Abstract: A plug connector according to the present invention is slidably inserted into a receptacle connector, and includes a signal pin having one side in electrical contact with one side of a signal line of a cable; a shield can electrically spaced apart from the signal pin and surrounding the signal pin such that a lower surface of the other side of the signal pin is exposed; a first insulating member coupled to the signal pin to insulate the signal pin and the shield can from each other; and a plug shell surrounding the shield can such that the lower surface of the other side of the signal pin is exposed.

Abstract: A method for fabricating a semiconductor device includes forming a low-k dielectric layer, forming a pattern by etching the low-k dielectric layer, and implanting a carbon-containing material into a surface of the pattern.

Abstract: A display device includes a fingerprint sensor including a first layer having at least one photo sensor to generate a fingerprint image corresponding to reflected light from a fingerprint contact surface, light emitting elements to transmit light reflected by the fingerprint, and a second layer including pin holes to allow reflected light to be incident upon the at least one photo sensor; and fingerprint detector to receive the fingerprint image from the fingerprint sensor, to extract a first image corresponding to a first region of the fingerprint and a second image corresponding to a second region of the fingerprint, to compare the first and second images to determine similarity, and to perform fingerprint authentication, based on similarity determination, where the fingerprint first region is in contact with the fingerprint contact surface and the fingerprint second region is not in contact with the fingerprint contact surface.

Abstract: An electronic apparatus is provided. The electronic apparatus includes a camera, a storage, and a processor configured to store an image photographed by the camera and metadata of the image in the storage, the processor is further configured to identify whether first information related to the image is obtainable, based on the first information not being obtainable, generate metadata related to the first information based on second information, and store the generated metadata as metadata of the image.

Abstract: A display device and an operating method thereof are provided. The display device may include: a display; a camera; a memory configured to store one or more instructions; and a processor configured to execute the instructions to obtain an image captured by the camera, transform the image based on visual condition information of a user, the visual condition information including information about a type of visual impairment of the user, and display the transformed image on the display.

Abstract: A fingerprint recognition device including: a sensing panel including a plurality of sensing blocks, wherein each of the sensing blocks includes a plurality of sensors; a scan driving unit configured to provide a scan signal to the sensors; and a timing controller configured to provide a second initiation signal to the scan driving unit, wherein each of the sensors includes a reference capacitor and a sensing capacitor, the scan driving unit includes scan drivers that correspond to rows of the sensing blocks, in a fingerprint recognition mode, the timing controller provides the second initiation signal to a scan driver corresponding to a sensing block where a touch input is generated, and in a touch mode, the timing controller sequentially provides the second initiation signal to the scan drivers.

Abstract: Disclosed are a transmission line using a nanostructured material and a method of manufacturing the transmission line. The transmission line includes a first nanoflon layer formed of nanoflon, above which a first coating layer formed of an insulating material is formed, and below which a second coating layer formed of an insulating material is formed, a first pattern formed by a first conductive layer formed on the first coating layer, and a first ground layer formed below the second coating layer.

Abstract: A display device includes a light sensing array layer (LSAL), a substrate, a selective light transmission layer (SLTL), a pixel circuit layer (PCL), a display element layer (DEL), and pixels. The LSAL includes an optical sensor to sense incident light. The substrate is on the LSAL and includes a display area (DA) including pixel areas (PAs), and a non-DA adjacent to the DA. The SLTL is disposed on the substrate and includes through-holes to form a path of light onto the optical sensor, and a light-blocking conductive pattern (LBCP) between the through-holes. The PCL is disposed on the SLTL and includes a conductive layer and an insulation layer. The DEL is disposed on the PCL and emits light. Each pixel includes a pixel circuit disposed on the PCL, and a light emitting element on the DEL in a corresponding pixel area. The LBCP is electrically connected to the conductive layer.

Abstract: A foam made of a specific material having superior properties and cosmetic products including the foam are disclosed.

Abstract: An apparatus for cold-shaping a glass sheet that includes: a plurality of vacuum chucks configured within a moveable table; a first automated pick mechanism proximate the table; an automated dispensing mechanism proximate the table; and a pressing apparatus. The first pick mechanism is configured to shape a glass sheet onto one of the chucks. The dispensing mechanism is configured to dispense a curable adhesive onto the glass sheet or a frame. One of the first pick mechanism and the dispensing mechanism is configured to position the frame onto the glass sheet such that the adhesive is disposed between the glass sheet and the frame. The pressing apparatus is configured to press the frame and the adhesive onto the glass sheet to define a finished glass sheet assembly. The glass sheet is bendable at ambient temperature. Methods for cold-shaping a glass sheet are also included in the disclosure.

