Abstract: The present disclosure relates to a simulation apparatus for secondary battery production. The simulation apparatus for secondary battery production includes a memory configured to store at least one instruction and at least one processor configured to execute the at least one instruction stored in the memory to perform operations including: receiving information associated with a user account of a user using the simulation apparatus for secondary battery production; when receiving the information associated with the user account, executing an apparatus operating unit including a 3D lamination and stack (L&S) apparatus related to secondary battery production, a facility operating unit including a plurality of adjustment parameters for determining operation of the 3D L&S apparatus, and a quality checking unit including quality information related to quality of a mono-cell produced by the 3D L&S apparatus.

Abstract: The present disclosure relates to a simulation apparatus for secondary battery production. The simulation apparatus for secondary battery production includes a memory configured to store at least one instruction and at least one processor configured to execute the at least one instruction stored in the memory to perform operations including: executing an apparatus operating unit including a 3D laminator related to secondary battery production, a facility operating unit including a plurality of adjustment parameters for determining operation of the 3D laminator, and a quality checking unit including quality information related to quality of a bi-cell produced by the 3D laminator.

Abstract: The present invention relates to a novel compound exhibiting anti-inflammatory activity, and the compound of the present invention plays a key role in the generation of pro-inflammatory cytokines, thereby having excellent inhibitory activity against p38 MAPK, which is known to cause inflammatory diseases, and thus can be effectively used as an agent for treating inflammatory diseases.

Abstract: Systems and methods for executing a simulation of a mold notching machine for secondary battery production by one or more processors to perform operations. The operations include executing an apparatus operating unit including a 3D mold notching machine related to secondary battery production, executing a facility operating unit including a plurality of adjustment parameters for determining an operation of the 3D mold notching machine, executing a quality checking unit including quality information related to quality of a material generated by the 3D mold notching machine, obtaining at least one of first user action information obtained through the apparatus operating unit or first user condition information obtained through the facility operating unit, determining operation of the 3D mold notching machine based on at least one of the first user action information or the first user condition information, and punching out electrodes based on the operation of the 3D mold notching machine.

Abstract: The present disclosure relates to a simulation apparatus for secondary battery production.

Abstract: The present invention relates to a method of manufacturing a transparent conductive layer and a transparent conductive layer manufactured by the method. The method of manufacturing the transparent conductive layer includes: a) a step of forming a conductive nanowire layer on a base material; b) a step of thermally treating the conductive nanowire layer; c) a step of applying a conductive metal ink on the conductive nanowire layer; and d) a step of thermally treating the base material coated with the conductive metal ink to electrically bridge the conductive nanowires with each other by conductive metal particles of the conductive metal ink.

Abstract: A method of fabricating a package substrate, includes forming a cavity in at least one region of an upper surface of a wafer, the cavity including a chip mounting region, forming a through-hole penetrating through the wafer and a via filling the through-hole, forming a first wiring layer and a second wiring layer spaced apart from the first wiring layer, which are extended into the cavity, and mounting a chip in the cavity to be connected to the first wiring layer and the second wiring layer.

Abstract: Disclosed is a transparent multilayer sheet that is excellent in antistatic properties, as well as transparency. The transparent multilayer sheet includes a surface layer comprising a conductive thermoplastic polyurethane or polyurea resin containing ethylene oxide; and a back layer attached to the surface layer and comprising a transparent non-conductive polymer resin. Preferably, the polyurethane or polyurea resin is a polymerization product of (a) a polyether-based polymer containing ethylene oxide and reacting with an isocyanate group; (b) an aromatic or aliphatic diisocyanate compound; and (c) a chain extender C2 to C10 containing a primary hydroxyl group or an amine group, and the transparent non-conductive polymer resin is selected from the group consisting of polyethylene terephthalate, glycol modified polyethylene tereph-thalate, glycol modified polycyclohexaneterephthalate, polymethylmethacrylate, polycarbonate, transparent acrylonitrile-butadiene-styrene (ABS), and mixtures thereof.

Abstract: A method of fabricating a package substrate, includes forming a cavity in at least one region of an upper surface of a wafer, the cavity including a chip mounting region, forming a through-hole penetrating through the wafer and a via filling the through-hole, forming a first wiring layer and a second wiring layer spaced apart from the first wiring layer, which are extended into the cavity, and mounting a chip in the cavity to be connected to the first wiring layer and the second wiring layer.

