Patents by Inventor Nam Gyol Kim

Nam Gyol Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080206567
    Abstract: Plastic conductive particles having an outer diameter of 2.5 ?m˜1 mm obtained by sequentially plating a 0.1˜10 ?m thick metal plating layer and a 1˜100 ?m thick Pb solder layer or a Pb-free solder layer on plastic core beads having a high elastic modulus of compression, and a method of manufacturing thereof.
    Type: Application
    Filed: December 28, 2005
    Publication date: August 28, 2008
    Applicant: Dongbu Hitek Co., Ltd.
    Inventors: Byung Hoon Min, Kyung Heum Kim, Seung Bum Kim, Sung Soo Lee, Kyoung Bae Park, Nam Gyol Kim, Byoung Jae Yoo