Abstract: A sensor shifting actuator includes a fixed body; a moving body disposed in the fixed body and including an image sensor having an imaging surface; a supporting substrate disposed in the fixed body and configured to support the moving body so that the moving body is movable with respect to the fixed body in first and second directions parallel to the imaging surface of the image sensor; and a driver configured to move the moving body in either one or both of the first and second directions. The supporting substrate includes a movable portion coupled to the moving body, a fixed portion coupled to the fixed body, and a connection portion disposed between the movable portion and the fixed portion. The movable portion and the connection portion are movable together in the first direction, and the movable portion is movable with respect to the connection portion in the second direction.

Abstract: A camera module includes a fixed frame having an internal space, a movable frame installed in the internal space of the fixed frame to be movable, with at least one optical member mounted thereon, and a driving wire including a wire member formed of a shape-memory alloy, and two coupling members coupled to the wire member and formed in a wedge shape, wherein the fixed frame includes a first wire coupling portion disposed to protrude toward the movable frame, and the movable frame includes a second wire coupling portion disposed to protrude toward the fixed frame, and the two coupling members of the driving wire are inserted into the first wire coupling portion and the second wire coupling portion, respectively, to connect the movable frame and the fixed frame to each other.

Abstract: A touch sensor includes a transparent substrate, and an electrode pattern formed on the transparent substrate. The electrode pattern is formed by stacking at least two or more electrode layers, thereby enhancing the anti-corrosion and visibility of electrode patterns and ensuring the adhesive reliability of the transparent substrate and the electrode patterns.

Abstract: There is provided a touch sensor including: a base substrate; a first electrode pattern formed on the base substrate and including first electrode lines repeatedly arranged in parallel with each other; and a second electrode pattern formed on a surface spaced apart from a surface on which the first electrode pattern is formed and including second electrode lines intersecting with the first electrode lines and repeatedly arranged in parallel with each other, wherein an extension line connecting intersection points between the first and second electrode lines to each other is formed as an oblique line with respect to a horizontal direction.

Abstract: Disclosed herein are a touch panel and a fabricating method thereof. In the touch panel according to an embodiment of the present invention, a noise shielding layer may be separately formed between a transparent substrate and an electrode pattern, thereby shielding noise that occur from a display coupled to the touch panel. In addition, through a bridge electrode pattern formed by patterning the noise shielding layer and a bridge insulating pattern patterned on an insulating layer formed on the noise shielding layer, a first electrode pattern and a second electrode pattern may be formed on the same plane of the transparent substrate so as to intersect with each other, thereby ensuring reliability of electrical connection between each electrode pattern.

Abstract: A method of manufacturing a printed circuit board having a bump is disclosed. The method includes preparing a first carrier having a first circuit formed thereon, compressing the first carrier to one surface of an insulation layer such that the first circuit is buried, stacking an etching resist on the first carrier in accordance with where the bump is to be formed and forming the bump by etching the first carrier. In accordance with an embodiment of the present invention, the difference in height between a bump and its adjacent bump in a printed circuit board can be reduced, and thus electrical connection between an electronic component and the printed circuit board can be better implemented.

Abstract: There is provided a touch sensor including: a base substrate; a first electrode pattern formed on the base substrate and including first electrode lines repeatedly arranged in parallel with each other; and a second electrode pattern formed on a surface spaced apart from a surface on which the first electrode pattern is formed and including second electrode lines intersecting with the first electrode lines and repeatedly arranged in parallel with each other, wherein an extension line connecting intersection points between the first and second electrode lines to each other is formed as an oblique line with respect to a horizontal direction.

Abstract: A method of manufacturing a ball grid array substrate includes: forming a first circuit pattern and a second circuit pattern on a first metal carrier and a second metal carrier, respectively; stacking a first insulating layer and a second insulating layer with a separable material interposed therebetween, wherein each of the first and second insulating layers has first and second surfaces opposing each other, and the first surface contacts the separable material; burying the first and second circuit patterns in the second surfaces of the first and second insulating layers, respectively; removing the first and second metal carriers; removing the separable material to separate the first and second insulating layers from each other; and forming an opening in each of the first and second insulating layers to connect the first and second surfaces with each other. The method may also be part of a process for manufacturing a semiconductor package.

Abstract: A single layered printed circuit board and a method of manufacturing the same are disclosed. In accordance with an embodiment of the present invention, the method can include forming a bonding pad, a circuit pattern and a post on a surface of an insulation film, in which one end part of the post is electrically connected to at least a portion of the circuit pattern, pressing an insulator on the surface of the insulation film, in which the circuit pattern and the post are buried in the insulator, selectively etching the insulator such that the other end part of the post is exposed, and opening a portion of the insulation film such that at least a portion of the bonding pad is exposed.

Abstract: A touch sensor includes a transparent substrate, and an electrode pattern formed on the transparent substrate. The electrode pattern is formed by stacking at least two or more electrode layers, thereby enhancing the anti-corrosion and visibility of electrode patterns and ensuring the adhesive reliability of the transparent substrate and the electrode patterns.

