Abstract: A bandpass filter (BPF) configured in 3-D structures for filtering signals of ultra wide bands is disclosed, the BPF comprising sequentially stacked first to fourth dielectric substrates, wherein the first dielectric substrate is formed at a bottom surface thereof with a first ground pattern, the second dielectric substrate is formed at an upper surface thereof with a second ground pattern, and a stripline pattern is formed between the first and second dielectric substrates. The fourth dielectric substrate is formed thereon with a filter pattern and input/output coupled line patterns.

Abstract: The chip embedded printed circuit board and a fabricating method thereof are disclosed, wherein a circuit pattern is formed by depositing a metal layer on a support layer, a semiconductor chip is packaged on a support layer to wrap the semiconductor chip and the circuit pattern on the support layer and to form an isolation layer, a via hole filled with conductive material is formed through the isolation layer for interlayer electrical connection, part of the support layer is selectively removed to form a plated heat sink, such that a packaging process can be performed in a very planar state and the plated heat sink can be integrated with a printed circuit board.

Abstract: A bandpass filter (BPF) configured in 3-D structures for filtering signals of ultra wide bands is disclosed, the BPF comprising sequentially stacked first to fourth dielectric substrates, wherein the first dielectric substrate is formed at a bottom surface thereof with a first ground pattern, the second dielectric substrate is formed at an upper surface thereof with a second ground pattern, and a stripline pattern is formed between the first and second dielectric substrates. The fourth dielectric substrate is formed thereon with a filter pattern and input/output coupled line patterns.