Abstract: Provided are a device for a digital assay of targets according to an exemplary embodiment of the present disclosure and a method using the same. The digital assay method of targets according to the exemplary embodiment of the present disclosure includes acquiring an image for a plurality of microdroplets, predicting at least one region based on the image for the plurality of microdroplets using an artificial neural network-based prediction model configured to segment at least one region among positive microdroplets, negative microdroplets, and atypical microdroplets, with the image for the plurality of microdroplets as an input, determining a number for the plurality of microdroplets based on the at least one region, and providing quantitative data of targets based on the number for the plurality of microdroplets.

Abstract: A solid state drive apparatus may include a main body including a semiconductor device, a label attached to a first portion of an exterior surface of the main body such that a second portion of the exterior surface of the main body is free of the label, and an information marking on the label and on the second portion of the exterior surface of the main body.

Abstract: A solid state drive apparatus may include a main body including a semiconductor device, a label attached to a first portion of an exterior surface of the main body such that a second portion of the exterior surface of the main body is free of the label, and an information marking on the label and on the second portion of the exterior surface of the main body.

Abstract: An electronic component, a semiconductor package, and an electronic device including the electronic component and/or the semiconductor package are provided. The electronic component includes an electronic element; an encapsulation member that encapsulates the electronic element and has a first surface and a second surface substantially parallel to each other; and a lead electrically connected to the electronic element and extending outward from the encapsulation member. The lead is disposed entirely in a region between a plane of the first surface of the encapsulation member and a plane of the second surface of the encapsulation member.

Abstract: An electronic component, a semiconductor package, and an electronic device including the electronic component and/or the semiconductor package are provided. The electronic component includes an electronic element; an encapsulation member that encapsulates the electronic element and has a first surface and a second surface substantially parallel to each other; and a lead electrically connected to the electronic element and extending outward from the encapsulation member. The lead is disposed entirely in a region between a plane of the first surface of the encapsulation member and a plane of the second surface of the encapsulation member.