Patents by Inventor Nam Jung LEE
Nam Jung LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240109839Abstract: The present invention relates to a novel compound exhibiting anti-inflammatory activity, and the compound of the present invention plays a key role in the generation of pro-inflammatory cytokines, thereby having excellent inhibitory activity against p38 MAPK, which is known to cause inflammatory diseases, and thus can be effectively used as an agent for treating inflammatory diseases.Type: ApplicationFiled: December 23, 2021Publication date: April 4, 2024Applicant: PRAZERTHERAPEUTICS INC.Inventors: Kyung-Soo INN, Nam-Jung KIM, Jong Kil LEE, Ga Yeong KIM, Kyeojin KIM, Donghwan KIM, Jimin DO, Chaewon SONG, Na-Rae LEE
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Publication number: 20230084640Abstract: An acoustic resonator package includes a substrate, a cap including a protrusion portion protruding toward the substrate, an acoustic resonator disposed between the substrate and the cap and including a first electrode, a piezoelectric layer, and a second electrode, a metal layer connected to one of the first electrode and the second electrode, and a conductive pad at least partially disposed between the protrusion portion and the metal layer and extending in a first direction different from a second direction in which the acoustic resonator faces the conductive pad.Type: ApplicationFiled: March 2, 2022Publication date: March 16, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Nam Jung LEE, Tae Yoon KIM
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Patent number: 11476833Abstract: An acoustic resonator includes a substrate, an insulation layer disposed on the substrate, a resonating portion disposed on the insulation layer and having a first electrode, a piezoelectric layer, and a second electrode, stacked thereon, a cavity disposed between the insulation layer and the resonating portion, a protruded portion having a plurality of protrusions disposed on a lower surface of the cavity, and a hydrophobic layer disposed on an upper surface of the cavity and a surface of the protruded portion.Type: GrantFiled: June 10, 2019Date of Patent: October 18, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Tae Yoon Kim, Tae Kyung Lee, Sang Kee Yoon, Sung Jun Lee, Chang Hyun Lim, Nam Jung Lee, Tae Hun Lee, Moon Chul Lee
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Patent number: 11424729Abstract: A bulk-acoustic wave resonator includes a substrate, a first layer, a second layer, a membrane layer, and a resonance portion. The substrate includes a substrate protection layer. The first layer is disposed on the substrate protection layer. The second layer is disposed outside of the first layer. The membrane layer forms a cavity with the substrate protection layer and the first layer. The resonance portion is disposed on the membrane layer. Either one or both of the substrate protection layer and the membrane layer includes a protrusion disposed in the cavity.Type: GrantFiled: March 18, 2019Date of Patent: August 23, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Tae Hun Lee, Tae Yoon Kim, Moon Chul Lee, Chang Hyun Lim, Nam Jung Lee, Il Han Lee
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Patent number: 11050409Abstract: An acoustic resonator includes: an upper electrode including a first active region disposed on an upper portion of a piezoelectric layer, and a first extended region extended from the first active region; a lower electrode including a second active region disposed on a lower portion of the piezoelectric layer, and a second extended region extended from the second active region; a first metal layer including a first resistance reduction region disposed on the first extended region; and a second metal layer including a second resistance reduction region disposed on the second extended region. The first metal layer includes a first conductive link region extended from the first resistance reduction region. The second metal layer includes a second conductive link region extended from the second resistance reduction region. The first and second conductive link regions correspond to respective portions of a side boundary of the first and second active regions.Type: GrantFiled: July 30, 2019Date of Patent: June 29, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Yoon Sok Park, Dong Hoe Kim, Tah Joon Park, Won Kyu Jeung, Nam Jung Lee
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Publication number: 20200336131Abstract: An acoustic resonator includes: an upper electrode including a first active region disposed on an upper portion of a piezoelectric layer, and a first extended region extended from the first active region; a lower electrode including a second active region disposed on a lower portion of the piezoelectric layer, and a second extended region extended from the second active region; a first metal layer including a first resistance reduction region disposed on the first extended region; and a second metal layer including a second resistance reduction region disposed on the second extended region. The first metal layer includes a first conductive link region extended from the first resistance reduction region. The second metal layer includes a second conductive link region extended from the second resistance reduction region. The first and second conductive link regions correspond to respective portions of a side boundary of the first and second active regions.Type: ApplicationFiled: July 30, 2019Publication date: October 22, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Yoon Sok PARK, Dong Hoe KIM, Tah Joon PARK, Won Kyu JEUNG, Nam Jung LEE
