Patents by Inventor Nam-Boo Cho
Nam-Boo Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10178773Abstract: Provided is a method for manufacturing a metal printed circuit board, the method including: printing a circuit pattern on a release film; applying a heat conductive insulating layer on the circuit pattern; laminating a heat conductive base layer on the heat conductive insulating layer and hot pressing the laminated heat conductive base layer and the heat conductive insulating layer; and removing the release film therefrom.Type: GrantFiled: December 24, 2012Date of Patent: January 8, 2019Assignee: INKTEC CO., LTD.Inventors: Kwang-Choon Chung, Nam Boo Cho, Young-Koo Han, Myung Bong Yoo, Woong Ku On
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Patent number: 9832882Abstract: Provided herein is a conductive pattern making method and conductive pattern, the method including forming a groove such that its width in an inlet area is bigger than its width in an inner area; filling the groove with a conductive ink composition; and drying the conductive ink composition so that a solvent contained in the conductive ink composition inside the groove is volatilized to reduce the volume of the conductive ink composition.Type: GrantFiled: September 8, 2014Date of Patent: November 28, 2017Assignee: INKTEC CO., LTD.Inventors: Kwang-Choon Chung, Ji Hoon Yoo, Joonki Seong, Dae Sang Han, Nam-Boo Cho
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Patent number: 9788418Abstract: Provided herein is a method for manufacturing a conductive transparent substrate, the method including forming a plurality of main electrodes on the substrate such that the main electrodes are distanced from one another; and forming a connecting electrode that electrically connects two or more main electrodes such that the plurality of main electrodes are grouped into a plurality of group electrodes that are electrically disconnected from one another, thereby producing a conductive transparent substrate with excellent transmittance in a process of high yield.Type: GrantFiled: July 7, 2014Date of Patent: October 10, 2017Assignee: INKTEC CO., LTD.Inventors: Kwang-Choon Chung, Ji Hoon Yoo, Joonki Seong, Byung Hun Kim, Nam-Boo Cho, Myung-Bong Yoo
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Publication number: 20160192477Abstract: Provided herein is a method for manufacturing a conductive transparent substrate, the method including forming a plurality of main electrodes on the substrate such that the main electrodes are distanced from one another; and forming a connecting electrode that electrically connects two or more main electrodes such that the plurality of main electrodes are grouped into a plurality of group electrodes that are electrically disconnected from one another, thereby producing a conductive transparent substrate with excellent transmittance in a process of high yield.Type: ApplicationFiled: July 7, 2014Publication date: June 30, 2016Inventors: Kwang-Choon Chung, Ji Hoon Yoo, Joonki Seong, Byung Hun Kim, Nam Boo Cho, Myung-Bong Yoo
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Patent number: 9313900Abstract: Disclosed is a method for manufacturing a double-sided printed circuit board (PCB) having a circuit pattern by printing a conductive paste. According to the method of the present invention, a circuit pattern that is precise and highly conductive can be formed, and a reduction in raw materials and the simplification of processes are made possible. Also, due to the printing of the conductive paste, short-circuit can be prevented even when a conductive layer is bent or exposed to heat or physical impact.Type: GrantFiled: April 2, 2010Date of Patent: April 12, 2016Assignees: Inktec Co., Ltd., Haeun Chemtec Co., Ltd.Inventors: Kwang Choon Chung, Young-Koo Han, Myung-Bong Yoo, Nam-Boo Cho, Young-Ho Han, Kyong-Min Lee, Kwang-Baek Yoon, Hee-Yong Ahn, Su-Han Kim
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Patent number: 9167735Abstract: Provided is a method for manufacturing an electromagnetic interference (EMI) shielding film, including: (a) providing a single insulating layer on a first protective film, the insulating layer being made of an insulating layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and at least one filler selected from a flame-retardant filler and an abrasion-resistant filler; (b) providing a metal layer on the insulating layer; (c) providing a conductive adhesive layer on the metal layer, the conductive adhesive layer being made from a conductive adhesive layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and a conductive filler; and (d) providing a second protective film on the conductive adhesive layer, and an EMI shielding film manufactured by the method.Type: GrantFiled: November 12, 2010Date of Patent: October 20, 2015Assignee: Inktec Co., Ltd.Inventors: Kwang Choon Chung, Hyun Nam Cho, Myung Bong Yoo, Nam-Boo Cho, Seok Pil Jin, Seong Hoon No
