Patents by Inventor Nam-Heung Kim

Nam-Heung Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11894614
    Abstract: An antenna apparatus includes: a ground plane including first sides parallel to a first direction and second sides parallel to a second direction, on a plane formed in the first and second directions; a dielectric layer disposed on the ground plane in a third direction; an antenna patch overlapping the ground plane in the third direction; and vias connected to the ground plane and passing through at least a portion of the dielectric layer. Edges of the vias at least partially overlap the first sides of the ground plane in the third direction.
    Type: Grant
    Filed: April 15, 2021
    Date of Patent: February 6, 2024
    Assignees: Samsung Electro-Mechanics Co., Ltd., Research & Business Foundation SUNGKYUNKWAN UNIVERSITY
    Inventors: Won Wook So, Jeongki Ryoo, Woncheol Lee, Youngsik Hur, Keum Cheol Hwang, Nam Heung Kim, Yong-serk Kim
  • Patent number: 11641065
    Abstract: An antenna device is provided. The antenna device includes a first antenna patch configured to transmit and receive an RF signal in a first frequency bandwidth and disposed a first dielectric layer; a second antenna patch disposed on a second dielectric layer and coupled to the first antenna patch; a third antenna patch disposed on a third dielectric layer and coupled to the second antenna patch; and a fourth antenna patch configured to transmit and receive an RF signal in the second frequency bandwidth, wherein the second antenna patch includes a plurality of first sub-antenna patches that do not overlap the first antenna patch, and the third antenna patch includes a plurality of second sub-antenna patches that overlap the first sub-antenna patches.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: May 2, 2023
    Assignees: Samsung Electro-Mechanics Co., Ltd., Research & Business Foundation SUNGKYUNKWAN UNIVERSITY
    Inventors: Won Wook So, Jeongki Ryoo, Woncheol Lee, Youngsik Hur, Keum Cheol Hwang, Nam Heung Kim, Yong-Serk Kim
  • Publication number: 20220166149
    Abstract: An antenna device is provided. The antenna device includes a first antenna patch configured to transmit and receive an RF signal in a first frequency bandwidth and disposed a first dielectric layer; a second antenna patch disposed on a second dielectric layer and coupled to the first antenna patch; a third antenna patch disposed on a third dielectric layer and coupled to the second antenna patch; and a fourth antenna patch configured to transmit and receive an RF signal in the second frequency bandwidth, wherein the second antenna patch includes a plurality of first sub-antenna patches that do not overlap the first antenna patch, and the third antenna patch includes a plurality of second sub-antenna patches that overlap the first sub-antenna patches.
    Type: Application
    Filed: June 29, 2021
    Publication date: May 26, 2022
    Applicants: SAMSUNG ELECTRO-MECHANICS CO., LTD., Research & Business Foundation SUNGKYUNKWAN UNIVERSITY
    Inventors: Won Wook SO, Jeongki RYOO, Woncheol LEE, Youngsik HUR, Keum Cheol HWANG, Nam Heung KIM, Yong-serk KIM
  • Publication number: 20220123479
    Abstract: An antenna apparatus includes: a ground plane including first sides parallel to a first direction and second sides parallel to a second direction, on a plane formed in the first and second directions; a dielectric layer disposed on the ground plane in a third direction; an antenna patch overlapping the ground plane in the third direction; and vias connected to the ground plane and passing through at least a portion of the dielectric layer. Edges of the vias at least partially overlap the first sides of the ground plane in the third direction.
