Patents by Inventor Nam-Heung Kim
Nam-Heung Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11894614Abstract: An antenna apparatus includes: a ground plane including first sides parallel to a first direction and second sides parallel to a second direction, on a plane formed in the first and second directions; a dielectric layer disposed on the ground plane in a third direction; an antenna patch overlapping the ground plane in the third direction; and vias connected to the ground plane and passing through at least a portion of the dielectric layer. Edges of the vias at least partially overlap the first sides of the ground plane in the third direction.Type: GrantFiled: April 15, 2021Date of Patent: February 6, 2024Assignees: Samsung Electro-Mechanics Co., Ltd., Research & Business Foundation SUNGKYUNKWAN UNIVERSITYInventors: Won Wook So, Jeongki Ryoo, Woncheol Lee, Youngsik Hur, Keum Cheol Hwang, Nam Heung Kim, Yong-serk Kim
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Patent number: 11641065Abstract: An antenna device is provided. The antenna device includes a first antenna patch configured to transmit and receive an RF signal in a first frequency bandwidth and disposed a first dielectric layer; a second antenna patch disposed on a second dielectric layer and coupled to the first antenna patch; a third antenna patch disposed on a third dielectric layer and coupled to the second antenna patch; and a fourth antenna patch configured to transmit and receive an RF signal in the second frequency bandwidth, wherein the second antenna patch includes a plurality of first sub-antenna patches that do not overlap the first antenna patch, and the third antenna patch includes a plurality of second sub-antenna patches that overlap the first sub-antenna patches.Type: GrantFiled: June 29, 2021Date of Patent: May 2, 2023Assignees: Samsung Electro-Mechanics Co., Ltd., Research & Business Foundation SUNGKYUNKWAN UNIVERSITYInventors: Won Wook So, Jeongki Ryoo, Woncheol Lee, Youngsik Hur, Keum Cheol Hwang, Nam Heung Kim, Yong-Serk Kim
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Publication number: 20220166149Abstract: An antenna device is provided. The antenna device includes a first antenna patch configured to transmit and receive an RF signal in a first frequency bandwidth and disposed a first dielectric layer; a second antenna patch disposed on a second dielectric layer and coupled to the first antenna patch; a third antenna patch disposed on a third dielectric layer and coupled to the second antenna patch; and a fourth antenna patch configured to transmit and receive an RF signal in the second frequency bandwidth, wherein the second antenna patch includes a plurality of first sub-antenna patches that do not overlap the first antenna patch, and the third antenna patch includes a plurality of second sub-antenna patches that overlap the first sub-antenna patches.Type: ApplicationFiled: June 29, 2021Publication date: May 26, 2022Applicants: SAMSUNG ELECTRO-MECHANICS CO., LTD., Research & Business Foundation SUNGKYUNKWAN UNIVERSITYInventors: Won Wook SO, Jeongki RYOO, Woncheol LEE, Youngsik HUR, Keum Cheol HWANG, Nam Heung KIM, Yong-serk KIM
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Publication number: 20220123479Abstract: An antenna apparatus includes: a ground plane including first sides parallel to a first direction and second sides parallel to a second direction, on a plane formed in the first and second directions; a dielectric layer disposed on the ground plane in a third direction; an antenna patch overlapping the ground plane in the third direction; and vias connected to the ground plane and passing through at least a portion of the dielectric layer. Edges of the vias at least partially overlap the first sides of the ground plane in the third direction.Type: ApplicationFiled: April 15, 2021Publication date: April 21, 2022Applicants: SAMSUNG ELECTRO-MECHANICS CO., LTD., Research & Business Foundation SUNGKYUNKWAN UNIVERSITYInventors: Won Wook SO, Jeongki RYOO, Woncheol LEE, Youngsik HUR, Keum Cheol HWANG, Nam Heung KIM, Yong-serk KIM
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Patent number: 11283175Abstract: An antenna apparatus includes a ground plane; first and second patch antenna patterns disposed above and spaced apart from a first surface of the ground plane and from each other; a second feed via to provide a second feed path of the second patch antenna pattern, and disposed adjacent to an edge of the second patch antenna pattern; a first feed via to provide a first feed path of the first patch antenna pattern, and disposed adjacent to an edge of the first patch antenna pattern that is opposite to the second patch antenna pattern; a first coupling pattern disposed between the first patch antenna pattern and the second patch antenna pattern along the first direction; a ground via; and a second coupling pattern disposed between the second patch antenna pattern and the first coupling pattern along the first direction.Type: GrantFiled: March 18, 2020Date of Patent: March 22, 2022Assignees: Samsung Electro-Mechanics Co., Ltd., Research & Business Foundation Sungkyunkwan UniversityInventors: Myeong Woo Han, Nam Ki Kim, Young Sik Hur, Yong Serk Kim, Keum Cheol Hwang, Nam Heung Kim, Jeong Ki Ryoo
