Abstract: The present invention relates to a multi-component host material and an organic electroluminescent device comprising the same. By comprising a specific combination of the multi-component host compounds, the organic electroluminescent device according to the present invention can provide high luminous efficiency and excellent lifespan characteristics.

Abstract: Provided are a monitoring device and method. A monitoring device includes a laser processor configured to emit a processing laser beam to perform a melting annealing process on a wafer; a laser monitor configured to emit a monitoring laser beam onto the wafer while the laser processor performs the melting annealing process, the laser monitor configured to measure reflectivity of the wafer; and a data processor configured to process data on the reflectivity measured by the laser monitor, and monitor one or more characteristics of the wafer based on the data on the reflectivity.

Abstract: In a method of manufacture, a displacement sensor is provided over a conditioner disk. The conditioner disk is rotated to perform a conditioning process on a polishing surface of a polishing pad. A displacement of the rotating conditioner disk is detected using the displacement sensor during the conditioning process. A height of the conditioner disk is calculated from the detected displacement. An end point of the conditioning process is determined on the polishing surface based on the calculated height.

Abstract: Provided is an ampoule-type reserve battery including: an ampoule casing having an accommodation part formed therein; an electrolyte accommodated in a lower portion of the accommodation part; a leakage prevention liquid made of oil, which is phase-separated from the electrolyte without being mixed therewith so as to prevent the electrolyte from leaking through an upper portion of the accommodation part, and accommodated in the upper portion of the accommodation part; and a separation membrane mounted in the accommodation part and configured to separate the electrolyte from the leakage prevention liquid.

Abstract: In a method of manufacture, a displacement sensor is provided over a conditioner disk. The conditioner disk is rotated to perform a conditioning process on a polishing surface of a polishing pad. A displacement of the rotating conditioner disk is detected using the displacement sensor during the conditioning process. A height of the conditioner disk is calculated from the detected displacement. An end point of the conditioning process is determined on the polishing surface based on the calculated height.

Abstract: Provided are a monitoring device and method. A monitoring device includes a laser processor configured to emit a processing laser beam to perform a melting annealing process on a wafer; a laser monitor configured to emit a monitoring laser beam onto the wafer while the laser processor performs the melting annealing process, the laser monitor configured to measure reflectivity of the wafer; and a data processor configured to process data on the reflectivity measured by the laser monitor, and monitor one or more characteristics of the wafer based on the data on the reflectivity.

Abstract: Provided is an ampoule-type reserve battery including: an ampoule casing having an accommodation part formed therein; an electrolyte accommodated in a lower portion of the accommodation part; a leakage prevention liquid made of oil, which is phase-separated from the electrolyte without being mixed therewith so as to prevent the electrolyte from leaking through an upper portion of the accommodation part, and accommodated in the upper portion of the accommodation part; and a separation membrane mounted in the accommodation part and configured to separate the electrolyte from the leakage prevention liquid.

Abstract: In a method of manufacture, a displacement sensor is provided over a conditioner disk. The conditioner disk is rotated to perform a conditioning process on a polishing surface of a polishing pad. A displacement of the rotating conditioner disk is detected using the displacement sensor during the conditioning process. A height of the conditioner disk is calculated from the detected displacement. An end point of the conditioning process is determined on the polishing surface based on the calculated height.

Abstract: Provided are a monitoring device and method. A monitoring device includes a laser processor configured to emit a processing laser beam to perform a melting annealing process on a wafer; a laser monitor configured to emit a monitoring laser beam onto the wafer while the laser processor performs the melting annealing process, the laser monitor configured to measure reflectivity of the wafer; and a data processor configured to process data on the reflectivity measured by the laser monitor, and monitor one or more characteristics of the wafer based on the data on the reflectivity.

Abstract: An apparatus for treating a substrate includes a chamber including a space in which a substrate is treated, a support member disposed in the chamber and supporting the substrate, and a heating member for heating the substrate. The space is divided into an upper space and a lower space by the support member. The support member includes a support plate receiving the substrate, a base supporting the support plate, exposing a bottom surface of the support plate and including a cut region formed in an edge portion of the base, and an adjustment block held in the cut region and coupled to the base. The cut region fluidly connects the upper space to the lower space. The adjustment block divides the cut region into a plurality of vents.

Abstract: In a method of manufacture, a displacement sensor is provided over a conditioner disk. The conditioner disk is rotated to perform a conditioning process on a polishing surface of a polishing pad. A displacement of the rotating conditioner disk is detected using the displacement sensor during the conditioning process. A height of the conditioner disk is calculated from the detected displacement. An end point of the conditioning process is determined on the polishing surface based on the calculated height.