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Patent number: 10756702Abstract: An acoustic resonator includes a substrate, and a resonant portion comprising a center portion in which a first electrode, a piezoelectric layer and a second electrode are sequentially laminated on the substrate, and an extending portion disposed along a periphery of the center portion, wherein the resonant portion is configured to have an asymmetrical polygonal plane, an insertion layer is disposed below the piezoelectric layer in the extending portion, and the piezoelectric layer is configured to have a top surface which is raised to conform to a shape of the insertion layer, and the insertion layer is configured to have an asymmetrical polygonal shape corresponding to a shape of the extending portion.Type: GrantFiled: November 14, 2018Date of Patent: August 25, 2020Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Tae Kyung Lee, Tae Yoon Kim, Jong Woon Kim, Moon Chul Lee, Yong Jin Kang, Nam Jung Lee
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Publication number: 20200169246Abstract: An acoustic resonator includes a substrate, an insulation layer disposed on the substrate, a resonating portion disposed on the insulation layer and having a first electrode, a piezoelectric layer, and a second electrode, stacked thereon, a cavity disposed between the insulation layer and the resonating portion, a protruded portion having a plurality of protrusions disposed on a lower surface of the cavity, and a hydrophobic layer disposed on an upper surface of the cavity and a surface of the protruded portion.Type: ApplicationFiled: June 10, 2019Publication date: May 28, 2020Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tae Yoon KIM, Tae Kyung LEE, Sang Kee YOON, Sung Jun LEE, Chang Hyun LIM, Nam Jung LEE, Tae Hun LEE, Moon Chul LEE
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Publication number: 20200091888Abstract: A bulk-acoustic wave resonator includes a substrate, a first layer, a second layer, a membrane layer, and a resonance portion. The substrate includes a substrate protection layer. The first layer is disposed on the substrate protection layer. The second layer is disposed outside of the first layer. The membrane layer forms a cavity with the substrate protection layer and the first layer. The resonance portion is disposed on the membrane layer. Either one or both of the substrate protection layer and the membrane layer includes a protrusion disposed in the cavity.Type: ApplicationFiled: March 18, 2019Publication date: March 19, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Tae Hun LEE, Tae Yoon KIM, Moon Chul LEE, Chang Hyun LIM, Nam Jung LEE, Il Han LEE
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Publication number: 20190386641Abstract: An acoustic resonator includes a substrate, and a resonant portion comprising a center portion in which a first electrode, a piezoelectric layer and a second electrode are sequentially laminated on the substrate, and an extending portion disposed along a periphery of the center portion, wherein the resonant portion is configured to have an asymmetrical polygonal plane, an insertion layer is disposed below the piezoelectric layer in the extending portion, and the piezoelectric layer is configured to have a top surface which is raised to conform to a shape of the insertion layer, and the insertion layer is configured to have an asymmetrical polygonal shape corresponding to a shape of the extending portion.Type: ApplicationFiled: November 14, 2018Publication date: December 19, 2019Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tae Kyung LEE, Tae Yoon KIM, Jong Woon KIM, Moon Chul LEE, Yong Jin KANG, Nam Jung LEE
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Patent number: 10068820Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.Type: GrantFiled: November 9, 2017Date of Patent: September 4, 2018Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Pil Joong Kang, Kwang Su Kim, Ji Hye Nam, Jeong Il Lee, Jong Hyeong Song, Yun Sung Kang, Seung Joo Shin, Nam Jung Lee
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Publication number: 20180068915Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.Type: ApplicationFiled: November 9, 2017Publication date: March 8, 2018Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Pil Joong KANG, Kwang Su KIM, Ji Hye NAM, Jeong Il LEE, Jong Hyeong SONG, Yun Sung KANG, Seung Joo SHIN, Nam Jung LEE
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Patent number: 9842787Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.Type: GrantFiled: September 26, 2016Date of Patent: December 12, 2017Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Pil Joong Kang, Kwang Su Kim, Ji Hye Nam, Jeong Il Lee, Jong Hyeong Song, Yun Sung Kang, Seung Joo Shin, Nam Jung Lee
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Publication number: 20170271222Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.Type: ApplicationFiled: September 26, 2016Publication date: September 21, 2017Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Pil Joong KANG, Kwang Su KIM, Ji Hye NAM, Jeong Il LEE, Jong Hyeong SONG, Yun Sung KANG, Seung Joo SHIN, Nam Jung LEE