Abstract: Proposed is a compound represented by Formula 1, where R1 is an alkyl group having 9 to 30 carbon atoms, an alkenyl group having 9 to 30 carbon atoms, or an alkynyl group having 9 to 30 carbon atoms, R2 is hydrogen, an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, or an alkynyl group having 2 to 10 carbon atoms, and R3 to R5 are each independently hydrogen, an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, or an alkynyl group having 2 to 10 carbon atoms. Alternatively, at least two of R3 to R5 are bonded together to form a hydrocarbon ring having 5 or 6 carbon atoms. In addition, proposed are a lube base oil and a lubricant composition comprising the compound.

Abstract: A semiconductor manufacturing equipment may include a process chamber for treating a substrate; a front-end module including a first transfer robot, wherein the first transfer robot may be configured to transport the substrate received in a container; a transfer chamber between the front-end module and the process chamber, wherein the transfer chamber may be configured to load or unload the substrate into or out of the process chamber; and a cassette capable of receiving a replaceable component capable of being used in the process chamber. The front-end module may include a seat plate configured to move in a sliding manner so as to retract or extend into or from the front-end module. The cassette may be configured to be loaded into the front-end module while the cassette is seated on the seat plate.

Abstract: The present invention relates to a novel compound exhibiting anti-inflammatory activity, and the compound of the present invention plays a key role in the generation of pro-inflammatory cytokines, thereby having excellent inhibitory activity against p38 MAPK, which is known to cause inflammatory diseases, and thus can be effectively used as an agent for treating inflammatory diseases.

Abstract: Disclosed here is an air conditioner and the control method thereof comprising an outdoor unit having an outdoor heat exchanger for the heat exchanging of the outdoor air and refrigerant; at least one indoor unit corresponding to the outdoor unit and having indoor heat exchanger for the heat exchanging of the room air and refrigerant; an expansion valve installed on the refrigerant pipe connecting the outdoor heat exchanger and the indoor heat exchanger, and expanding the refrigerant; and a control device controlling the opening speed of the expansion valve in accordance with the operation modes of the indoor unit.

Abstract: A compressor and device for reducing vibration therefor is provided herein. The compressor includes a compression device having a compression chamber, and configured to receive, compress, and output a refrigerant, a drive motor configured to rotate the compression device to compress a refrigerant within the compression chamber, and a torsional vibration absorbing device attached to the motor and configured to absorb torsional vibration.

Abstract: A compressor and device for reducing vibration therefor is provided herein. The compressor includes a compression device having a compression chamber, and configured to receive, compress, and output a refrigerant, a drive motor configured to rotate the compression device to compress a refrigerant within the compression chamber, and a torsional vibration absorbing device attached to the motor and configured to absorb torsional vibration.

Abstract: There is provided a system and method for controlling a temperature of a refrigerant in an air conditioner, in which a supercooling degree and/or a superheating degree can be secured by controlling a difference in refrigerant temperatures of a pipe connecting one or more indoor units to one or more outdoor units, and a flow of a specific refrigerant. The system includes: one or more indoor units; one or more outdoor units; a high-pressure pipe and a low-pressure pipe for connecting the indoor units and the outdoor units; and a refrigerant temperature control unit coupled to the high-pressure pipe and the low-pressure pipe, for performing a heat exchange with respect to flowing refrigerants by coupling an inner pipe to an outer pipe, the inner pipe passing through the another pipe.

Abstract: The stack package includes at least two semiconductor chips disposed up and down. Bonding pads are formed in the respective semiconductor chips along a center line. Inner leads of a first lead frame and a second lead frame are attached to bonding-pad-disposed faces of the respective semiconductor chips. The inner lead of each lead frame is electrically connected to its corresponding bonding pad by means of metal wires. The inner lead of the first lead frame is also electrically connected to the second lead frame by utilizing a conductive adhesive material. A connecting hole is formed in the outer end of the inner lead for better electrical connection when soldered. The entire resultant structure is molded with an epoxy compound so as to expose a connecting part between the first and second lead frames and an outer lead of the second lead frame.

Abstract: Disclosed herewith is a foil journal bearing utilizing a plurality of piezoelectric actuators. The foil journal bearing is provided at an interior surface of its bearing housing with a plurality of foils or a top foil for supporting a rotating shaft. The foil journal bearing includes a plurality of piezoelectric actuator devices embedded in an inside portion of the bearing housing while coming into contact with and supporting the foils or foil to increase stiffness and damping coefficient of the bearing at critical speeds of the rotating shaft. Each of the piezoelectric actuator devices is comprised of a piezoelectric actuator inserted into one of dimples formed on the interior surface of the bearing housing and provided with at least a piezoelectric actuating element and an elastic spring interposed between a bottom of the piezoelectric actuator and a bottom of the dimple, so as to increase stiffness and damping coefficient of the bearing by application of voltage to the piezoelectric actuator.