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Patent number: 11121477Abstract: An antenna apparatus includes a ground plane; first and second patch antenna patterns disposed above and spaced apart from the ground plane, and spaced apart from each other; a first feed via providing a first feed path of the first patch antenna pattern through a first point disposed adjacent to an edge of the first patch antenna pattern in a direction spaced apart from the second patch antenna pattern; a second feed via providing a second feed path of the second patch antenna pattern through a second point disposed adjacent to an edge of the second patch antenna pattern in a direction spaced apart from the first patch antenna pattern; and a first coupling pattern spaced apart from the first and second patch antenna patterns between the first and second patch antenna patterns, and defining a first internal space exposed towards the first patch antenna pattern.Type: GrantFiled: February 26, 2020Date of Patent: September 14, 2021Assignees: SAMSUNG ELECTRO-MECHANICS CO., LTD., RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITYInventors: Myeong Woo Han, Dae Ki Lim, Yong Serk Kim, Keum Cheol Hwang, Nam Heung Kim, Won Cheol Lee, Young Sik Hur
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Publication number: 20210151889Abstract: An antenna apparatus includes a ground plane; first and second patch antenna patterns disposed above and spaced apart from a first surface of the ground plane and from each other; a second feed via to provide a second feed path of the second patch antenna pattern, and disposed adjacent to an edge of the second patch antenna pattern; a first feed via to provide a first feed path of the first patch antenna pattern, and disposed adjacent to an edge of the first patch antenna pattern that is opposite to the second patch antenna pattern; a first coupling pattern disposed between the first patch antenna pattern and the second patch antenna pattern along the first direction; a ground via; and a second coupling pattern disposed between the second patch antenna pattern and the first coupling pattern along the first direction.Type: ApplicationFiled: March 18, 2020Publication date: May 20, 2021Applicants: SAMSUNG ELECTRO-MECHANICS CO., LTD., Research & Business Foundation Sungkyunkwan UniversityInventors: Myeong Woo HAN, Nam Ki KIM, Young Sik HUR, Yong Serk KIM, Keum Cheol HWANG, Nam Heung KIM, Jeong Ki RYOO
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Publication number: 20210151898Abstract: An antenna apparatus includes a ground plane; first and second patch antenna patterns disposed above and spaced apart from the ground plane, and spaced apart from each other; a first feed via providing a first feed path of the first patch antenna pattern through a first point disposed adjacent to an edge of the first patch antenna pattern in a direction spaced apart from the second patch antenna pattern; a second feed via providing a second feed path of the second patch antenna pattern through a second point disposed adjacent to an edge of the second patch antenna pattern in a direction spaced apart from the first patch antenna pattern; and a first coupling pattern spaced apart from the first and second patch antenna patterns between the first and second patch antenna patterns, and defining a first internal space exposed towards the first patch antenna pattern.Type: ApplicationFiled: February 26, 2020Publication date: May 20, 2021Applicants: Samsung Electro-Mechanics Co., Ltd., Research & Business Foundation Sungkyunkwan UniversityInventors: Myeong Woo HAN, Dae Ki LIM, Yong Serk KIM, Keum Cheol HWANG, Nam Heung KIM, Won Cheol LEE, Young Sik HUR
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Patent number: 9899968Abstract: A low noise amplifier circuit includes a first amplifier including a first transistor and a second transistor that are cascode-connected to each other; a second amplifier including a third transistor and a fourth transistor that are cascode-connected to each other; a source terminal matcher connected to a source of the first transistor and a source of the third transistor; and an input matcher providing input that is impedance-matched by a first inductor and a second inductor to a gate of the first transistor and providing input which is impedance-matched by the first inductor to a gate of the third transistor. The circuit is able to operate in a dual-band and provide impedance matching, while being simpler than alternative circuits.Type: GrantFiled: December 21, 2015Date of Patent: February 20, 2018Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Nack Gyun Seong, Sung Hwan Park, Sang Hoon Ha, Sang Hee Kim, Nam Heung Kim, Sang Wook Park
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Patent number: 9479133Abstract: The present invention relates to a power detection circuit and an RF signal amplification circuit having the same. According to an embodiment of the present invention, a power detection circuit including a coupling unit adjacent to an RF matching inductor to extract induced power; a rectification unit for rectifying the signal output from the coupling unit to output the rectified signal; a slope adjustment unit connected between an output terminal of the rectification unit and a ground and adjusting a voltage slope for power detection by changing the output signal of the output terminal of the rectification unit according to changes in internal impedance; and a smoothing unit for receiving the output signal of the output terminal of the rectification unit to smooth the received signal into a DC voltage for power detection using the voltage slope is provided. Further, an RF signal amplification circuit having the same is provided.Type: GrantFiled: August 5, 2014Date of Patent: October 25, 2016Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ki Joong Kim, Nam Heung Kim, Young Jean Song, Myeong Woo Han, Jun Goo Won, Iizuka Shinichi, Youn Suk Kim
