Abstract: An organic electroluminescent device includes first and second substrates attached by a seal pattern, array elements including a plurality of thin film transistors formed on the first substrate, a first electrode formed on a rear surface of the second substrate, a plurality of electrode separators formed on the rear surface of the first electrode, wherein the plurality of electrode separators is made of an insulating material defining sub-pixel regions that correspond to each thin film transistor, an organic electroluminescent layer formed on a rear surface of the first electrode in each of the sub-pixel regions, a second electrode formed on a rear surface of the organic electroluminescent layer in each of sub-pixel regions, a conductive connector formed between the first and second substrates in each sub-pixel region for connecting to the second electrode of a sub-pixel region.

Abstract: An organic electroluminescent display device includes a first substrate, a second substrate spaced apart from and facing the first substrate to form a space therebetween, an array element on an inner surface of the first substrate, an organic electroluminescent diode on an inner surface of the second substrate, a seal pattern along a peripheral portion between the first and second substrates, and a connection pattern electrically interconnecting the array element and the organic electroluminescent diode, wherein a pressure within the space between the first and second substrates is lower than an ambient atmospheric pressure.

Abstract: An organic electroluminescent device includes first and second substrates attached by a seal pattern; array elements including a plurality of switching devices on the first substrate; a color changing medium on a rear surface of the second substrate, wherein the color changing medium has a black matrix that defines sub-pixel regions and has red, green and blue color changing layers respectively corresponding to the sub-pixel regions, a planarizing layer on the color changing medium,; a first electrode on a rear surface of the planarizing layer; an organic electroluminescent layer on a rear surface of the first electrode; second electrodes on a rear surface of the organic electroluminescent layer that correspond to respective sub-pixel regions, and a plurality of electrical connectors between the first and second substrates, wherein electrical connectors connect an array elements on the first substrate to second electrodes on the second substrate, respectively.

Abstract: An organic electroluminescent device includes a first substrate, a second substrate facing and spaced apart from the first substrate, the first and second substrates each having a pixel region including a plurality of sub-pixel regions, a plurality of array elements on an inner surface of the first substrate, the plurality of array elements include a switching element within each of the plurality of sub-pixel regions, a first electrode of a transparent conductive material on an inner surface of the second substrate, an organic electroluminescent layer on the first electrode, a second electrode on the organic electroluminescent layer within each of the plurality of sub-pixel regions, a seal pattern along a peripheral portion between the first substrate and the second substrate, and a connection pattern electrically interconnecting the switching element and the second electrode within each of the plurality of sub-pixel regions.

Abstract: An improved field emission display device fabrication method which adopts both a silicon wafer direct bonding method and a mold method so as to fabricate an improved field emission display device, which includes the steps of a first step which forms a tip array by a molding method; and a second step which bonds the tip array to a second semiconductor substrate.

Abstract: A fabrication method for a test piece for observing non-contact regions in a pair of bonded semiconductor substrates includes thinning one substrate of a pair of bonded semiconductor substrates, grade-polishing the thinned semiconductor substrate and the bonded semiconductor substrates to have a predetermined graded angle relative their bonded surfaces, and dry-etching an area around the bonded surfaces of the grade-polished semiconductor substrates to reveal faults. With the thusly fabricated test piece, micro non-contact regions can be simply observed and crystal faults existing on the bonded surfaces as well as in the micro non-contact regions can be easily detected.