Patents by Inventor Nam-Hong Lee

Nam-Hong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240363832
    Abstract: One embodiment of the present invention relates to a lithium metal anode. Wherein the lithium metal anode comprises a current collector and a lithium metal thin film layer disposed on at least one surface of the current collector and having a thickness in a range of 0.1 to 200 ?m and a coating layer disposed on a surface of the lithium metal thin film layer, wherein, the coating layer comprising a Li—N—C—H—O based ionic compound.
    Type: Application
    Filed: May 13, 2024
    Publication date: October 31, 2024
    Applicants: POSCO CO., LTD, RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE & TECHNOLOGY
    Inventors: Jin Hong Kim, Hong-Youl Bae, Mun Kyu Cho, Nam Soon Choi, Sang-Lag Lee, Weon-Soo Bae, Yong Won Lee, Ji-Woong Moon
  • Patent number: 12092907
    Abstract: A transmittance-variable device is provided in the present application. The present application provides a transmittance-variable device, which can be applied to various applications without causing problems such as a crosstalk phenomenon, a rainbow phenomenon or a mirroring phenomenon, while having excellent transmittance-variable characteristics.
    Type: Grant
    Filed: March 9, 2023
    Date of Patent: September 17, 2024
    Assignee: LG Chem, Ltd.
    Inventors: Eun Jung Lim, Sergey Belyaev, Min Jun Gim, Dong Hyun Oh, Jung Sun You, Nam Gyu Kim, Jin Hong Kim, Hyun Jun Lee
  • Publication number: 20240270646
    Abstract: Provided are a marine concrete composition using dechlorination microorganisms capable of easily removing chlorine generated by seawater through an electrical method by allowing electrons emitted from electricity-generating microorganisms to flow through steel fibers incorporated into ultra-high-performance concrete (UHPC) or high-performance fiber reinforced concrete (HPFRCC) through a dechlorination microbial capsule carrier and capable of self-healing concrete crack sites through a self-healing microbial capsule carrier and is also capable of fundamentally solving the problem of reduced durability against salt damage of ultra-high-performance concrete or high-performance fiber reinforced concrete for application in marine construction environments through a dechlorination microbial capsule carrier, and a method for constructing a marine concrete structure using the same.
    Type: Application
    Filed: November 6, 2023
    Publication date: August 15, 2024
    Applicants: KOREA INSTITUTE OF CIVIL ENGINEERING AND BUILDING TECHNOLOGY, Four-m Co., Ltd.
    Inventors: Kyong-Chul Kim, Kwang-Mo Lim, Kyung-Taek Koh, Gum-Sung Ryu, Sung Yong Park, Jae-Yoon Kang, Gi-Hong An, Kihyon Kwon, Nam-Kon Lee, Soonku Yoon, Jueng wan Go, Dong ha Lee
  • Patent number: 10823779
    Abstract: A substrate manufacturing apparatus includes a test apparatus including a test handler module for performing a test process on a substrate. The test handler module may include a conveyor unit to transfer a substrate, a handler unit for performing a test process on the substrate, and a transfer unit for transferring the substrate between the conveyor unit and the handler unit. The conveyor unit may include a feed conveyor and a discharge conveyor spaced apart from the feed conveyor.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: November 3, 2020
    Assignees: Samsung Electronics Co., Ltd., Semes Co., Ltd.
    Inventors: Youngchul Lee, Semin Kwon, JinHwan Lee, Jea-Muk Oh, Kyungsook Lee, Nam-Hong Lee
  • Publication number: 20180246164
    Abstract: A substrate manufacturing apparatus includes a test apparatus including a test handler module for performing a test process on a substrate. The test handler module may include a conveyor unit to transfer a substrate, a handler unit for performing a test process on the substrate, and a transfer unit for transferring the substrate between the conveyor unit and the handler unit. The conveyor unit may include a feed conveyor and a discharge conveyor spaced apart from the feed conveyor.
    Type: Application
    Filed: April 27, 2018
    Publication date: August 30, 2018
    Applicant: Semes Co. , Ltd.
    Inventors: Youngchul Lee, Semin Kwon, JinHwan Lee, Jea-Muk Oh, Kyungsook Lee, Nam-Hong Lee
  • Patent number: 9995787
    Abstract: A substrate manufacturing apparatus includes a test apparatus including a test handler module for performing a test process on a substrate. The test handler module may include a conveyor unit to transfer a substrate, a handler unit for performing a test process on the substrate, and a transfer unit for transferring the substrate between the conveyor unit and the handler unit. The conveyor unit may include a feed conveyor and a discharge conveyor spaced apart from the feed conveyor.