Abstract: A semiconductor device includes a first semiconductor chip having a first bonding layer and a second semiconductor chip stacked on the first semiconductor chip and having a second bonding layer. The first bonding layer includes a first bonding pad, a plurality of first internal vias, and a first interconnection connecting the first bonding pad and the plurality of first internal vias. The second bonding layer includes a second bonding pad bonded to the first bonding pad. An upper surface of the first interconnection and an upper surface of the first bonding pad are coplanar with an upper surface of the first bonding layer. The first interconnection is electrically connected to the plurality of different first internal lines through the plurality of first internal vias.

Abstract: A compact connector for transmitting super-high-frequency signals is adapted to connect a printed circuit board (PCB) to a single or multiple high-frequency signal lines transmitting super-high frequency signals therethrough. The compact connector includes: a male connector connected to the single or multiple super-high frequency signal lines and including a male connector housing receiving, securing, and protecting terminals of the single or multiple super-high frequency signal lines; and a connector socket mounted on the PCB and receiving the male connector housing fastened to the male connector, wherein the super high-frequency signal line terminals in the male connector are brought into direct contact with and connected to signal line terminal pads formed on the printed circuit board, respectively.

Abstract: A scan driver includes a plurality of stages. An nth (n is a natural number) stage among the stages includes: a first and a second input circuit for controlling a voltage of a first node in response to a carry signal of a previous stage and a next stage, respectively; a first output circuit for outputting an nth carry signal corresponding to a carry clock signal in response to the voltage of the first node; a second output circuit for outputting an nth scan and an nth sensing signal corresponding to a scan and a sensing clock signal, respectively, in response to the voltage of the first node; and a sampling circuit for storing the carry signal of the previous stage in response to a first select signal, and for supplying a control voltage to the first node in response to a second select signal and the stored carry signal.

Abstract: Provided is a device including: a controller configured to obtain illumination information about illumination around the device, determine, based on the illumination information, a thickness of an outline of an object included in content reproduced by the device, and perform image processing on the content such that the outline of the object is represented as having the determined thickness; and a display displaying the content on which the image processing is performed.

Abstract: A semiconductor device includes a device isolation layer defining first and second active regions, a buried contact connected to the second active region, and first and second bit line structures disposed on the first and second active regions. Each of the first and second bit line structures comprises a bit line contact part and a bit line pass part. The bit line contact part is electrically connected to the first active region. The bit line pass part is disposed on the device isolation layer. A height of a lowest part of the buried contact is smaller than a height of a lowest part of the bit line pass part. The height of the lowest part of the buried contact is greater than a height of a lowest part of the bit line contact part. A lower end of the bit line pass part is buried in the second active region.

Abstract: Disclosed is a coaxial cable male connector for transmitting super-high frequency signals, which is used in a coaxial cable connector for transmitting super-high frequency signals and is received in a connector socket mounted on a printed circuit board (PCB) to connect multiple coaxial cables to the PCB. The coaxial cable male connector includes: a single or multiple coaxial cables each including an inner conductor, an outer conductor, a dielectric, and a sheath, wherein the outer conductor, the dielectric, and the sheath are partially stripped to expose the inner conductor over a predetermined length, and a terminal of the exposed inner conductor is brought into electrical connect with a signal line terminal pad formed on the PCB; and a shielding can receiving the exposed inner conductors of the single or multiple coaxial cables, securing and protecting ends of the exposed inner conductors, and blocking electromagnetic waves generated from the inner conductors.

Abstract: A fingerprint recognition device including: a sensing panel including a plurality of sensing blocks, wherein each of the sensing blocks includes a plurality of sensors; a scan driving unit configured to provide a scan signal to the sensors; and a timing controller configured to provide a second initiation signal to the scan driving unit, wherein each of the sensors includes a reference capacitor and a sensing capacitor, the scan driving unit includes scan drivers that correspond to rows of the sensing blocks, in a fingerprint recognition mode, the timing controller provides the second initiation signal to a scan driver corresponding to a sensing block where a touch input is generated, and in a touch mode, the timing controller sequentially provides the second initiation signal to the scan drivers.

Abstract: Disclosed is a method of manufacturing a transmission line using a nanostructured material. The method includes locating a first insulating layer above a first nanoflon layer including nanoflon, forming a first conductive layer above the first insulating layer, forming a first pattern, which transmits and receives a signal, by etching the first conductive layer, and locating a first ground layer below the first nanoflon layer. Here, the nanoflon is a nanostructured material formed by electrospinning a liquid resin at a high voltage.

Abstract: A substrate processing apparatus including a process chamber; a susceptor in the process chamber; and an inner edge ring and an outer edge ring on the susceptor, wherein the inner edge ring includes a semiconductor, the outer edge ring includes an insulator, an upper surface of the outer edge ring is at a higher level than an upper surface of the inner edge ring, and the outer edge ring has an overhang extending onto the inner edge ring.