Patents by Inventor Nam-Seong Kim
Nam-Seong Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240120847Abstract: A voltage regulator having a multiple of main stages and at least one accelerated voltage regulator (AVR) bridge is provided. The main stages may respond to low frequency current transients and provide DC output voltage regulation. The AVR bridges are switched much faster than the main stages and respond to high frequency current transients without regulating the DC output voltage. The AVR bridge frequency response range can overlap with the main stage frequency response range, and the lowest frequency to which the AVR bridges respond may be set lower than the highest frequency to which the main stages respond.Type: ApplicationFiled: October 6, 2022Publication date: April 11, 2024Inventors: Shuai Jiang, Xin Li, Woon-Seong Kwon, Cheng Chung Yang, Qiong Wang, Nam Hoon Kim, Mikhail Popovich, Houle Gan, Chenhao Nan
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Publication number: 20240096859Abstract: A microelectronic system may include a microelectronic component having electrically conductive elements exposed at a first surface thereof, a socket mounted to a first surface of the microelectronic component and including a substrate embedded therein, one or more microelectronic elements each having active semiconductor devices therein and each having element contacts exposed at a front face thereof, and a plurality of socket pins mounted to and extending above the substrate, the socket pins being ground shielded coaxial socket pins. The one or more microelectronic elements may be disposed at least partially within a recess defined within the socket. The socket may have a land grid array comprising top surfaces of the plurality of the socket pins or electrically conductive pads mounted to corresponding ones of the socket pins, and the element contacts of the one or more microelectronic elements may be pressed into contact with the land grid array.Type: ApplicationFiled: November 23, 2022Publication date: March 21, 2024Inventors: Nam Hoon Kim, Jaesik Lee, Woon-Seong Kwon, Teckgyu Kang
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Patent number: 11699676Abstract: Provided is a multi-beam laser debonding apparatus for debonding an electronic component from a substrate, the apparatus including: a first laser module to emit a first laser beam to a predetermined range of a first substrate area including attachment positions of a debonding target electronic component and a neighboring electronic component to thereby heat a solder of the electronic components to reach a predetermined pre-heat temperature; and a second laser module to emit a second laser beam overlapping the first laser beam to a second substrate area smaller than the first substrate area, the second substrate area including the attachment position of the debonding target electronic component to thereby heat the solder of the debonding target electronic component to reach a debonding temperature at which the solder commences melting.Type: GrantFiled: October 9, 2019Date of Patent: July 11, 2023Assignee: LASERSSEL CO., LTD.Inventors: Jae-Joon Choi, Nam-Seong Kim, Byung-Roc Kim, Jong-Jae Yoo, Boo-Seong Park
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Publication number: 20220157768Abstract: Provided is a laser reflow apparatus for reflowing electronic components on a substrate disposed on a stage, the apparatus including: a laser emission unit comprised of a plurality of laser modules for emitting a laser beam having a flat top output profile in at least one section of the substrate on which the electronic components are disposed; a camera unit comprising at least one camera module for capturing a reflowing process of the electronic components performed by the laser beam; and a laser output control unit configured to generate a control signal for independently controlling the respective laser modules of the laser emission unit based on a signal output from the camera unit and apply the control signal to the laser emission unit.Type: ApplicationFiled: February 7, 2022Publication date: May 19, 2022Inventors: Nam Seong KIM, Jae Joon CHOI
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Patent number: 11276665Abstract: Provided is a laser reflow apparatus for reflowing electronic components on a substrate disposed on a stage, the apparatus including: a laser emission unit comprised of a plurality of laser modules for emitting a laser beam having a flat top output profile in at least one section of the substrate on which the electronic components are disposed; a camera unit comprising at least one camera module for capturing a reflowing process of the electronic components performed by the laser beam; and a laser output control unit configured to generate a control signal for independently controlling the respective laser modules of the laser emission unit based on a signal output from the camera unit and apply the control signal to the laser emission unit.Type: GrantFiled: August 21, 2019Date of Patent: March 15, 2022Assignee: LASERSSEL CO., LTD.Inventors: Nam Seong Kim, Jae Joon Choi
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Patent number: 11213913Abstract: A laser reflow apparatus capable of reducing tact time for a single bonding object, and accelerating an overall bonding process for all of a plurality of bonding objects is provided. The laser reflow apparatus comprises a bonding object transfer unit including a stage, a laser emission unit, a beam transmission plate, and a beam transmission plate transfer unit.Type: GrantFiled: July 12, 2018Date of Patent: January 4, 2022Assignee: LASERSSEL CO., LTD.Inventors: Jae Joon Choi, Byoung Cheol Kim, Byung Roc Kim, Nam Seong Kim
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Publication number: 20210220945Abstract: A laser reflow apparatus capable of reducing tact time for a single bonding object, and accelerating an overall bonding process for all of a plurality of bonding objects is provided. The laser reflow apparatus comprises a bonding object transfer unit including a stage, a laser emission unit, a beam transmission plate, and a beam transmission plate transfer unit.Type: ApplicationFiled: July 12, 2018Publication date: July 22, 2021Inventors: Jae Joon CHOI, Byoung Cheol KIM, Byung Roc KIM, Nam Seong KIM
