Abstract: The present disclosure provides substrate heat-treating apparatus including a process chamber in which a flat substrate to be heat treated is placed, the process chamber comprising a beam irradiating plate placed below the flat substrate and an infrared transmitting plate placed above the flat substrate; a beam irradiating module for irradiating a laser beam to a lower surface of the flat substrate through the beam irradiating plate; and a gas circulation cooling module for spraying a cooling gas to an upper surface of the infrared transmitting plate, thereby cooling the infrared transmitting plate.

Abstract: The present disclosure discloses a flat substrate heating apparatus including a module support plate having a plurality of unit module regions placed on an upper surface thereof; a plurality of laser light source modules having a plurality of laser light source devices and seated on unit module regions of the module support plate, respectively; a power supply board placed below the module support plate and configured to supply power to the laser light source module; and an electrode terminal electrically connecting the laser light source module and the power supply board while detachably securing them to upper and lower surfaces of the module support plate.

Abstract: A thin film transistor array panel according to an exemplary embodiment of the present invention includes: a gate line disposed on a substrate and including a gate electrode; a gate insulating layer formed on the gate line; a first oxide semiconductor layer disposed on the gate insulating layer and formed of an oxide semiconductor; a data wiring layer disposed on the gate insulating layer and including data line intersecting with the gate line, a source electrode connected to the data line, and a drain electrode facing the drain electrode; and a second oxide semiconductor layer covering the source electrode and the drain electrode, wherein the data wiring layer includes copper or a copper alloy.