Abstract: Provided is a coating film having excellent durability and wear resistance, and utility as mold surface release coating. The coating film has excellent releasability (non-adhesiveness) over a long period of time. Further provided is a coating composition capable of forming such a coating film, the coating composition containing a fluoropolymer and an oil that is a liquid at 25° C., wherein the decomposition temperature of the oil is higher than the melting point of the fluoropolymer.

Abstract: An object of the present invention is to provide a hot-melt fluorine resin powder coating composition containing a filler, which has a large film thickness that can be coated once, a large limit film thickness for an overcoating, and can be thickly coated. The present invention is a powder coating composition, which is a powder mixture, containing: first hot-melt fluorine resin particles having an average particle diameter of 2 to 100 ?m in which a filler is dispersed in the particles; second hot-melt fluorine resin particles having an average particle diameter of 10 to 200 ?m; and charge controlling agent particles.

Abstract: Provided is a melt molding manufacturing method wherein the mold exhibits excellent molded product releasability over a long period of time, and that can produce a molded product having a matte surface with suppressed surface gloss. The molding manufacturing method for manufacturing the molded product involves forming the melt molded product in a mold having a coating on the surface of the mold, wherein the coating is a layer of fluororesin having dispersed therein oil and filler having an average particle size of 300 nm or less.

Abstract: This application provides a coating film having excellent durability and wear resistance that, when applied to a mold surface, has excellent releasability (non-adhesiveness) over a long period of time, and a fluoropolymer coating composition that is able to form such a coating film. The fluoropolymer coating composition contains a fluoropolymer and a fluoro oil, where the decomposition temperature of the fluoro oil is higher than the melting point of the fluoropolymer.

Abstract: The present invention proposes a method of industrial composite manufacturing. The method combines the resin transferring molding method with vacuum process and compression process in appropriate orders for achieving high quality products. In the curing process, microwaves are used to harden the plastic resin in the mold. Specifically, the main steps of the method are following: step 1: preparation of materials and equipment; Step 2: Disposition of the reinforced fibers/fabrics and mold closing at the extend position; Step 3: Vacuum and transfer plastic resin into the mold; Step 4: Mold closing by compression pressure; Step 5: Plastic resin curing by using a microwave system; Step 6: Open the mold and take the composite product.

Abstract: Methods of manufacturing high-temperature composite materials using carbon nanotube to improve the efficiency of insulation applied to propulsion systems for aerospace equipment including 5 steps: step 1: select necessary materials and equipment, step 2: disperse MW-CNTs in the polar solution, step 3: distribute MW-CNTs evenly in the resin, step 4: eliminate residual solvents, step 5: curing phenolic resin composites.

Abstract: Provided is a coating film having excellent durability and wear resistance, and utility as mold surface release coating. The coating film has excellent releasability (non-adhesiveness) over a long period of time. Further provided is a coating composition capable of forming such a coating film, the coating composition containing a fluoropolymer and an oil that is a liquid at 25° C., wherein the decomposition temperature of the oil is higher than the melting point of the fluoropolymer.

Abstract: The air eliminator valve helps to eliminate air in the plastic resin used for composite products manufacturing. During operation, it continuously eliminates the air bubbles in the plastic resin running through the valve, and then transfers the filtered plastic resin into the mold. The design of the air eliminator valve consists of: inlet, inlet lock, air vent, upper cover, main body, ultrasonic generator, outlet lock and outlet. In which, the ultrasonic generator plays a role in generating ultrasonic waves to the plastic resin in the valve body that allows speeding up the air releasing process out the plastic resin. The air content in the valve could go out through the air vent on the upper cover, its status “open/close” is controlled by airlock with automatic response mechanism.

Abstract: An object of the present invention is to provide a heat shrink tube excellent in peelability and transparency, and a method for producing the heat shrink tube. The present invention provides a peelable heat shrink tube comprising a composition containing a melt-processable fluororesin and PTFE, the PTFE lacking a heat history of its melting point or higher after polymerization and having a specific gravity, as measured according to ASTM D4894, of 2.20 or less. The content of the PTFE is 0.05 to 3.0 wt % based on the total weight of the melt-processable fluororesin and the PTFE. The present invention also provides a method for producing the tube which comprises melt-extruding the composition at a temperature lower than the melting point of the PTFE.

Abstract: Methods of manufacturing high-temperature composite materials using carbon nanotube to improve the efficiency of insulation applied to propulsion systems for aerospace equipment including 5 steps: step 1: Select necessary materials and equipment, step 2: disperse MW-CNTs in the polar solution, step 3: distribute MW-CNTs evenly in the resin, step 4: eliminate residual solvents, step 5: curing phenolic resin composites.

Abstract: The present invention proposes a method of industrial composite manufacturing. The method combines the resin transferring molding method with vacuum process and compression process in appropriate orders for achieving high quality products. In the curing process, microwaves are used to harden the plastic resin in the mold. Specifically, the main steps of the method are following: step 1: preparation of materials and equipment; Step 2: Disposition of the reinforced fibers/fabrics and mold closing at the extend position; Step 3: Vacuum and transfer plastic resin into the mold; Step 4: Mold closing by compression pressure; Step 5: Plastic resin curing by using a microwave system; Step 6: Open the mold and take the composite product.

