Patents by Inventor Nam-Sung Kim

Nam-Sung Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240103760
    Abstract: Systems and methods for hardware-based asynchronous logging include: initiating first and second atomic regions on first and second cores of a central processing unit (CPU); and asynchronously logging data for the first atomic region and the second atomic region using the CPU by: asynchronously performing log persist operations (LPOs) to log an old data value from each atomic region; updating the old data value to a new data value from each atomic region; tracking dependencies between the first atomic region and the second atomic region using a memory controller; asynchronously performing data persist operations (DPOs) to persist the new data value for each atomic region; and committing the first atomic region and the second atomic region based on the dependencies using the memory controller of the CPU.
    Type: Application
    Filed: September 27, 2022
    Publication date: March 28, 2024
    Inventors: Ahmed Abulila, Nam Sung Kim, Izzat El Hajj
  • Publication number: 20240086345
    Abstract: A memory device includes a buffer die configured to receive a first broadcast command and a second broadcast command from an external device; and a plurality of core dies stacked on the buffer die. The plurality of core dies include: a first core die including a first processing circuit, a first memory cell array, a first command decoder configured to decode the first broadcast command, and a first data input/output circuit configured to output data of the first memory cell array to a common data input/output bus under control of the first command decoder; and a second core die including a second processing circuit, a second memory cell array, a second command decoder configured to decode the second broadcast command, and a second data input/output circuit configured to receive the data of the first memory cell array through the common data input/output bus under control of the second command decoder.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Applicant: SAMSUNG ELECTRONICS Co., LTD.
    Inventors: Sang-Hyuk KWON, Nam Sung KIM, Kyomin SOHN, Jaeyoun YOUN
  • Publication number: 20240071786
    Abstract: The present disclosure provides substrate heat-treating apparatus including a process chamber in which a flat substrate to be heat treated is placed, the process chamber comprising a beam irradiating plate placed below the flat substrate and an infrared transmitting plate placed above the flat substrate; a beam irradiating module for irradiating a laser beam to a lower surface of the flat substrate through the beam irradiating plate; and a gas circulation cooling module for spraying a cooling gas to an upper surface of the infrared transmitting plate, thereby cooling the infrared transmitting plate.
    Type: Application
    Filed: December 23, 2021
    Publication date: February 29, 2024
    Inventors: Hyoung June Kim, Byung Kuk Kim, Wang Jun Park, Oh Sung Kwon, Jin Hong Lee, Nam Chun Lee
  • Publication number: 20240004419
    Abstract: A computer architecture provides both a parallel memory bus and serial memory bus between a processor system and memory. Latency-tolerant memory access requests are steered to the serial memory bus which operates to increase the available memory bus bandwidth on the parallel memory. The invention also provides integrated circuit computer memory suitable for this application.
    Type: Application
    Filed: August 4, 2023
    Publication date: January 4, 2024
    Inventors: Hao Wang, Nam Sung Kim
  • Patent number: 11860803
    Abstract: A memory device includes a buffer die configured to receive a first broadcast command and a second broadcast command from an external device; and a plurality of core dies stacked on the buffer die. The plurality of core dies include: a first core die including a first processing circuit, a first memory cell array, a first command decoder configured to decode the first broadcast command, and a first data input/output circuit configured to output data of the first memory cell array to a common data input/output bus under control of the first command decoder; and a second core die including a second processing circuit, a second memory cell array, a second command decoder configured to decode the second broadcast command, and a second data input/output circuit configured to receive the data of the first memory cell array through the common data input/output bus under control of the second command decoder.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: January 2, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-Hyuk Kwon, Nam Sung Kim, Kyomin Sohn, Jaeyoun Youn
  • Patent number: 11848369
    Abstract: Embodiments provide methods for forming nanowire structures, such as, for example, horizontal gate-all-around (hGAA) structures. In one embodiment, a method includes selectively etching material from a stack disposed on a material layer located on a substrate with a plasma to create recesses on each of first and second sides of the stack and depositing a dielectric material on the first and second sides. The stack includes repeating pairs of first and second layers. The method also includes removing the dielectric material from the first and second sides, where the dielectric material remains in the recesses of the first and second sides, and selectively depositing a stressor layer on regions of the first and second sides which are unprotected by the dielectric material to form gaps between the stressor layer and the dielectric material remaining in the recesses of the first and second sides.
    Type: Grant
    Filed: February 16, 2022
    Date of Patent: December 19, 2023
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Shiyu Sun, Nam Sung Kim, Bingxi Sun Wood, Naomi Yoshida, Sheng-Chin Kung, Miao Jin
  • Publication number: 20230333852
    Abstract: A dataflow-based general-purpose processor architecture and its method are disclosed. A circuit for the dataflow-based general-purpose processor architecture includes multiple processing elements (PEs) corresponding to multiple assigned central processing unit (CPU) instructions in program order, a register file, and multiple feedforward register lanes configured to map each of the multiple assigned CPU instructions on the multiple PEs to the register file or another PE of the multiple PEs to construct a hardware datapath corresponding to a dataflow graph of the multiple assigned CPU instructions. Other aspects, embodiments, and features are also claimed and described.