    Type: Application
    Filed: April 15, 2021
    Publication date: April 21, 2022
    Applicants: SAMSUNG ELECTRO-MECHANICS CO., LTD., Research & Business Foundation SUNGKYUNKWAN UNIVERSITY
    Inventors: Won Wook SO, Jeongki RYOO, Woncheol LEE, Youngsik HUR, Keum Cheol HWANG, Nam Heung KIM, Yong-serk KIM
  • Patent number: 11283175
    Abstract: An antenna apparatus includes a ground plane; first and second patch antenna patterns disposed above and spaced apart from a first surface of the ground plane and from each other; a second feed via to provide a second feed path of the second patch antenna pattern, and disposed adjacent to an edge of the second patch antenna pattern; a first feed via to provide a first feed path of the first patch antenna pattern, and disposed adjacent to an edge of the first patch antenna pattern that is opposite to the second patch antenna pattern; a first coupling pattern disposed between the first patch antenna pattern and the second patch antenna pattern along the first direction; a ground via; and a second coupling pattern disposed between the second patch antenna pattern and the first coupling pattern along the first direction.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: March 22, 2022
    Assignees: Samsung Electro-Mechanics Co., Ltd., Research & Business Foundation Sungkyunkwan University
    Inventors: Myeong Woo Han, Nam Ki Kim, Young Sik Hur, Yong Serk Kim, Keum Cheol Hwang, Nam Heung Kim, Jeong Ki Ryoo
  • Patent number: 11121477
    Abstract: An antenna apparatus includes a ground plane; first and second patch antenna patterns disposed above and spaced apart from the ground plane, and spaced apart from each other; a first feed via providing a first feed path of the first patch antenna pattern through a first point disposed adjacent to an edge of the first patch antenna pattern in a direction spaced apart from the second patch antenna pattern; a second feed via providing a second feed path of the second patch antenna pattern through a second point disposed adjacent to an edge of the second patch antenna pattern in a direction spaced apart from the first patch antenna pattern; and a first coupling pattern spaced apart from the first and second patch antenna patterns between the first and second patch antenna patterns, and defining a first internal space exposed towards the first patch antenna pattern.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: September 14, 2021
    Assignees: SAMSUNG ELECTRO-MECHANICS CO., LTD., RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Myeong Woo Han, Dae Ki Lim, Yong Serk Kim, Keum Cheol Hwang, Nam Heung Kim, Won Cheol Lee, Young Sik Hur
  • Publication number: 20210151889
    Abstract: An antenna apparatus includes a ground plane; first and second patch antenna patterns disposed above and spaced apart from a first surface of the ground plane and from each other; a second feed via to provide a second feed path of the second patch antenna pattern, and disposed adjacent to an edge of the second patch antenna pattern; a first feed via to provide a first feed path of the first patch antenna pattern, and disposed adjacent to an edge of the first patch antenna pattern that is opposite to the second patch antenna pattern; a first coupling pattern disposed between the first patch antenna pattern and the second patch antenna pattern along the first direction; a ground via; and a second coupling pattern disposed between the second patch antenna pattern and the first coupling pattern along the first direction.
    Type: Application
    Filed: March 18, 2020
    Publication date: May 20, 2021
    Applicants: SAMSUNG ELECTRO-MECHANICS CO., LTD., Research & Business Foundation Sungkyunkwan University
    Inventors: Myeong Woo HAN, Nam Ki KIM, Young Sik HUR, Yong Serk KIM, Keum Cheol HWANG, Nam Heung KIM, Jeong Ki RYOO
  • Publication number: 20210151898
    Abstract: An antenna apparatus includes a ground plane; first and second patch antenna patterns disposed above and spaced apart from the ground plane, and spaced apart from each other; a first feed via providing a first feed path of the first patch antenna pattern through a first point disposed adjacent to an edge of the first patch antenna pattern in a direction spaced apart from the second patch antenna pattern; a second feed via providing a second feed path of the second patch antenna pattern through a second point disposed adjacent to an edge of the second patch antenna pattern in a direction spaced apart from the first patch antenna pattern; and a first coupling pattern spaced apart from the first and second patch antenna patterns between the first and second patch antenna patterns, and defining a first internal space exposed towards the first patch antenna pattern.
    Type: Application
    Filed: February 26, 2020
    Publication date: May 20, 2021
    Applicants: Samsung Electro-Mechanics Co., Ltd., Research & Business Foundation Sungkyunkwan University
    Inventors: Myeong Woo HAN, Dae Ki LIM, Yong Serk KIM, Keum Cheol HWANG, Nam Heung KIM, Won Cheol LEE, Young Sik HUR
  • Patent number: 9899968
    Abstract: A low noise amplifier circuit includes a first amplifier including a first transistor and a second transistor that are cascode-connected to each other; a second amplifier including a third transistor and a fourth transistor that are cascode-connected to each other; a source terminal matcher connected to a source of the first transistor and a source of the third transistor; and an input matcher providing input that is impedance-matched by a first inductor and a second inductor to a gate of the first transistor and providing input which is impedance-matched by the first inductor to a gate of the third transistor. The circuit is able to operate in a dual-band and provide impedance matching, while being simpler than alternative circuits.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: February 20, 2018
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Nack Gyun Seong, Sung Hwan Park, Sang Hoon Ha, Sang Hee Kim, Nam Heung Kim, Sang Wook Park
  • Patent number: 9479133
    Abstract: The present invention relates to a power detection circuit and an RF signal amplification circuit having the same. According to an embodiment of the present invention, a power detection circuit including a coupling unit adjacent to an RF matching inductor to extract induced power; a rectification unit for rectifying the signal output from the coupling unit to output the rectified signal; a slope adjustment unit connected between an output terminal of the rectification unit and a ground and adjusting a voltage slope for power detection by changing the output signal of the output terminal of the rectification unit according to changes in internal impedance; and a smoothing unit for receiving the output signal of the output terminal of the rectification unit to smooth the received signal into a DC voltage for power detection using the voltage slope is provided. Further, an RF signal amplification circuit having the same is provided.
