Abstract: An electronic device embedded substrate and a method of manufacturing the same are disclosed. The electronic device embedded substrate includes a core substrate comprising a polyimide resin layer disposed on one side of a cavity of the core substrate, an electronic device embedded in the cavity, and an insulation layer disposed on both surfaces of the core substrate so as to cover the core substrate and the electronic device.

Abstract: A method of fabricating a package substrate includes: preparing a base substrate; forming a metal material layer surrounding an entire surface of the base substrate; forming sacrificial patterns on partial regions of the base substrate on which the metal material layer is formed; forming pads contacting lateral surfaces of the sacrificial patterns; forming a gold plating layer on upper surfaces of the pads; and removing the sacrificial patterns and removing portions of the metal material layer to form a conductive layer that remains on partial regions so as to contact lower surfaces of the pads.