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Publication number: 20150068787Abstract: Provided herein is a conductive pattern making method and conductive pattern, the method including forming a groove such that its width in an inlet area is bigger than its width in an inner area; filling the groove with a conductive ink composition; and drying the conductive ink composition so that a solvent contained in the conductive ink composition inside the groove is volatilized to reduce the volume of the conductive ink composition.Type: ApplicationFiled: September 8, 2014Publication date: March 12, 2015Inventors: Kwang-Choon Chung, Ji Hoon Yoo, Joonki Seong, Dae Sang Han, Nam-Boo Cho
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Publication number: 20140338192Abstract: Provided is a method for manufacturing a metal printed circuit board, the method including: printing a circuit pattern on a release film; applying a heat conductive insulating layer on the circuit pattern; laminating a heat conductive base layer on the heat conductive insulating layer and hot pressing the laminated heat conductive base layer and the heat conductive insulating layer; and removing the release film therefrom.Type: ApplicationFiled: December 24, 2012Publication date: November 20, 2014Inventors: Kwang-Choon Chung, Nam Boo Cho, Young-Koo Han, Myung Bong Yoo, Woong Ku On
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Publication number: 20130206315Abstract: Provided is a method for manufacturing an electromagnetic interference (EMI) shielding film, including: (a) providing a single insulating layer on a first protective film, the insulating layer being made of an insulating layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and at least one filler selected from a flame-retardant filler and an abrasion-resistant filler; (b) providing a metal layer on the insulating layer; (c) providing a conductive adhesive layer on the metal layer, the conductive adhesive layer being made from a conductive adhesive layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and a conductive filler; and (d) providing a second protective film on the conductive adhesive layer, and an EMI shielding film manufactured by the method.Type: ApplicationFiled: November 12, 2010Publication date: August 15, 2013Applicant: INKTEC CO., LTD.Inventors: Kwang Choon Chung, Hyun Nam Cho, Myung Bong Yoo, Nam-Boo Cho, Seok Pil Jin, Seong Hoon No
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Patent number: 8425021Abstract: Disclosed is an ink cartridge for a printer, comprising a body having an opened surface and a predetermined shape to receive ink therein; a cover coupled with the body to define a desired space; and a chamber instrument comprising a filling chamber having a space for receiving a part of the ink in the body, a discharging chamber connected with the filling chamber, an ink transferring channel for moving the ink received in the filling chamber to the discharging chamber, an air guiding hold for guiding air to an inside of the cartridge, an air suction valve for selectively passing the guided air and a pressure regulating valve for regulating an internal pressure of the body.Type: GrantFiled: March 28, 2007Date of Patent: April 23, 2013Assignee: Inktec Co., Ltd.Inventors: Kwang-Choon Chung, Chang Soo Yu, Nam Boo Cho, Young Chul Shin, Baek Song Heo, In-Ha Kim, Jae-Won Choi
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Publication number: 20130056250Abstract: Disclosed is a method for manufacturing a double-sided printed circuit board (PCB) having a circuit pattern by printing a conductive paste. According to the method of the present invention, a circuit pattern that is precise and highly conductive can be formed, and a reduction in raw materials and the simplification of processes are made possible. Also, due to the printing of the conductive paste, short-circuit can be prevented even when a conductive layer is bent or exposed to heat or physical impact.Type: ApplicationFiled: April 2, 2010Publication date: March 7, 2013Applicants: HAEUN CHEMTEC CO., LTD., INKTEC CO., LTD.Inventors: Kwang Choon Chung, Young-Koo Han, Myung-Bong Yoo, Nam-Boo Cho, Young-Ho Han, Kyong-Min Lee, Kwang-Baek Yoon, Hee-Yong Ahn, Su-Han Kim