    Type: Grant
    Filed: August 5, 2014
    Date of Patent: October 25, 2016
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ki Joong Kim, Nam Heung Kim, Young Jean Song, Myeong Woo Han, Jun Goo Won, Iizuka Shinichi, Youn Suk Kim
  • Publication number: 20160268980
    Abstract: A low noise amplifier circuit includes a first amplifier including a first transistor and a second transistor that are cascode-connected to each other; a second amplifier including a third transistor and a fourth transistor that are cascode-connected to each other; a source terminal matcher connected to a source of the first transistor and a source of the third transistor; and an input matcher providing input that is impedance-matched by a first inductor and a second inductor to a gate of the first transistor and providing input which is impedance-matched by the first inductor to a gate of the third transistor. The circuit is able to operate in a dual-band and provide impedance matching, while being simpler than alternative circuits.
    Type: Application
    Filed: December 21, 2015
    Publication date: September 15, 2016
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Nack Gyun SEONG, Sung Hwan PARK, Sang Hoon HA, Sang Hee KIM, Nam Heung KIM, Sang Wook PARK
  • Patent number: 9184505
    Abstract: There is provided a dielectric cavity antenna including: a multilayer substrate having an opening formed in at least a portion of a predetermined surface thereof; a dielectric cavity inserted into the multilayer substrate to radiate an electromagnetic wave signal through the opening; a feed line feeding power to the dielectric cavity; and at least one metal pattern formed in an inner portion of the dielectric cavity or on a surface thereof to thereby be electromagnetically coupled to the feed line.
    Type: Grant
    Filed: January 31, 2012
    Date of Patent: November 10, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Myeong Woo Han, Jung Aun Lee, Nam Heung Kim
  • Patent number: 9136991
    Abstract: There are provided a power amplifying circuit and a front end module including the same. The power amplifying circuit includes a signal amplifying unit amplifying and outputting a plurality of wireless signals having different frequency bands, and a diplexer circuit transferring at least one of the plurality of wireless signals output from the signal amplifying unit to an antenna, wherein the signal amplifying unit and the diplexer circuit include impedance matching circuits having different impedance matching ranges, respectively, and the impedance matching range of the diplexer circuit is continuous with that of the signal amplifying unit.
    Type: Grant
    Filed: February 26, 2013
    Date of Patent: September 15, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ki Joong Kim, Nam Heung Kim, Young Jean Song, Myeong Woo Han, Jun Goo Won, Shinichi Iizuka, Youn Suk Kim
  • Patent number: 9048542
    Abstract: Disclosed herein are a side-face radiation antenna and a wireless communication module. According to an embodiment of the present invention, there is provided the side-face radiation antenna including a via patch part formed at a side portion of a module substrate including laminated substrates to perform a side-face radiation, and formed by metal filled in a plurality of vias arranged at a predetermined interval in the side portion and connected, and a feed line part inserted between intermediate layers of the module substrate, and connected to the via at a center portion of the via patch part. In addition, there is provided the wireless communication module including the side-face radiation antenna.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: June 2, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Myeong Woo Han, Jung Aun Lee, Nam Heung Kim
  • Patent number: 8970279
    Abstract: There is provided a radio frequency switch circuit including a first switch circuit unit connected between a first node connected to a first signal port and a common node connected to a common port, and operated according to a first control signal, a second switch circuit unit connected between a second node connected to a second signal port and the common node and operated according to a second control signal having a phase opposite to that of the first control signal, a first shunt circuit unit connected between the second node and a common source node and operated according to the first control signal, a second shunt circuit unit connected between the first node and the common source node, and a source voltage generating unit generating a source voltage, wherein the source voltage is lower than a high level of the first control signal and higher than a ground potential.