    Type: Application
    Filed: April 17, 2023
    Publication date: October 19, 2023
    Inventors: Nam Sung Kim, Dong Kai Wang
  • Patent number: 11763876
    Abstract: A memory device includes a memory cell array including a plurality of banks each including a plurality of memory cells connected to a plurality of word lines, and a row decoder block connected to the plurality of banks. In a first operation mode, the row decoder block receives a first row address and a first bank address together with an activation command and activates a word line selected by the first row address from among the plurality of word lines of a bank selected by the first bank address from among the plurality of banks. In a second operation mode, the row decoder block receives a second row address and a second bank address together with the activation command and activates a word line selected by the second row address from among the plurality of word lines of each of at least two banks of the plurality of banks.
    Type: Grant
    Filed: September 15, 2021
    Date of Patent: September 19, 2023
    Inventors: Sang-Hyuk Kwon, Nam Sung Kim, Kyomin Sohn, Seongil O, Haesuk Lee
  • Patent number: 11755060
    Abstract: A computer architecture provides both a parallel memory bus and serial memory bus between a processor system and memory. Latency-tolerant memory access requests are steered to the serial memory bus which operates to increase the available memory bus bandwidth on the parallel memory. The invention also provides integrated circuit computer memory suitable for this application.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: September 12, 2023
    Assignee: Wisconsin Alumni Research Foundation
    Inventors: Hao Wang, Nam Sung Kim
  • Patent number: 11620504
    Abstract: A neuromorphic device includes a memory cell array that includes first memory cells corresponding to a first address and storing first weights and second memory cells corresponding to a second address and storing second weights, and a neuron circuit that includes an integrator summing first read signals from the first memory cells and an activation circuit outputting a first activation signal based on a first sum signal of the first read signals output from the integrator.
    Type: Grant
    Filed: June 4, 2020
    Date of Patent: April 4, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hak-Soo Yu, Nam Sung Kim, Kyomin Sohn, Jaeyoun Youn
  • Publication number: 20230071386
    Abstract: A computing device includes a host processor to execute a host driver to create a host-side interface, the host-side interface emulating a first Ethernet interface, assign the host-side interface a first medium access control (MAC) address and a first Internet Protocol (IP) address. Memory components are disposed on a substrate. A memory channel network (MCN) processor is disposed on the substrate and coupled between the memory components and the host processor. The MCN processor is to execute an MCN driver to create a MCN-side interface, the MCN-side interface emulating a second Ethernet interface. The MCN processor is to assign the MCN-side interface a second MAC address and a second IP address, which identify the MCN processor as a MCN network node to the host processor.
    Type: Application
    Filed: November 4, 2022
    Publication date: March 9, 2023
    Inventors: Nam Sung Kim, Mohammad Alian
  • Patent number: 11520724
    Abstract: A system includes a printed circuit board (PCB) on which is disposed memory components and a processor disposed on the PCB and coupled between the memory components and a host memory controller. The processor comprises a memory channel network (MCN) memory controller to handle memory requests associated with the memory components; a local buffer; and a core coupled to the MCN memory controller and the local buffer. The core executes an operating system (OS) running a network software layer and a distributed computing framework; and an MCN driver to: receive a network packet from the network software layer; store the network packet in the local buffer; and assert a transmit polling field of the local buffer to signal to the host memory controller that the network packet is available for transmission to a host computing device.
    Type: Grant
    Filed: September 6, 2019
    Date of Patent: December 6, 2022
    Assignee: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
    Inventors: Nam Sung Kim, Mohammad Alian
  • Publication number: 20220318164
    Abstract: A memory device includes a buffer die configured to receive a first broadcast command and a second broadcast command from an external device; and a plurality of core dies stacked on the buffer die. The plurality of core dies include: a first core die including a first processing circuit, a first memory cell array, a first command decoder configured to decode the first broadcast command, and a first data input/output circuit configured to output data of the first memory cell array to a common data input/output bus under control of the first command decoder; and a second core die including a second processing circuit, a second memory cell array, a second command decoder configured to decode the second broadcast command, and a second data input/output circuit configured to receive the data of the first memory cell array through the common data input/output bus under control of the second command decoder.
    Type: Application
    Filed: March 3, 2022
    Publication date: October 6, 2022
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-Hyuk KWON, Nam Sung Kim, Kyomin Sohn, Jaeyoun Youn
  • Publication number: 20220173220
    Abstract: Embodiments provide methods for forming nanowire structures, such as, for example, horizontal gate-all-around (hGAA) structures. In one embodiment, a method includes selectively etching material from a stack disposed on a material layer located on a substrate with a plasma to create recesses on each of first and second sides of the stack and depositing a dielectric material on the first and second sides. The stack includes repeating pairs of first and second layers. The method also includes removing the dielectric material from the first and second sides, where the dielectric material remains in the recesses of the first and second sides, and selectively depositing a stressor layer on regions of the first and second sides which are unprotected by the dielectric material to form gaps between the stressor layer and the dielectric material remaining in the recesses of the first and second sides.