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Patent number: 8282860Abstract: The present invention relates to a process for preparation of silver nanoparticles and the compositions of silver ink containing the same. The present invention can prepare the silver nanoparticles with various shapes through a simple preparation process, improve the selectivity of the size of the silver nanoparticles, fire the silver nanoparticles even at a low temperature of 150° C. or less during a short time, provide the ink compositions capable of forming the coating or the fine pattern showing the high conductivity, and provide the ink compositions capable of being applied to the reflective film material, the electromagnetic wave shield, and the antimicrobial agent, etc.Type: GrantFiled: August 2, 2007Date of Patent: October 9, 2012Assignee: Inktec Co., Ltd.Inventors: Kwang-Choon Chung, Hyun-Nam Cho, Byung Hun Kim, Su Han Kim, Myung Bong Yoo, Nam Boo Cho, Yi Sup Han
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Patent number: 8128211Abstract: The present invention relates to an ink-cartridge for printers comprising a body formed having a filling hole on an upper surface thereof; a plurality of filling chambers inside of the body divided by a partition having a connecting hole; a discharging chamber connected to the filling chamber; an air chamber connected to the filling chamber via an air transferring channel so as to supply air to the filling chamber; an air suction valve installed in the air chamber; an air inducing channel inducing external air to the air suction valve; a blocking film attached to one surface of the body; and a cover installed in the other side surface of the body; and a pressure regulating part formed in a surface of an outer wall of the body and communicating with the filling chamber.Type: GrantFiled: October 25, 2006Date of Patent: March 6, 2012Assignee: Inktec Co., LtdInventors: Kwang-Choon Chung, Chang-Soo Yu, Nam-Boo Cho, Young-Chul Shin, Bae-Song Heo
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Patent number: 7997708Abstract: An ink cartridge for printers and ink filling method that can expand the space where the ink is filled, and maintain pressure inside the ink cartridge. The ink cartridge includes a body formed in a predetermined shape and having a filling hold on one surface, a filling chamber where ink is filled inside the body, a discharging chamber connected to the filling chamber, an ink discharging port connected to the discharging chamber through an ink transferring channel, an air chamber connected to the filling chamber to supply air through an air transferring channel, an air suction valve in the air chamber, an air inducing channel that induces exterior air into the air suction valve, a blocking film attached to one surface of the body, a cover installed on another surface of the body, a pressure regulating part on one surface of outer body, which communicates with the filling chamber.Type: GrantFiled: March 17, 2007Date of Patent: August 16, 2011Assignee: Inktec Co., Ltd.Inventors: Kwang-Choon Chung, Chang Soo Yu, Nam Boo Cho, Young Chul Shin, Baek Song Heo
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Patent number: 7955528Abstract: The present invention relates to a variety of conductive ink compositions comprising a metal complex compound having a special structure and an additive and a method for preparing the same, more particularly to conductive ink compositions comprising a metal complex compound obtained by reacting a metal or metal compound with an ammonium carbamate- or ammonium carbonate-based compound and an additive and a method for preparing the same.Type: GrantFiled: March 12, 2010Date of Patent: June 7, 2011Assignee: Inktec Co., LtdInventors: Kwang-Choon Chung, Hyun-Nam Cho, Myoung-Seon Gong, Yi-Sup Han, Jeong-Bin Park, Dong-Hun Nam, Seong-Yong Uhm, Young-Kwan Seo, Nam-Boo Cho