Abstract: Provided are a monitoring device and method. A monitoring device includes a laser processor configured to emit a processing laser beam to perform a melting annealing process on a wafer; a laser monitor configured to emit a monitoring laser beam onto the wafer while the laser processor performs the melting annealing process, the laser monitor configured to measure reflectivity of the wafer; and a data processor configured to process data on the reflectivity measured by the laser monitor, and monitor one or more characteristics of the wafer based on the data on the reflectivity.

Abstract: Provided is a technical spillover effect analysis method. The technical spillover effect analysis method according to an embodiment of the present invention includes: obtaining technical co-classification information from a patent concurrently technically classified into two or more technical categories from patent data formed of a plurality of patents classified into preset technical categories; calculating the degree of the relationship between the technical categories from the technical co-classification information; and deriving a technical spillover effect for the technology classification using the degree of the relationship between the technical categories.

Abstract: A transparent plate and a substrate processing system including the same are disclosed. The substrate processing system may include a chamber, a lamp provided below the chamber, and a plate provided in the chamber to load a substrate. The plate may include a center region having a first transmittance value and an edge region having with a second transmittance value higher than the first transmittance value.

Abstract: An apparatus for treating a substrate includes a chamber including a space in which a substrate is treated, a support member disposed in the chamber and supporting the substrate, and a heating member for heating the substrate. The space is divided into an upper space and a lower space by the support member. The support member includes a support plate receiving the substrate, a base supporting the support plate, exposing a bottom surface of the support plate and including a cut region formed in an edge portion of the base, and an adjustment block held in the cut region and coupled to the base. The cut region fluidly connects the upper space to the lower space. The adjustment block divides the cut region into a plurality of vents.

Abstract: A transparent plate and a substrate processing system including the same are disclosed. The substrate processing system may include a chamber, a lamp provided below the chamber, and a plate provided in the chamber to load a substrate. The plate may include a center region having a first transmittance value and an edge region having with a second transmittance value higher than the first transmittance value.

Abstract: An arc discharge apparatus includes a body unit including a housing and a transmissive member fixed to the housing, the housing having a coolant inlet and a coolant outlet, and an electrode unit on the housing, the electrode unit including an anode and a cathode facing each other, wherein the anode includes a main body portion connected to the housing, an anode tip coupled to the main body portion, and a cooling line in the anode and in contact with an inner wall of the anode tip, the cooling line being connected to the coolant inlet and to the coolant outlet.

Abstract: An apparatus for organic layer deposition is provided that can improve precision of a gap between a substrate and a mask by correcting a position of a mask stage having a mask mounted thereon based on a substrate shape, and that can reduce a measurement error of a mask surface by pre-measuring a position of a mask and determining an initial position of the mask based on the measured position. The apparatus includes a shape measuring sensor, a substrate carrier, a deposition material discharge source, a mask including a plurality of pattern slits, a camera measuring an alignment error between the substrate and the mask, a distance measuring sensor measuring an alignment error between the substrate and the mask, and a mask stage controlling a position of the mask.

Abstract: A roll-to-roll printing system includes driven rolls to apply a feeding force to a flexible substrate so that the flexible substrate is fed from an unwinder to a rewinder, nip rolls respectively disposed above two opposite end portions of each of the driven rolls to pressurize two opposite side portions of the flexible substrate, nip roll driving motors connected to the nip rolls to rotate the nip rolls, and a control unit to receive information regarding change of torque values of the nip roll driving motors and control tension of the flexible substrate based on the information.

Abstract: A printing plate cleaning apparatus may include a cleaning chamber configured to receive a printing plate to be cleaned, a nozzle supporter in the cleaning chamber, and/or a unified nozzle unit that includes a cleaning nozzle unit and a rinsing nozzle unit unified as a body and attached to the nozzle supporter. The cleaning nozzle unit may include a cleaner nozzle configured to inject cleaner to the printing plate and/or a first suction nozzle suctioning waste. The rinsing nozzle unit may include a rinsing liquid nozzle configured to inject rinsing liquid to the printing plate and/or a second suction nozzle suctioning the waste. A printing plate cleaning apparatus may include the cleaning chamber, a cleaning nozzle unit in the cleaning chamber, and/or a rinsing nozzle unit in the cleaning chamber. The cleaning and rinsing nozzle units may be configured to move together with each other in the cleaning chamber.