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Publication number: 20200251442Abstract: Provided is a multi-beam laser debonding apparatus for debonding an electronic component from a substrate, the apparatus including: a first laser module to emit a first laser beam to a predetermined range of a first substrate area including attachment positions of a debonding target electronic component and a neighboring electronic component to thereby heat a solder of the electronic components to reach a predetermined pre-heat temperature; and a second laser module to emit a second laser beam overlapping the first laser beam to a second substrate area smaller than the first substrate area, the second substrate area including the attachment position of the debonding target electronic component to thereby heat the solder of the debonding target electronic component to reach a debonding temperature at which the solder commences melting.Type: ApplicationFiled: October 9, 2019Publication date: August 6, 2020Inventors: Jae-Joon CHOI, Nam-Seong KIM, Byung-Roc KIM, Jong-Jae YOO, Boo-Seong PARK
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Publication number: 20200091108Abstract: Provided is a laser reflow apparatus for reflowing electronic components on a substrate disposed on a stage, the apparatus including: a laser emission unit comprised of a plurality of laser modules for emitting a laser beam having a flat top output profile in at least one section of the substrate on which the electronic components are disposed; a camera unit comprising at least one camera module for capturing a reflowing process of the electronic components performed by the laser beam; and a laser output control unit configured to generate a control signal for independently controlling the respective laser modules of the laser emission unit based on a signal output from the camera unit and apply the control signal to the laser emission unit.Type: ApplicationFiled: August 21, 2019Publication date: March 19, 2020Inventors: Nam Seong KIM, Jae Joon CHOI
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Patent number: 10554009Abstract: A highly efficient laser ignition device is provided. The highly efficient laser ignition device fundamentally includes: a pumping light source adopting a multi-chip single emitter-packaged optical fiber output laser diode; a laser medium to which ytterbium is added; and a saturated absorber as a passive Q-switch medium, wherein a pulse of 100-999 ps as the passive Q-switch laser output can be obtained. According to the disclosed, the problems of high cost/low efficiency/low reliance/non-uniformity, which are disadvantages for replacing an ignition device using an electric spark with a laser ignition device, can be solved.Type: GrantFiled: January 12, 2016Date of Patent: February 4, 2020Assignees: FIBERO INC.Inventor: Nam Seong Kim
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Publication number: 20180013257Abstract: A highly efficient laser ignition device is provided. The highly efficient laser ignition device fundamentally includes: a pumping light source adopting a multi-chip single emitter-packaged optical fiber output laser diode; a laser medium to which ytterbium is added; and a saturated absorber as a passive Q-switch medium, wherein a pulse of 100-999 ps as the passive Q-switch laser output can be obtained. According to the disclosed, the problems of high cost/low efficiency/low reliance/non-uniformity, which are disadvantages for replacing an ignition device using an electric spark with a laser ignition device, can be solved.Type: ApplicationFiled: January 12, 2016Publication date: January 11, 2018Inventor: NAM SEONG KIM
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Publication number: 20090121323Abstract: A semiconductor device and a method of fabricating the same. The semiconductor device includes a semiconductor substrate including an active surface and an inactive surface which faces the active surface, a device isolation layer and a pad stacked on the active surface; and a through electrode disposed in a first via hole and a second via hole and including a protruding part that protrudes from the pad, the first via hole penetrating the semiconductor substrate, the second via hole penetrating the device insulation layer and the pad continuously, wherein at least a surface of the protruding part of the through electrode is formed of an oxidation resistance-conductive material.Type: ApplicationFiled: November 7, 2008Publication date: May 14, 2009Applicant: Samsung Electronics Co., LtdInventors: Yong-Chai KWON, Nam-Seong KIM
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Patent number: 5675596Abstract: The present invention relates to a passively Q-switched laser with a dual-cavity configuration to obtain a symmetrical laser pulse with a short and variable pulse width. The passively Q-switched laser comprises: a laser medium and a passively Q-switching medium; a cavity mirror capable of fully reflecting the respective wavelengths emitted from the laser medium and the passively Q-switching medium; a main cavity mirror composed of a dichroic mirror having non-reflective characteristics for the light emitted from the passively Q-switching medium and reflective characteristics for the light emitted from the laser medium with a reflectivity of 10% or more; and, an auxiliary cavity mirror composed of a dichroic mirror having non-reflective characteristics for the light emitted from the laser medium and reflective characteristics for the light emitted from the passively Q-switching medium with a reflectivity of 10% or more and capable of moving transversely against the laser beam.Type: GrantFiled: February 22, 1996Date of Patent: October 7, 1997Assignee: Korea Advanced Institute of Science and TechnologyInventors: Hong-Jin Kong, Nam-Seong Kim