Abstract: Disclosed herein are a touch panel and a fabricating method thereof. In the touch panel according to an embodiment of the present invention, a noise shielding layer may be separately formed between a transparent substrate and an electrode pattern, thereby shielding noise that occur from a display coupled to the touch panel. In addition, through a bridge electrode pattern formed by patterning the noise shielding layer and a bridge insulating pattern patterned on an insulating layer formed on the noise shielding layer, a first electrode pattern and a second electrode pattern may be formed on the same plane of the transparent substrate so as to intersect with each other, thereby ensuring reliability of electrical connection between each electrode pattern.

Abstract: Disclosed herein is a touch panel including a transparent substrate and an electrode formed on the transparent substrate and an electrode having light transmittance of 5 to 50%, wherein as the electrode has high light transmittance, such that it is possible to solve a defective problem of visibility of the touch panel due to the opacity and specular phenomenon of the electrode.

Abstract: A method of manufacturing a ball grid array substrate includes: forming a first circuit pattern and a second circuit pattern on a first metal carrier and a second metal carrier, respectively; stacking a first insulating layer and a second insulating layer with a separable material interposed therebetween, wherein each of the first and second insulating layers has first and second surfaces opposing each other, and the first surface contacts the separable material; burying the first and second circuit patterns in the second surfaces of the first and second insulating layers, respectively; removing the first and second metal carriers; removing the separable material to separate the first and second insulating layers from each other; and forming an opening in each of the first and second insulating layers to connect the first and second surfaces with each other. The method may also be part of a process for manufacturing a semiconductor package.

Abstract: Provided is a ball grid array substrate, a semiconductor chip package, and a method of manufacturing the same. The ball grid array substrate includes an insulating layer having a first surface providing a mounting region for a semiconductor chip, a second surface opposing the first surface, and an opening connecting the second surface with the mounting region of the semiconductor chip, and a circuit pattern buried in the second surface. Since the ball grid array substrate is manufactured by a method of stacking two insulating layers, existing devices can be used, and the ball grid array substrate can be manufactured as an ultra thin plate. In addition, since the circuit pattern is buried in the insulating layer, a high-density circuit pattern can be formed.

Abstract: A single-layer board on chip package substrate and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the single-layer board on chip package substrate includes an insulator, a circuit pattern and a flip-chip bonding pad, which are formed on an upper surface of the insulator, a conductive bump, which is in contact with a lower surface of the circuit pattern and penetrates through the insulator, a solder resist layer, which is formed on the upper surface of the insulator such that at least a portion of the flip-chip bonding pad is exposed, and a flip-chip bonding bump, which is formed on an upper surface of the flip-chip bonding pad in order to make a flip-chip connection with an electronic component.

Abstract: A single layered printed circuit board and a method of manufacturing the same are disclosed. In accordance with an embodiment of the present invention, the method can include forming a bonding pad, a circuit pattern and a post on a surface of an insulation film, in which one end part of the post is electrically connected to at least a portion of the circuit pattern, pressing an insulator on the surface of the insulation film, in which the circuit pattern and the post are buried in the insulator, selectively etching the insulator such that the other end part of the post is exposed, and opening a portion of the insulation film such that at least a portion of the bonding pad is exposed.

Abstract: A single-layer board on chip package substrate and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the single-layer board on chip package substrate includes an insulator, a circuit pattern and a flip-chip bonding pad, which are formed on an upper surface of the insulator, a conductive bump, which is in contact with a lower surface of the circuit pattern and penetrates through the insulator, a solder resist layer, which is formed on the upper surface of the insulator such that at least a portion of the flip-chip bonding pad is exposed, and a flip-chip bonding bump, which is formed on an upper surface of the flip-chip bonding pad in order to make a flip-chip connection with an electronic component.

Abstract: A method of manufacturing a printed circuit board having a bump is disclosed. The method includes preparing a first carrier having a first circuit formed thereon, compressing the first carrier to one surface of an insulation layer such that the first circuit is buried, stacking an etching resist on the first carrier in accordance with where the bump is to be formed and forming the bump by etching the first carrier. In accordance with an embodiment of the present invention, the difference in height between a bump and its adjacent bump in a printed circuit board can be reduced, and thus electrical connection between an electronic component and the printed circuit board can be better implemented.

Abstract: Provided is a ball grid array substrate, a semiconductor chip package, and a method of manufacturing the same. The ball grid array substrate includes an insulating layer having a first surface providing a mounting region for a semiconductor chip, a second surface opposing the first surface, and an opening connecting the second surface with the mounting region of the semiconductor chip, and a circuit pattern buried in the second surface. Since the ball grid array substrate is manufactured by a method of stacking two insulating layers, existing devices can be used, and the ball grid array substrate can be manufactured as an ultra thin plate. In addition, since the circuit pattern is buried in the insulating layer, a high-density circuit pattern can be formed.