    Type: Grant
    Filed: February 4, 2016
    Date of Patent: June 12, 2018
    Assignees: Samsung Electronics Co., Ltd., Semes Co., Ltd.
    Inventors: Youngchul Lee, Semin Kwon, JinHwan Lee, Jea-Muk Oh, Kyungsook Lee, Nam-Hong Lee
  • Patent number: 9618568
    Abstract: A method of testing a semiconductor device using the test equipment includes loading an undivided printed circuit board (PCB) including unit PCBs in a test equipment. A semiconductor device is mounted in each of the unit PCBs. Product information of the undivided PCB loaded in the test equipment is confirmed. The undivided PCB whose product information has been confirmed is electrically connected to one of a plurality of main testers of the test equipment. Each of the main testers includes a main test interface directly connected to a cloud server in which firmwares for various kinds of tests are stored. The product information of the undivided PCB is transmitted to the main tester electrically connected to the undivided PCB. The main tester to which the product information has been transmitted performs a main test of the undivided PCB using the product information. The undivided PCB on which the main test has been performed by the main tester is unloaded from the test equipment.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: April 11, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-Chul Lee, Nam-Hong Lee, Kyung-Sook Lee, Jung-Hyun Park, Sang-Youl Lee
  • Publication number: 20160154054
    Abstract: A substrate manufacturing apparatus includes a test apparatus including a test handler module for performing a test process on a substrate. The test handler module may include a conveyor unit to transfer a substrate, a handler unit for performing a test process on the substrate, and a transfer unit for transferring the substrate between the conveyor unit and the handler unit. The conveyor unit may include a feed conveyor and a discharge conveyor spaced apart from the feed conveyor.
    Type: Application
    Filed: February 4, 2016
    Publication date: June 2, 2016
    Inventors: Youngchul Lee, Semin Kwon, JinHwan Lee, Jea-Muk Oh, Kyungsook Lee, Nam-Hong Lee
  • Patent number: 9285416
    Abstract: A substrate manufacturing apparatus includes a test apparatus including a test handler module for performing a test process on a substrate. The test handler module may include a conveyor unit to transfer a substrate, a handler unit for performing a test process on the substrate, and a transfer unit for transferring the substrate between the conveyor unit and the handler unit. The conveyor unit may include a feed conveyor and a discharge conveyor spaced apart from the feed conveyor.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: March 15, 2016
    Assignees: Samsung Electronics Co., Ltd., Semes Co., Ltd.
    Inventors: Youngchul Lee, Semin Kwon, JinHwan Lee, Jea-Muk Oh, Kyungsook Lee, Nam-Hong Lee
  • Publication number: 20140197861
    Abstract: A method of testing a semiconductor device using the test equipment includes loading an undivided printed circuit board (PCB) including unit PCBs in a test equipment. A semiconductor device is mounted in each of the unit PCBs. Product information of the undivided PCB loaded in the test equipment is confirmed. The undivided PCB whose product information has been confirmed is electrically connected to one of a plurality of main testers of the test equipment. Each of the main testers includes a main test interface directly connected to a cloud server in which firmwares for various kinds of tests are stored. The product information of the undivided PCB is transmitted to the main tester electrically connected to the undivided PCB. The main tester to which the product information has been transmitted performs a main test of the undivided PCB using the product information. The undivided PCB on which the main test has been performed by the main tester is unloaded from the test equipment.
    Type: Application
    Filed: November 12, 2013
    Publication date: July 17, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Young-Chul Lee, Nam-Hong Lee, Kyung-Sook Lee, Jung-Hyun Park, Sang-Youl Lee
  • Publication number: 20130257471
    Abstract: A substrate manufacturing apparatus includes a test apparatus including a test handler module for performing a test process on a substrate. The test handler module may include a conveyor unit to transfer a substrate, a handler unit for performing a test process on the substrate, and a transfer unit for transferring the substrate between the conveyor unit and the handler unit. The conveyor unit may include a feed conveyor and a discharge conveyor spaced apart from the feed conveyor.
    Type: Application
    Filed: March 13, 2013
    Publication date: October 3, 2013
    Inventors: Youngchul Lee, Semin Kwon, JinHwan Lee, Jea-Muk Oh, Kyungsook Lee, Nam-Hong Lee