Abstract: An enhanced integrated circuit interconnect package, method and multiple-layer integrated circuit laminate structure enable increased routing density per layer and maintains signal integrity performance. A differential signal via pair of vertical interconnect vias provide differential signaling. The vias of the differential signal via pair are positioned closely spaced together with each via offset from a center axis of an associated LGA contact, minimizing space between the differential signal vias and maintaining signal integrity performance, and providing increased available wiring signal channel.

Abstract: A gang drilling machine for drilling a circuit card includes a pair of n and p master drills that are configured to be aligned in registry with respective n and p test vias of the card; pluralities of n and p minion drills that are configured to be aligned in registry with pluralities of n and p live vias of the card; and a controller that is electrically connected to control the n and p master drills and minion drills, and to send and receive electrical signals to and from the card. The controller is configured to: send a query signal to the card; monitor a response signal from the card; determine drilling depth of at least one of the master drills, in response to comparing the response signal to the query signal; and adjust operation of the machine, in response to the determined drilling depth.

Abstract: A computer controls voltage supply for a system that includes a plurality of active cables. The computer determines that a first voltage source included in a first cable has failed to provide a required amount of voltage to the first cable. The computer switches the first cable to a second voltage source included in a second cable. The second voltage source provides voltage to the first cable.

Abstract: A computer uses an active cable architecture to control communications. The computer sends a first set of instructions for completion of an activity to a first micro-controller of an active communication cable. The computer determines that at least one transceiver of an active cable is to receive a set of signals from the first micro-controller. The computer forms a communication connection between the first micro-controller and the at least one transceiver. The computer sends a second set of instructions to the at least one transceiver, wherein the second set of instructions instruct the at least one transceiver to complete at least a portion of the activity.

Abstract: A computer uses an active cable architecture to control communications. The computer sends a first set of instructions for completion of an activity to a first micro-controller of an active communication cable. The computer determines that at least one transceiver of an active cable is to receive a set of signals from the first micro-controller. The computer forms a communication connection between the first micro-controller and the at least one transceiver. The computer sends a second set of instructions to the at least one transceiver, wherein the second set of instructions instruct the at least one transceiver to complete at least a portion of the activity.

Abstract: A computer controls voltage supply for a system that includes a plurality of active cables. The computer determines that a first voltage source included in a first cable has failed to provide a required amount of voltage to the first cable. The computer switches the first cable to a second voltage source included in a second cable. The second voltage source provides voltage to the first cable.

Abstract: A method for testing a printed circuit board to determining the dielectric loss associated with the circuit board material relative to a standard. Dielectric losses in the material generate heat when a high frequency electronic signal, such as a microwave frequency signal, is communicated through a microstrip that is embedded within the printed circuit board. The temperature or spectrum at the surface of printed circuit board is measured and compared against the temperature or spectrum of the standard to determine whether the material under test is acceptable. While various temperature measurement devices may be used, the temperature is preferably measured without contacting the surface, such as using an infrared radiation probe.

Abstract: A method for testing a printed circuit board to determining the dielectric loss associated with the circuit board material relative to a standard. Dielectric losses in the material generate heat when a high frequency electronic signal, such as a microwave frequency signal, is communicated through a microstrip that is embedded within the printed circuit board. The temperature or spectrum at the surface of printed circuit board is measured and compared against the temperature or spectrum of the standard to determine whether the material under test is acceptable. While various temperature measurement devices may be used, the temperature is preferably measured without contacting the surface, such as using an infrared radiation probe.

Abstract: An apparatus, system, and method are disclosed for integrating component testing. A voltage module modifies a reference voltage integral to an electronic device to a plurality of reference voltage values. A test module tests a component of the electronic device at each of the plurality of reference voltage values. In addition, the test module determines a voltage range for the component, wherein the voltage range comprises voltage values between a high voltage failure and a low voltage failure. An optimization module sets the reference voltage value to within the voltage range.

Abstract: A cable having an electrically conducting wire with a cross sectional shape defined by a simple closed curve having from three to eight concave portions separated by an equal number of convex portions. The simple closed curve has no point where the radius of curvature is less than one-sixth (?) of an overall radius of the wire and no point where adjacent curves or lines intersect at an angle. The alternating concave and convex portions of the cable's cross-sectional shape may have substantially the same curvature. The cross-sectional shape of the cable avoids sharp angles and fight curves.

Abstract: An apparatus, system, and method are disclosed for modifying memory device timing and voltage. A detection module detects a change of memory device stress. A timing modification module modifies the memory device timing in response to the change of the memory device stress. In addition, a voltage modification module modifies the memory device voltage in response to the change of the memory device stress. In one embodiment, a processor pause module pauses the operation of a processor module while the timing modification module modifies the memory device timing and the voltage modification module modifies the memory device voltage.

Abstract: Embodiments of the invention address deficiencies of the art in respect to parameter value configuration for signaling in a multi-drop net, and provide a novel and non-obvious method, system and apparatus for spatial based transceiver adjustment. In one embodiment of the invention, a spatial based dynamic transceiver configuration method can be provided for a multi-drop net. The method can include locating a position for a target receiver for signaling in the multi-drop net, selecting a static transceiver configuration corresponding to the position, and signaling the target receiver utilizing the selected static transceiver configuration. The locating, selecting and signaling can be repeated for different target receivers in different positions in the multi-drop net each repetition utilizing a different selected transceiver configuration.

Abstract: A method and system for reducing a reflection coefficient below a predetermined value thereby reducing jitter by the variation of the effective impedance of a driver appearing to be bounded during state transitions. The driver may include a pull-up driver and a pull-down driver. In the pull-up driver, the transistors may be switched from a first state to a second state in a staggered fashion where the first state is complementary to the second state; In the pull-down driver, the transistors may be switched from a second state to a first state in a staggered fashion. By staggering the switching of the transistors in the pull-up driver and the pull-down driver, a portion of the current may flow from the pull-up driver to the pull-down driver thereby causing the variation of the effective impedance of the driver to appear to be bounded during state transitions.

Abstract: A method and system for reducing a reflection coefficient below a predetermined value thereby reducing jitter by the variation of the effective impedance of a driver appearing to be bounded during state transitions. The driver may comprise a pull-up driver and a pull-down driver. In the pull-driver, the transistors may be switched from a first state to a second state in a staggered fashion where the first state is complementary to the second state. In the pull-down driver, the transistors may be switched from a second state to a first state in a staggered fashion. By staggering the switching of the transistors in the pull-up driver and the pull-down driver, a portion of the current may flow from the pull-up driver to the pull-down driver thereby causing the variation of the effective impedance of the driver to appear to be bounded during state transitions.