Abstract: An object of the present invention is to provide a heat shrink tube excellent in peelability and transparency, and a method for producing the heat shrink tube. The present invention provides a peelable heat shrink tube comprising a composition containing a melt-processable fluororesin and PTFE, the PTFE lacking a heat history of its melting point or higher after polymerization and having a specific gravity, as measured according to ASTM D4894, of 2.20 or less. The content of the PTFE is 0.05 to 3.0 wt % based on the total weight of the melt-processable fluororesin and the PTFE. The present invention also provides a method for producing the tube which comprises melt-extruding the composition at a temperature lower than the melting point of the PTFE.

Abstract: This application provides a coating film having excellent durability and wear resistance that, when applied to a mold surface, has excellent releasability (non-adhesiveness) over a long period of time, and a fluoropolymer coating composition that is able to form such a coating film. The fluoropolymer coating composition contains a fluoropolymer and a fluoro oil, where the decomposition temperature of the fluoro oil is higher than the melting point of the fluoropolymer.

Abstract: A method of growing III-N semiconducting material on a silicon substrate including the steps of growing a layer of epitaxial rare earth oxide on a single crystal silicon substrate and modifying the surface of the layer of epitaxial rare earth oxide with nitrogen plasma. The method further includes the steps of growing a layer of low temperature epitaxial gallium nitride on the modified surface of the layer of epitaxial rare earth oxide and growing a layer of bulk epitaxial III-N semiconductive material on the layer of low temperature epitaxial gallium nitride.

Abstract: A method of growing III-N semiconducting material on a silicon substrate including the steps of growing a layer of epitaxial rare earth oxide on a single crystal silicon substrate and modifying the surface of the layer of epitaxial rare earth oxide with nitrogen plasma. The method further includes the steps of growing a layer of low temperature epitaxial gallium nitride on the modified surface of the layer of epitaxial rare earth oxide and growing a layer of bulk epitaxial III-N semiconductive material on the layer of low temperature epitaxial gallium nitride.

Abstract: A method of growing III-N semiconducting material on a silicon substrate including the steps of growing a layer of epitaxial rare earth oxide on a single crystal silicon substrate and modifying the surface of the layer of epitaxial rare earth oxide with nitrogen plasma. The method further includes the steps of growing a layer of low temperature epitaxial gallium nitride on the modified surface of the layer of epitaxial rare earth oxide and growing a layer of bulk epitaxial III-N semiconductive material on the layer of low temperature epitaxial gallium nitride.

Abstract: A method of growing III-N material on a silicon substrate including the steps of epitaxially growing a buffer layer of REO material on a silicon substrate, epitaxially growing a layer of REN material on the surface of the buffer, and epitaxially growing a thin protective layer of REO on the surface of the REN material layer. The substrate and structure can then be conveniently transferred to another growth machine in which are performed the steps of transforming or modifying in-situ the REO protective layer to a REN layer with a nitrogen treatment and epitaxially growing a layer of III-N material on the modified protective layer.

Abstract: Provide are fluororesin and silica compositions having a low coefficient of thermal expansion. The fluororesin compositions include 20 to 70 wt % of a melt-processible fluororesin and 80 to 30 wt % of silica particles. The silica particles are constituted by leafy silica secondary particles formed as a result of a parallel overlap of a plurality of scaly silica primary particles, or flower petal-shaped tertiary particles formed as a result of the aggregation of the leafy silica secondary particles, or mixtures thereof. The thickness of the scaly silica primary particle is 0.001 to 0.1 ?m, the thickness of the leafy silica secondary particles is 0.001 to 3 ?m, and the ratio of the length of the leafy silica secondary particle with respect to their thickness is 2 to 300.

Abstract: III-N material grown on a buffer on a substrate that includes one of a single crystal silicon or a single crystal sapphire. A buffer of single crystal alloy, including one of ErxAl1-xN or (RE1yRE21-y)xAl1-xN, is positioned on the substrate. A layer of single crystal III-N material is positioned on the surface of the buffer and the single crystal alloy has a lattice constant substantially crystal lattice matched to the layer of single crystal III-N material. When the III-N material is GaN, the x in the formula for the alloy varies from less than 1 adjacent the substrate to greater than or equal to 0.249 adjacent the layer of single crystal GaN.

Abstract: Provided is a thermoplastic resin composition having excellent thermal conductivity and high electrical insulating properties, and having excellent flexibility in comparison to ceramic molded bodies and thermoset resin compositions. The resin composition contains 20-60 volume percent of thermoplastic resin and 40-80 volume percent of boron nitride. The boron nitride is made up of spherical boron nitride particles and flat boron nitride particles. The spherical boron nitride particles have average particle size of 50-300 ?m and aspect ratio or 1-2. The flat boron nitride particles have average particle size of 8-100 ?m and aspect ratio of 30-300. The volume ratio of the spherical boron nitride particles with respect to the total amount of boron nitride is 75 vol %-99 vol %. Further provided are melt molded products of this thermoplastic resin composition and a method for the manufacture of such melt molded products.