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Publication number: 20100247798Abstract: The present invention relates to a variety of conductive ink compositions comprising a metal complex compound having a special structure and an additive and a method for preparing the same, more particularly to conductive ink compositions comprising a metal complex compound obtained by reacting a metal or metal compound with an ammonium carbamate- or ammonium carbonate-based compound and an additive and a method for preparing the same.Type: ApplicationFiled: March 12, 2010Publication date: September 30, 2010Applicant: INKTEC CO., LTD.Inventors: Kwang-Choon Chung, Hyun-Nam Cho, Myoung-Seon Gong, Yi-Sup Han, Jeong-Bin Park, Dong-Hun Nam, Seong-Yong Uhm, Young-Kwan Seo, Nam-Boo Cho
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Publication number: 20100189901Abstract: The present invention relates to a process for preparation of silver complex compound and the compositions of silver ink containing the same. The present invention includes a) preparing silver complex compound with special structure by reacting silver compound with at least one or two mixtures selected from ammonium carbamate compound, ammonium carbonate compound or ammonium bicarbonate compound and b) preparing silver nano particles by reacting the silver complex compound with reducer or reducing or pyrolyzing the silver complex compound by applying heat thereto. The preparing method according to the present invention can prepare the silver nano practical with various shapes through a simple preparation process, improve the selectivity of the size of the silver complex compound, fire the silver complex compound even when it is fired at a low temperature of 150° C.Type: ApplicationFiled: August 2, 2007Publication date: July 29, 2010Applicant: INKTEC CO., LTD.Inventors: Kwang-Choon Chung, Hyun-Nam Cho, Byung Hun Kim, Su Han Kim, Myung Bong Yoo, Nam Boo Cho, Yi Sup Han
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Patent number: 7691294Abstract: The present invention relates to a variety of conductive ink compositions comprising a metal complex compound having a special structure and an additive and a method for preparing the same, more particularly to conductive ink compositions comprising a metal complex compound obtained by reacting a metal or metal compound with an ammonium carbamate- or ammonium carbonate-based compound and an additive and a method for preparing the same.Type: GrantFiled: March 4, 2006Date of Patent: April 6, 2010Assignee: Inktec Co., Ltd.Inventors: Kwang-Choon Chung, Hyun-Nam Cho, Myoung-Seon Gong, Yi-Sup Han, Jeong-Bin Park, Dong-Hun Nam, Seong-Yong Uhm, Young-Kwan Seo, Nam-Boo Cho
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Publication number: 20090073245Abstract: The present invention relates to an ink-cartridge for printers comprising a body formed having a filling hole on an upper surface thereof; a plurality of filling chambers inside of the body divided by a partition having a connecting hole; a discharging chamber connected to the filling chamber; an air chamber connected to the filling chamber via an air transferring channel so as to supply air to the filling chamber; an air suction valve installed in the air chamber; an air inducing channel inducing external air to the air suction valve; a blocking film attached to one surface of the body; and a cover installed in the other surface of the body; and a pressure regulating part formed in a surface of an outer wall of the body and communicating with the filling chamber.Type: ApplicationFiled: October 25, 2006Publication date: March 19, 2009Applicant: Inktec Co., Ltd.Inventors: Kwang-Choon Chung, Chang-Soo Yu, Nam-Boo Cho, Young-Chul Shin, Bae-Song Heo
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Publication number: 20080284832Abstract: Disclosed is an ink cartridge for a printer, comprising a body having an opened surface and a predetermined shape to receive ink therein; a cover coupled with the body to define a desired space; and a chamber instrument comprising a filling chamber having a space for receiving a part of the ink in the body, a discharging chamber connected with the filling chamber, an ink transferring channel for moving the ink received in the filling chamber to the discharging chamber, an air guiding hold for guiding air to an inside of the cartridge, an air suction valve for selectively passing the guided air and a pressure regulating valve for regulating an internal pressure of the body.Type: ApplicationFiled: March 28, 2007Publication date: November 20, 2008Applicant: INKTEC CO., LTD.Inventors: Kwang-Choon Chung, Chang Soo Yu, Nam Boo Cho, Young Chul Shin, Baek Song Heo, In-Ha Kim, Jae-Won Choi