Abstract: The present invention relates to a copolymer polyester resin and a molded product using the same and more specifically to a copolymer polyester resin that contains 10˜80 mol % of 1,4-cyclohexane dimethanol, 0.1˜30 mol % of a cyclohexane dimethanol compound expressed as HOH2C—[C6H12]m—[C6H12]—CH2OH (where m is an integer from 1˜10), and ethylene glycol as the remainder so that the sum of the entire diol composition may be 100 mol % based on an aromatic dicarboxylic acid. The copolymer polyester of the present invention enables superior products to be provided that reduce cycle time and enhance product processability during mold processing using a heat-shrinking label by complementing low temperature shrinkage properties that may be exhibited by the polyester resin of the prior art copolymerized with 1,4-cyclohexane dimethanol.

Abstract: The present invention relates to a method of manufacturing a transparent conductive layer and a transparent conductive layer manufactured by the method. The method of manufacturing the transparent conductive layer includes: a) a step of forming a conductive nanowire layer on a base material; b) a step of thermally treating the conductive nanowire layer; c) a step of applying a conductive metal ink on the conductive nanowire layer; and d) a step of thermally treating the base material coated with the conductive metal ink to electrically bridge the conductive nanowires with each other by conductive metal particles of the conductive metal ink.

Abstract: The present invention relates to a copolymer polyester resin and a molded product using the same and more specifically to a copolymer polyester resin that contains 10˜80 mol % of 1,4-cyclohexane dimethanol, 0.1˜30 mol % of a cyclohexane dimethanol compound expressed as HOH2C—[C6H12]m—[C6H12]—CH2OH (where m is an integer from 1˜10), and ethylene glycol as the remainder so that the sum of the entire diol composition may be 100 mol % based on an aromatic dicarboxylic acid. The copolymer polyester of the present invention enables superior products to be provided that reduce cycle time and enhance product processability during mold processing using a heat-shrinking label by complementing low temperature shrinkage properties that may be exhibited by the polyester resin of the prior art copolymerized with 1,4-cyclohexane dimethanol.

Abstract: Disclosed is a transparent multilayer sheet that is excellent in antistatic properties, as well as transparency. The transparent multilayer sheet includes a surface layer comprising a conductive thermoplastic polyurethane or polyurea resin containing ethylene oxide; and a back layer attached to the surface layer and comprising a transparent non-conductive polymer resin. Preferably, the polyurethane or polyurea resin is a polymerization product of (a) a polyether-based polymer containing ethylene oxide and reacting with an isocyanate group; (b) an aromatic or aliphatic diisocyanate compound; and (c) a chain extender C2 to C10 containing a primary hydroxyl group or an amine group, and the transparent non-conductive polymer resin is selected from the group consisting of polyethylene terephthalate, glycol modified polyethylene terephthalate, glycol modified polycyclohexaneterephthalate, polymethylmethacrylate, polycarbonate, transparent acrylonitrile-butadiene-styrene (ABS), and mixtures thereof.

Abstract: There are provided a package substrate and a method fabricating thereof. The package substrate includes: a wafer having a cavity formed in an upper surface thereof, the cavity including a chip mounting region; a first wiring layer and a second wiring layer formed to be spaced apart from the first wiring layer, which are formed to be extended in the cavity; a chip positioned in the chip mounting region to be connected to the first wiring layer and the second wiring layer; a through-hole penetrating through the wafer and a via filled in the through-hole; and at least one electronic device connected to the via. Accordingly, a package substrate capable of having a passive device having a predetermined capacity embedded therein, while reducing a pattern size and increasing a component mounting density, and a method fabricating thereof may be provided.

Abstract: The present invention relates to a copolymer polyester resin and a molded product using the same and more specifically to a copolymer polyester resin that contains 10˜80 mol % of 1,4-cyclohexane dimethanol, 0.1˜30 mol % of a cyclohexane dimethanol compound expressed as HOH2C—[C6H12]m—[C6H12]—CH2OH (where m is an integer from 1˜10), and ethylene glycol as the remainder so that the sum of the entire diol composition may be 100 mol % based on an aromatic dicarboxylic acid. The copolymer polyester of the present invention enables superior products to be provided that reduce cycle time and enhance product processability during mold processing using a heat-shrinking label by complementing low temperature shrinkage properties that may be exhibited by the polyester resin of the prior art copolymerized with 1,4-cyclohexane dimethanol.