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Publication number: 20160268980Abstract: A low noise amplifier circuit includes a first amplifier including a first transistor and a second transistor that are cascode-connected to each other; a second amplifier including a third transistor and a fourth transistor that are cascode-connected to each other; a source terminal matcher connected to a source of the first transistor and a source of the third transistor; and an input matcher providing input that is impedance-matched by a first inductor and a second inductor to a gate of the first transistor and providing input which is impedance-matched by the first inductor to a gate of the third transistor. The circuit is able to operate in a dual-band and provide impedance matching, while being simpler than alternative circuits.Type: ApplicationFiled: December 21, 2015Publication date: September 15, 2016Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Nack Gyun SEONG, Sung Hwan PARK, Sang Hoon HA, Sang Hee KIM, Nam Heung KIM, Sang Wook PARK
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Patent number: 9184505Abstract: There is provided a dielectric cavity antenna including: a multilayer substrate having an opening formed in at least a portion of a predetermined surface thereof; a dielectric cavity inserted into the multilayer substrate to radiate an electromagnetic wave signal through the opening; a feed line feeding power to the dielectric cavity; and at least one metal pattern formed in an inner portion of the dielectric cavity or on a surface thereof to thereby be electromagnetically coupled to the feed line.Type: GrantFiled: January 31, 2012Date of Patent: November 10, 2015Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Myeong Woo Han, Jung Aun Lee, Nam Heung Kim
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Patent number: 9136991Abstract: There are provided a power amplifying circuit and a front end module including the same. The power amplifying circuit includes a signal amplifying unit amplifying and outputting a plurality of wireless signals having different frequency bands, and a diplexer circuit transferring at least one of the plurality of wireless signals output from the signal amplifying unit to an antenna, wherein the signal amplifying unit and the diplexer circuit include impedance matching circuits having different impedance matching ranges, respectively, and the impedance matching range of the diplexer circuit is continuous with that of the signal amplifying unit.Type: GrantFiled: February 26, 2013Date of Patent: September 15, 2015Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ki Joong Kim, Nam Heung Kim, Young Jean Song, Myeong Woo Han, Jun Goo Won, Shinichi Iizuka, Youn Suk Kim
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Patent number: 9048542Abstract: Disclosed herein are a side-face radiation antenna and a wireless communication module. According to an embodiment of the present invention, there is provided the side-face radiation antenna including a via patch part formed at a side portion of a module substrate including laminated substrates to perform a side-face radiation, and formed by metal filled in a plurality of vias arranged at a predetermined interval in the side portion and connected, and a feed line part inserted between intermediate layers of the module substrate, and connected to the via at a center portion of the via patch part. In addition, there is provided the wireless communication module including the side-face radiation antenna.Type: GrantFiled: December 28, 2012Date of Patent: June 2, 2015Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Myeong Woo Han, Jung Aun Lee, Nam Heung Kim
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Patent number: 8970279Abstract: There is provided a radio frequency switch circuit including a first switch circuit unit connected between a first node connected to a first signal port and a common node connected to a common port, and operated according to a first control signal, a second switch circuit unit connected between a second node connected to a second signal port and the common node and operated according to a second control signal having a phase opposite to that of the first control signal, a first shunt circuit unit connected between the second node and a common source node and operated according to the first control signal, a second shunt circuit unit connected between the first node and the common source node, and a source voltage generating unit generating a source voltage, wherein the source voltage is lower than a high level of the first control signal and higher than a ground potential.Type: GrantFiled: February 27, 2013Date of Patent: March 3, 2015Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Sang Hoon Ha, Sung Hwan Park, Sang Hee Kim, Nam Heung Kim, Hyo Gun Bae
