Abstract: In a method of manufacturing a semiconductor device, a trench is formed by removing an upper portion of a substrate. A gate insulation layer pattern is formed on an inner wall of the trench. A gate electrode is formed on the gate insulation layer pattern. The gate electrode fills a lower portion of the trench. A capping layer is formed on the gate electrode and the gate insulation layer pattern. The capping layer is partially oxidized to form a first capping layer pattern and a second capping layer pattern. The first capping layer pattern is not oxidized, and the second capping layer pattern is oxidized. A third capping layer pattern is formed on the second capping layer pattern, the third capping layer pattern filling an upper portion of the trench.

Abstract: Semiconductor devices are provided including a gate across an active region of a substrate; a source region and a drain region in the active region on either side of the gate and spaced apart from each other; a main channel impurity region in the active region between the source and drain regions and having a first channel impurity concentration; and a lightly doped channel impurity region in the active region adjacent to the drain region. The lightly doped channel impurity region has the same conductivity type as the main channel impurity region and a second channel impurity concentration, lower than the first channel impurity concentration. The lightly doped channel impurity region and the main channel impurity region contain a first element. The lightly doped channel impurity region also contains a second element, which is a different Group element from the first element.

Abstract: A semiconductor device includes an active region defined by a device isolation layer and including first and second sections or regions, a gate electrode extending in a first direction across the active region over a channel between the first region and the second region and including at least one first gate tab protruding in a second direction toward the first region, and first and second contact plugs. The first gate tab covers and extends along a boundary between the active region and the device isolation layer. The first contact plug is disposed over the first region, the second contact plug is disposed over the second region, and the second contact plug has an effective width, as measured in the first direction, greater than that of the first contact plug.

Abstract: A method of fabricating a semiconductor device is disclosed, the method generally including the steps of: forming a gate dielectric layer on a semiconductor substrate; forming a gate electrode on the gate dielectric layer; forming an etch stop layer on the gate electrode; forming a capacitor on the semiconductor substrate adjacent to the gate electrode; after forming the capacitor, forming a contact hole passing through the etch stop layer on the gate electrode; and, diffusing deuterium into the gate dielectric layer through the contact hole.

Abstract: A semiconductor device includes an active region defined by a device isolation layer and including first and second sections or regions, a gate electrode extending in a first direction across the active region over a channel between the first region and the second region and including at least one first gate tab protruding in a second direction toward the first region, and first and second contact plugs. The first gate tab covers and extends along a boundary between the active region and the device isolation layer. The first contact plug is disposed over the first region, the second contact plug is disposed over the second region, and the second contact plug has an effective width, as measured in the first direction, greater than that of the first contact plug.

Abstract: According to an example embodiment of inventive concepts, a capacitorless memory device includes a capacitorless memory cell that includes a bit line on a substrate; a read transistor, and a write transistor. The read transistor may include first to third impurity layers stacked in a vertical direction on the bit line. The first and third layers may be a first conductive type, and the second impurity layer may be a second conductive type that differs from the first conductive type. The write transistor may include a source layer, a body layer, and a drain layer stacked in the vertical direction on the substrate, and a gate line that is adjacent to a side surface of the body layer. The gate line may be spaced apart from the side surface of the body layer. The source layer may be adjacent to a side surface of the second impurity layer.

Abstract: A semiconductor device includes an active region defined by a device isolation layer and including first and second sections or regions, a gate electrode extending in a first direction across the active region over a channel between the first region and the second region and including at least one first gate tab protruding in a second direction toward the first region, and first and second contact plugs. The first gate tab covers and extends along a boundary between the active region and the device isolation layer. The first contact plug is disposed over the first region, the second contact plug is disposed over the second region, and the second contact plug has an effective width, as measured in the first direction, greater than that of the first contact plug.

Abstract: A method of fabricating a semiconductor device is disclosed, the method generally including the steps of: forming a gate dielectric layer on a semiconductor substrate;forming a gate electrode on the gate dielectric layer;forming an etch stop layer on the gate electrode;forming a capacitor on the semiconductor substrate adjacent to the gate electrode;after forming the capacitor, forming a contact hole passing through the etch stop layer on the gate electrode;and, diffusing deuterium into the gate dielectric layer through the contact hole.

Abstract: Semiconductor devices are provided including a gate across an active region of a substrate; a source region and a drain region in the active region on either side of the gate and spaced apart from each other; a main channel impurity region in the active region between the source and drain regions and having a first channel impurity concentration; and a lightly doped channel impurity region in the active region adjacent to the drain region. The lightly doped channel impurity region has the same conductivity type as the main channel impurity region and a second channel impurity concentration, lower than the first channel impurity concentration. The lightly doped channel impurity region and the main channel impurity region contain a first element. The lightly doped channel impurity region also contains a second element, which is a different Group element from the first element.