKTEC CO., LTD.
    Inventors: Kwang Choon Chung, Hyun Nam Cho, Myung Bong Yoo, Nam-Boo Cho, Seok Pil Jin, Seong Hoon No
  • Patent number: 8425021
    Abstract: Disclosed is an ink cartridge for a printer, comprising a body having an opened surface and a predetermined shape to receive ink therein; a cover coupled with the body to define a desired space; and a chamber instrument comprising a filling chamber having a space for receiving a part of the ink in the body, a discharging chamber connected with the filling chamber, an ink transferring channel for moving the ink received in the filling chamber to the discharging chamber, an air guiding hold for guiding air to an inside of the cartridge, an air suction valve for selectively passing the guided air and a pressure regulating valve for regulating an internal pressure of the body.
    Type: Grant
    Filed: March 28, 2007
    Date of Patent: April 23, 2013
    Assignee: Inktec Co., Ltd.
    Inventors: Kwang-Choon Chung, Chang Soo Yu, Nam Boo Cho, Young Chul Shin, Baek Song Heo, In-Ha Kim, Jae-Won Choi
  • Publication number: 20130056250
    Abstract: Disclosed is a method for manufacturing a double-sided printed circuit board (PCB) having a circuit pattern by printing a conductive paste. According to the method of the present invention, a circuit pattern that is precise and highly conductive can be formed, and a reduction in raw materials and the simplification of processes are made possible. Also, due to the printing of the conductive paste, short-circuit can be prevented even when a conductive layer is bent or exposed to heat or physical impact.
    Type: Application
    Filed: April 2, 2010
    Publication date: March 7, 2013
    Applicants: HAEUN CHEMTEC CO., LTD., INKTEC CO., LTD.
    Inventors: Kwang Choon Chung, Young-Koo Han, Myung-Bong Yoo, Nam-Boo Cho, Young-Ho Han, Kyong-Min Lee, Kwang-Baek Yoon, Hee-Yong Ahn, Su-Han Kim
  • Patent number: 8282860
    Abstract: The present invention relates to a process for preparation of silver nanoparticles and the compositions of silver ink containing the same. The present invention can prepare the silver nanoparticles with various shapes through a simple preparation process, improve the selectivity of the size of the silver nanoparticles, fire the silver nanoparticles even at a low temperature of 150° C. or less during a short time, provide the ink compositions capable of forming the coating or the fine pattern showing the high conductivity, and provide the ink compositions capable of being applied to the reflective film material, the electromagnetic wave shield, and the antimicrobial agent, etc.
    Type: Grant
    Filed: August 2, 2007
    Date of Patent: October 9, 2012
    Assignee: Inktec Co., Ltd.
    Inventors: Kwang-Choon Chung, Hyun-Nam Cho, Byung Hun Kim, Su Han Kim, Myung Bong Yoo, Nam Boo Cho, Yi Sup Han
  • Patent number: 8128211
    Abstract: The present invention relates to an ink-cartridge for printers comprising a body formed having a filling hole on an upper surface thereof; a plurality of filling chambers inside of the body divided by a partition having a connecting hole; a discharging chamber connected to the filling chamber; an air chamber connected to the filling chamber via an air transferring channel so as to supply air to the filling chamber; an air suction valve installed in the air chamber; an air inducing channel inducing external air to the air suction valve; a blocking film attached to one surface of the body; and a cover installed in the other side surface of the body; and a pressure regulating part formed in a surface of an outer wall of the body and communicating with the filling chamber.
    Type: Grant
    Filed: October 25, 2006
    Date of Patent: March 6, 2012
    Assignee: Inktec Co., Ltd
    Inventors: Kwang-Choon Chung, Chang-Soo Yu, Nam-Boo Cho, Young-Chul Shin, Bae-Song Heo
  • Patent number: 7997708
    Abstract: An ink cartridge for printers and ink filling method that can expand the space where the ink is filled, and maintain pressure inside the ink cartridge. The ink cartridge includes a body formed in a predetermined shape and having a filling hold on one surface, a filling chamber where ink is filled inside the body, a discharging chamber connected to the filling chamber, an ink discharging port connected to the discharging chamber through an ink transferring channel, an air chamber connected to the filling chamber to supply air through an air transferring channel, an air suction valve in the air chamber, an air inducing channel that induces exterior air into the air suction valve, a blocking film attached to one surface of the body, a cover installed on another surface of the body, a pressure regulating part on one surface of outer body, which communicates with the filling chamber.
    Type: Grant
    Filed: March 17, 2007
    Date of Patent: August 16, 2011
    Assignee: Inktec Co., Ltd.
    Inventors: Kwang-Choon Chung, Chang Soo Yu, Nam Boo Cho, Young Chul Shin, Baek Song Heo
  • Patent number: 7955528
    Abstract: The present invention relates to a variety of conductive ink compositions comprising a metal complex compound having a special structure and an additive and a method for preparing the same, more particularly to conductive ink compositions comprising a metal complex compound obtained by reacting a metal or metal compound with an ammonium carbamate- or ammonium carbonate-based compound and an additive and a method for preparing the same.