    Type: Application
    Filed: February 16, 2022
    Publication date: June 2, 2022
    Inventors: Shiyu SUN, Nam Sung KIM, Bingxi Sun WOOD, Naomi YOSHIDA, Sheng-Chin KUNG, Miao JIN
  • Patent number: 11301399
    Abstract: A memory device includes a buffer die configured to receive a first broadcast command and a second broadcast command from an external device; and a plurality of core dies stacked on the buffer die. The plurality of core dies include: a first core die including a first processing circuit, a first memory cell array, a first command decoder configured to decode the first broadcast command, and a first data input/output circuit configured to output data of the first memory cell array to a common data input/output bus under control of the first command decoder; and a second core die including a second processing circuit, a second memory cell array, a second command decoder configured to decode the second broadcast command, and a second data input/output circuit configured to receive the data of the first memory cell array through the common data input/output bus under control of the second command decoder.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: April 12, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-Hyuk Kwon, Nam Sung Kim, Kyomin Sohn, Jaeyoun Youn
  • Patent number: 11282936
    Abstract: Embodiments provide apparatuses and methods for forming nanowire structures with desired materials horizontal gate-all-around (hGAA) structures field effect transistor (FET) for semiconductor chips. In one embodiments, a nanowire structure is provided and includes a stack containing repeating pairs of a first layer and a second layer and having a first side and a second side opposite from the first side, a gate structure surrounding the stack, a source layer adjacent to the first side, and a drain layer adjacent to the second side. The stack also contains one or more gaps disposed between the source layer and the second layer and having a dielectric constant value of about 1 and one or more gaps disposed between the drain layer and the second layer and having a dielectric constant value of about 1.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: March 22, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Shiyu Sun, Nam Sung Kim, Bingxi Sun Wood, Naomi Yoshida, Sheng-Chin Kung, Miao Jin
  • Patent number: 11256321
    Abstract: A server system including an enhanced Network Interface Controller (NIC) within a client-server architecture is provided. The server system includes a memory for storing data from one or more network packets and one or more processors for processing network requests based on the one or more network packets. The enhanced NIC is configured to receive the one or more network packets and transfer the data from the one or more network packets to the memory. During a latency period defined from the time required to transfer the network packet to memory, the enhanced NIC performs a Network-driven, packet Context Aware Power (NCAP) management process in order to actively transition a power management state of the one or more processors to a predicted level. In this manner, computational and energy efficiency of the server system is improved.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: February 22, 2022
    Assignee: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
    Inventors: Nam Sung Kim, Mohammad Alian
  • Publication number: 20210407577
    Abstract: A memory device includes a memory cell array including a plurality of banks each including a plurality of memory cells connected to a plurality of word lines, and a row decoder block connected to the plurality of banks. In a first operation mode, the row decoder block receives a first row address and a first bank address together with an activation command and activates a word line selected by the first row address from among the plurality of word lines of a bank selected by the first bank address from among the plurality of banks. In a second operation mode, the row decoder block receives a second row address and a second bank address together with the activation command and activates a word line selected by the second row address from among the plurality of word lines of each of at least two banks of the plurality of banks.
    Type: Application
    Filed: September 15, 2021
    Publication date: December 30, 2021
    Inventors: Sang-Hyuk Kwon, Nam Sung Kim, Kyomin Sohn, Seongil O, Haesuk Lee
  • Publication number: 20210382691
    Abstract: A random access memory may include memory banks and arithmetic approximation units. Each arithmetic approximation unit may be dedicated to one or more of the memory banks and include a respective multiply-and-accumulate unit and a respective lookup-table unit. The respective multiply-and-accumulate unit is configured to iteratively perform shift and add operations with two inputs and to provide a result of the shift and add operations to the respective lookup-table unit. The result approximates or is a product of the two inputs. The respective lookup-table unit is configured produce an output by applying a pre-defined function to the result. The arithmetic approximation units are configured for parallel operation. The random access memory may also include a memory controller configured to receive instructions, from a processor, regarding locations within the memory banks from which to obtain the two inputs and in which to write the output.
    Type: Application
    Filed: October 14, 2019
    Publication date: December 9, 2021
    Inventors: Nam Sung Kim, Hadi Esmaeilzadeh, Amir Yazdanbakhsh
  • Publication number: 20210374503
    Abstract: A distributed network includes a first group of computing devices. Each computing device is to be coupled to two neighbor computing devices of the first group of computing device and is to: (i) aggregate gradient values received from a first neighbor computing device with local gradient values to generate a partial aggregate of gradient values that are to train a neural network model; (ii) transfer the partial aggregate of gradient values to a second neighbor computing device; and repeat (i) and (ii) until a first aggregate of gradient values from the first group of computing devices is buffered at a first computing device of the first group of computing devices. The first computing device is to transfer the first aggregate of gradient values to a second group of computing devices of the distributed network for further aggregation.
    Type: Application
    Filed: October 11, 2019
    Publication date: December 2, 2021
    Inventors: Nam Sung Kim, Youjie Li, Alexander Gerhard Schwing