Patents by Inventor Nam-Kyu BAEK

Nam-Kyu BAEK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20150333018
    Abstract: A semiconductor package may include a package substrate, an MRAM chip, a first magnetic shielding film and a second magnetic shielding film. The MRAM chip may be arranged over the package substrate. The MRAM chip may be electrically connected with the package substrate. The first magnetic shielding film may attach the MRAM chip to the package substrate. The first magnetic shielding film may shield magnetic interference between the MRAM chip and the package substrate. The second magnetic shielding film may be arranged over the MRAM chip to shield magnetic interference at an upper region over the MRAM chip. Thus, the magnetic shielding layer may be arranged between the bonding pads of the MRAM chip so that magnetic interference between the bonding pads may be suppressed.
    Type: Application
    Filed: December 30, 2014
    Publication date: November 19, 2015
    Inventors: Dong-Kwan KIM, Hee-Jeong KIM, Nam-Kyu BAEK