    Type: Grant
    Filed: March 12, 2010
    Date of Patent: June 7, 2011
    Assignee: Inktec Co., Ltd
    Inventors: Kwang-Choon Chung, Hyun-Nam Cho, Myoung-Seon Gong, Yi-Sup Han, Jeong-Bin Park, Dong-Hun Nam, Seong-Yong Uhm, Young-Kwan Seo, Nam-Boo Cho
  • Publication number: 20100247798
    Abstract: The present invention relates to a variety of conductive ink compositions comprising a metal complex compound having a special structure and an additive and a method for preparing the same, more particularly to conductive ink compositions comprising a metal complex compound obtained by reacting a metal or metal compound with an ammonium carbamate- or ammonium carbonate-based compound and an additive and a method for preparing the same.
    Type: Application
    Filed: March 12, 2010
    Publication date: September 30, 2010
    Applicant: INKTEC CO., LTD.
    Inventors: Kwang-Choon Chung, Hyun-Nam Cho, Myoung-Seon Gong, Yi-Sup Han, Jeong-Bin Park, Dong-Hun Nam, Seong-Yong Uhm, Young-Kwan Seo, Nam-Boo Cho
  • Publication number: 20100189901
    Abstract: The present invention relates to a process for preparation of silver complex compound and the compositions of silver ink containing the same. The present invention includes a) preparing silver complex compound with special structure by reacting silver compound with at least one or two mixtures selected from ammonium carbamate compound, ammonium carbonate compound or ammonium bicarbonate compound and b) preparing silver nano particles by reacting the silver complex compound with reducer or reducing or pyrolyzing the silver complex compound by applying heat thereto. The preparing method according to the present invention can prepare the silver nano practical with various shapes through a simple preparation process, improve the selectivity of the size of the silver complex compound, fire the silver complex compound even when it is fired at a low temperature of 150° C.
    Type: Application
    Filed: August 2, 2007
    Publication date: July 29, 2010
    Applicant: INKTEC CO., LTD.
    Inventors: Kwang-Choon Chung, Hyun-Nam Cho, Byung Hun Kim, Su Han Kim, Myung Bong Yoo, Nam Boo Cho, Yi Sup Han
  • Patent number: 7691294
    Abstract: The present invention relates to a variety of conductive ink compositions comprising a metal complex compound having a special structure and an additive and a method for preparing the same, more particularly to conductive ink compositions comprising a metal complex compound obtained by reacting a metal or metal compound with an ammonium carbamate- or ammonium carbonate-based compound and an additive and a method for preparing the same.
    Type: Grant
    Filed: March 4, 2006
    Date of Patent: April 6, 2010
    Assignee: Inktec Co., Ltd.
    Inventors: Kwang-Choon Chung, Hyun-Nam Cho, Myoung-Seon Gong, Yi-Sup Han, Jeong-Bin Park, Dong-Hun Nam, Seong-Yong Uhm, Young-Kwan Seo, Nam-Boo Cho
  • Publication number: 20090073245
    Abstract: The present invention relates to an ink-cartridge for printers comprising a body formed having a filling hole on an upper surface thereof; a plurality of filling chambers inside of the body divided by a partition having a connecting hole; a discharging chamber connected to the filling chamber; an air chamber connected to the filling chamber via an air transferring channel so as to supply air to the filling chamber; an air suction valve installed in the air chamber; an air inducing channel inducing external air to the air suction valve; a blocking film attached to one surface of the body; and a cover installed in the other surface of the body; and a pressure regulating part formed in a surface of an outer wall of the body and communicating with the filling chamber.
    Type: Application
    Filed: October 25, 2006
    Publication date: March 19, 2009
    Applicant: Inktec Co., Ltd.
    Inventors: Kwang-Choon Chung, Chang-Soo Yu, Nam-Boo Cho, Young-Chul Shin, Bae-Song Heo
  • Publication number: 20080284832
    Abstract: Disclosed is an ink cartridge for a printer, comprising a body having an opened surface and a predetermined shape to receive ink therein; a cover coupled with the body to define a desired space; and a chamber instrument comprising a filling chamber having a space for receiving a part of the ink in the body, a discharging chamber connected with the filling chamber, an ink transferring channel for moving the ink received in the filling chamber to the discharging chamber, an air guiding hold for guiding air to an inside of the cartridge, an air suction valve for selectively passing the guided air and a pressure regulating valve for regulating an internal pressure of the body.
    Type: Application
    Filed: March 28, 2007
    Publication date: November 20, 2008
    Applicant: INKTEC CO., LTD.
    Inventors: Kwang-Choon Chung, Chang Soo Yu, Nam Boo Cho, Young Chul Shin, Baek Song Heo, In-Ha Kim, Jae-Won Choi