    Type: Grant
    Filed: February 27, 2013
    Date of Patent: March 3, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Hoon Ha, Sung Hwan Park, Sang Hee Kim, Nam Heung Kim, Hyo Gun Bae
  • Publication number: 20150042405
    Abstract: The present invention relates to a power detection circuit and an RF signal amplification circuit having the same. According to an embodiment of the present invention, a power detection circuit including a coupling unit adjacent to an RF matching inductor to extract induced power; a rectification unit for rectifying the signal output from the coupling unit to output the rectified signal; a slope adjustment unit connected between an output terminal of the rectification unit and a ground and adjusting a voltage slope for power detection by changing the output signal of the output terminal of the rectification unit according to changes in internal impedance; and a smoothing unit for receiving the output signal of the output terminal of the rectification unit to smooth the received signal into a DC voltage for power detection using the voltage slope is provided. Further, an RF signal amplification circuit having the same is provided.
    Type: Application
    Filed: August 5, 2014
    Publication date: February 12, 2015
    Inventors: Ki Joong KIM, Nam Heung KIM, Young Jean SONG, Myeong Woo HAN, Jun Goo WON, Iizuka SHINICHI, Youn Suk KIM
  • Patent number: 8830000
    Abstract: Provided is a multi-band amplifier and a method of amplifying a multi-band. The multi-band amplifier includes a wireless signal input terminal into which a first frequency band signal and a second frequency band signal are input, a first impedance matching part connected to the wireless signal input terminal and configured to match an input impedance in a first frequency band, a second impedance matching part connected to the wireless signal input terminal and configured to match an input impedance in a second frequency band, a common source amplifier to which the first impedance matching part and the second impedance matching part, and a common gate amplifier connected to the common source amplifier. Accordingly, performance degradation can be reduced in comparison with a conventional amplifier, broadband amplification as well as narrow band amplification can be performed, and an amplification gain can be adjusted.
    Type: Grant
    Filed: August 29, 2012
    Date of Patent: September 9, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Moon Suk Jeong, Nam Heung Kim, Hyun Paek, Su Kyong Kim, Shin Hwan Hwang, Yoo Sam Na
  • Publication number: 20140176225
    Abstract: There is provided a radio frequency switch circuit including a first switch circuit unit connected between a first node connected to a first signal port and a common node connected to a common port, and operated according to a first control signal, a second switch circuit unit connected between a second node connected to a second signal port and the common node and operated according to a second control signal having a phase opposite to that of the first control signal, a first shunt circuit unit connected between the second node and a common source node and operated according to the first control signal, a second shunt circuit unit connected between the first node and the common source node, and a source voltage generating unit generating a source voltage, wherein the source voltage is lower than a high level of the first control signal and higher than a ground potential.
    Type: Application
    Filed: February 27, 2013
    Publication date: June 26, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Hoon HA, Sung Hwan PARK, Sang Hee KIM, Nam Heung KIM, Hyo Gun BAE
  • Publication number: 20140177493
    Abstract: There are provided a power amplifying circuit and a front end module including the same. The power amplifying circuit includes a signal amplifying unit amplifying and outputting a plurality of wireless signals having different frequency bands, and a diplexer circuit transferring at least one of the plurality of wireless signals output from the signal amplifying unit to an antenna, wherein the signal amplifying unit and the diplexer circuit include impedance matching circuits having different impedance matching ranges, respectively, and the impedance matching range of the diplexer circuit is continuous with that of the signal amplifying unit.
    Type: Application
    Filed: February 26, 2013
    Publication date: June 26, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ki Joong KIM, Nam Heung KIM, Young Jean SONG, Myeong Woo HAN, Jun Goo WON, Shinichi IIZUKA, Youn Suk KIM
  • Publication number: 20130127669
    Abstract: There is provided a dielectric cavity antenna including: a multilayer substrate having an opening formed in at least a portion of a predetermined surface thereof; a dielectric cavity inserted into the multilayer substrate to radiate an electromagnetic wave signal through the opening; a feed line feeding power to the dielectric cavity; and at least one metal pattern formed in an inner portion of the dielectric cavity or on a surface thereof to thereby be electromagnetically coupled to the feed line.
    Type: Application
    Filed: January 31, 2012
    Publication date: May 23, 2013
    Inventors: Myeong Woo Han, Jung Aun Lee, Nam Heung Kim