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Publication number: 20150042405Abstract: The present invention relates to a power detection circuit and an RF signal amplification circuit having the same. According to an embodiment of the present invention, a power detection circuit including a coupling unit adjacent to an RF matching inductor to extract induced power; a rectification unit for rectifying the signal output from the coupling unit to output the rectified signal; a slope adjustment unit connected between an output terminal of the rectification unit and a ground and adjusting a voltage slope for power detection by changing the output signal of the output terminal of the rectification unit according to changes in internal impedance; and a smoothing unit for receiving the output signal of the output terminal of the rectification unit to smooth the received signal into a DC voltage for power detection using the voltage slope is provided. Further, an RF signal amplification circuit having the same is provided.Type: ApplicationFiled: August 5, 2014Publication date: February 12, 2015Inventors: Ki Joong KIM, Nam Heung KIM, Young Jean SONG, Myeong Woo HAN, Jun Goo WON, Iizuka SHINICHI, Youn Suk KIM
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Patent number: 8830000Abstract: Provided is a multi-band amplifier and a method of amplifying a multi-band. The multi-band amplifier includes a wireless signal input terminal into which a first frequency band signal and a second frequency band signal are input, a first impedance matching part connected to the wireless signal input terminal and configured to match an input impedance in a first frequency band, a second impedance matching part connected to the wireless signal input terminal and configured to match an input impedance in a second frequency band, a common source amplifier to which the first impedance matching part and the second impedance matching part, and a common gate amplifier connected to the common source amplifier. Accordingly, performance degradation can be reduced in comparison with a conventional amplifier, broadband amplification as well as narrow band amplification can be performed, and an amplification gain can be adjusted.Type: GrantFiled: August 29, 2012Date of Patent: September 9, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Moon Suk Jeong, Nam Heung Kim, Hyun Paek, Su Kyong Kim, Shin Hwan Hwang, Yoo Sam Na
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Publication number: 20140176225Abstract: There is provided a radio frequency switch circuit including a first switch circuit unit connected between a first node connected to a first signal port and a common node connected to a common port, and operated according to a first control signal, a second switch circuit unit connected between a second node connected to a second signal port and the common node and operated according to a second control signal having a phase opposite to that of the first control signal, a first shunt circuit unit connected between the second node and a common source node and operated according to the first control signal, a second shunt circuit unit connected between the first node and the common source node, and a source voltage generating unit generating a source voltage, wherein the source voltage is lower than a high level of the first control signal and higher than a ground potential.Type: ApplicationFiled: February 27, 2013Publication date: June 26, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Hoon HA, Sung Hwan PARK, Sang Hee KIM, Nam Heung KIM, Hyo Gun BAE
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Publication number: 20140177493Abstract: There are provided a power amplifying circuit and a front end module including the same. The power amplifying circuit includes a signal amplifying unit amplifying and outputting a plurality of wireless signals having different frequency bands, and a diplexer circuit transferring at least one of the plurality of wireless signals output from the signal amplifying unit to an antenna, wherein the signal amplifying unit and the diplexer circuit include impedance matching circuits having different impedance matching ranges, respectively, and the impedance matching range of the diplexer circuit is continuous with that of the signal amplifying unit.Type: ApplicationFiled: February 26, 2013Publication date: June 26, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ki Joong KIM, Nam Heung KIM, Young Jean SONG, Myeong Woo HAN, Jun Goo WON, Shinichi IIZUKA, Youn Suk KIM
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Publication number: 20130127669Abstract: There is provided a dielectric cavity antenna including: a multilayer substrate having an opening formed in at least a portion of a predetermined surface thereof; a dielectric cavity inserted into the multilayer substrate to radiate an electromagnetic wave signal through the opening; a feed line feeding power to the dielectric cavity; and at least one metal pattern formed in an inner portion of the dielectric cavity or on a surface thereof to thereby be electromagnetically coupled to the feed line.Type: ApplicationFiled: January 31, 2012Publication date: May 23, 2013Inventors: Myeong Woo Han, Jung Aun Lee, Nam Heung Kim