Abstract: A foil journal bearing utilizes a plurality of piezoelectric actuators to increase the load carrying capacity of the bearing. The foil journal bearing is provided at an interior surface of its bearing housing with a plurality of foils or a top foil for supporting a rotating shaft The foil journal bearing includes a plurality of piezoelectric actuator devices embedded in an inside portion of the bearing housing while coming into contact with and supporting the foils or foil to increase stiffness and damping coefficient of the bearing at critical speeds of the rotating shaft.

Abstract: A foil journal bearing which is provided at an interior surface of the bearing housing with a plurality of foils or one foil for supporting a shaft comprises a plurality of dampers embedded in an inside portion of its bearing housing while coming into contact with and supporting the plurality of foils or the one foil to increase stiffness and damping capacity of the bearing during rotation of said shaft, wherein each of said dampers is comprised of a damper pin inserted into one of dimples formed on the interior surface of the bearing housing and an elastic spring interposed between a bottom of the damper pin and a bottom of the dimple.

Abstract: A hybrid air foil journal bearing in accordance with the present invention, comprising an hybrid air foil journal bearing supporting a shaft by air layer formed between inner surface of the housing thereof and the shaft, wherein said bearing comprising a plurality of key slots formed on the surface of the bearing housing, which are spaced apart from each other at a certain distance, a plurality of hybrid foils formed as a body to have a high stiffness and a high resiliency supporting said shaft, which are correspondingly fixed at said key slots.

Abstract: A foil journal bearing which is provided at an interior surface of the bearing housing with a plurality of foils or one foil for supporting a shaft comprises a plurality of dampers embedded in an inside portion of its bearing housing while coming into contact with and supporting the plurality of foils or the one foil to increase stiffness and damping capacity of the bearing during rotation of said shaft, wherein each of said dampers is comprised of a damper pin inserted into one of dimples formed on the interior surface of the bearing housing and an elastic spring interposed between a bottom of the damper pin and a bottom of the dimple.

Abstract: The present invention relates to a stack package, as well as a method for fabricating the same, the stack package includes at least two semiconductor chips disposed up and down. Bonding pads are formed in the respective semiconductor chips along a center line. Inner leads of a first lead frame and a second lead frame are attached to bonding pad-disposed faces of the respective semiconductor chips. The inner lead of each lead frame is electrically connected to its corresponding bonding pad by means of metal wires. The inner lead of the first lead frame is also electrically connected to the second lead frame. The entire structure is molded with an epoxy compound so as to expose a connecting part between the first and second lead frames and an outer lead of the second lead frame.

Abstract: The present invention relates to a stack package, as well as a method for fabricating the same, the stack package includes at least two semiconductor chips disposed up and down. Bonding pads are formed in the respective semiconductor chips along a center line. Inner leads of a first lead frame and a second lead frame are attached to bonding pad-disposed faces of the respective semiconductor chips. The inner lead of each lead frame is electrically connected to its corresponding bonding pad by means of metal wires. The inner lead of the first lead frame is also electrically connected to the second lead frame. The entire structure is molded with an epoxy compound so as to expose a connecting part between the first and second lead frames and an outer lead of the second lead frame.

Abstract: Disclosed is a stack package. In the stack package, at least two semiconductor chips 40 are disposed up and down. Inner leads 31 of lead frames 30 are attached at a bonding pad-disposed face of the semiconductor chip 40. The inner leads 31 are electrically connected to the bonding pads of the semiconductor chips 40 with metal wires 50. Protruding portions 33,34 are formed at the inner leads 31 toward downside and upside. To expose the respective protruding portions 33,34 and outer leads 32 formed at the lowermost lead frame 30, the respective semiconductor chips 40 are molded with an epoxy compound 60. The respective lead frames 30 are electrically connected by contacting the upwardly or downwardly protruding portions 34, 33 from the respective lead frames.

Abstract: A monitor tilting device capable of tilting the monitor using one hand. In an embodiment, the device comprises a cabinet bottom having a tilting opening at its rear lower surface, a monitor tilting member rotatably downwardly received in the tilting opening, a sliding washer rotatably receiving the upper section of the tilting member, and a torsion spring member elastically supporting the tilting member for supporting a tiled position of the monitor. In another embdiment, the device comprises a bracket integrally formed on the bottom surface of the monitor and a tilting member rotatably engaged with this bracket. In a further embodiment, the device comprises a monitor stand having a sliding depression, a sliding washer slidably coupled to an insert member of the sliding depression, and a bottom surface of the monitor fixedly coupled to the sliding washer.

Abstract: A monitor tilting device capable of tilting the monitor using one hand. In an embodiment, the device comprises a cabinet bottom having a tilting opening at its rear lower surface, a monitor tilting member rotatably downwardly received in the tilting opening, a sliding washer rotatably receiving the upper section of the tilting member, and a torsion spring member elastically supporting the tilting member for supporting a tiled position of the monitor. In another embdiment, the device comprises a bracket integrally formed on the bottom surface of the monitor and a tilting member rotatably engaged with this bracket. In a further embodiment, the device comprises a monitor stand having a sliding depression, a sliding washer slidably coupled to an insert member of the sliding depression, and a bottom surface of the monitor fixedly coupled to the sliding washer.