Abstract: A semiconductor manufacturing equipment may include a process chamber for treating a substrate; a front-end module including a first transfer robot, wherein the first transfer robot may be configured to transport the substrate received in a container; a transfer chamber between the front-end module and the process chamber, wherein the transfer chamber may be configured to load or unload the substrate into or out of the process chamber; and a cassette capable of receiving a replaceable component capable of being used in the process chamber. The front-end module may include a seat plate configured to move in a sliding manner so as to retract or extend into or from the front-end module. The cassette may be configured to be loaded into the front-end module while the cassette is seated on the seat plate.

Abstract: The present disclosure relates to a wear resistant steel material that is not cracked even after being cut using gas, etc., and a method of manufacturing the wear resistant steel material.

Abstract: A semiconductor manufacturing apparatus includes a loadlock module including a loadlock chamber in which a substrate container is received, wherein the loadlock module is configured to switch an internal pressure of the loadlock chamber between atmospheric pressure and a vacuum; and a transfer module configured to transfer a substrate between the substrate container received in the loadlock chamber and a process module for performing a semiconductor manufacturing process on the substrate, wherein the loadlock module includes a purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; and an exhaust unit configured to discharge a gas in the substrate container through an exhaust line connected to the substrate container.

Abstract: One embodiment of the present disclosure provides an abrasion resistant steel having excellent hardness and impact toughness, and a manufacturing method therefor, the steel comprising, by wt %, 0.33-0.42% of C, 0.1-0.7% of Si, 0.6-1.6% of Mn, 0.05% or less of P, 0.02% or less of S, 0.07% or less of Al, 0.55-5.0% of Ni, 0.01-1.5% of Cu, 0.01-0.8% of Cr, 0.01-0.8% of Mo, 50 ppm or less of B, and 0.02% or less of Co, further comprising one or more selected from the group consisting of 0.02% or less of Ti, 0.05% or less of Nb, 0.05% or less of V and 2-100 ppm of Ca, and comprising the balance of Fe and other inevitable impurities, wherein C and Ni satisfy the following relation 1, and the microstructure comprises 95 area % or more of martensite and 5% or less of bainite (including 0%). [Relation 1] [C]×[Ni]?0.

Abstract: A semiconductor manufacturing apparatus includes a loadlock module including a loadlock chamber in which a substrate container is received, wherein the loadlock module is configured to switch an internal pressure of the loadlock chamber between atmospheric pressure and a vacuum; and a transfer module configured to transfer a substrate between the substrate container received in the loadlock chamber and a process module for performing a semiconductor manufacturing process on the substrate, wherein the loadlock module includes a purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; and an exhaust unit configured to discharge a gas in the substrate container through an exhaust line connected to the substrate container.

Abstract: A semiconductor manufacturing apparatus includes a loadlock module including a loadlock chamber in which a substrate container is received, wherein the loadlock module is configured to switch an internal pressure of the loadlock chamber between atmospheric pressure and a vacuum; and a transfer module configured to transfer a substrate between the substrate container received in the loadlock chamber and a process module for performing a semiconductor manufacturing process on the substrate, wherein the loadlock module includes a purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; and an exhaust unit configured to discharge a gas in the substrate container through an exhaust line connected to the substrate container.

Abstract: A semiconductor manufacturing apparatus includes a loadlock module including a loadlock chamber in which a substrate container is received, wherein the loadlock module is configured to switch an internal pressure of the loadlock chamber between atmospheric pressure and a vacuum; and a transfer module configured to transfer a substrate between the substrate container received in the loadlock chamber and a process module for performing a semiconductor manufacturing process on the substrate, wherein the loadlock module includes a purge gas supply unit configured to supply a purge gas into the substrate container through a gas supply line connected to the substrate container; and an exhaust unit configured to discharge a gas in the substrate container through an exhaust line connected to the substrate container.

Abstract: The present invention provides an apparatus and method for manufacturing a metal separator for a fuel cell, which can manufacture large-sized metal separators in large quantities using metal plates such as stainless steel by thermoplastic deformation using an incremental and synchronized rubber molding process.

Abstract: The present invention provides an apparatus and method for manufacturing a metal separator for a fuel cell, which can manufacture large-sized metal separators in large quantities using metal plates such as stainless steel by thermoplastic deformation using an incremental and synchronized rubber molding process.

Abstract: The present invention provides an apparatus and method for manufacturing a metal separator for a fuel cell, which can manufacture large-sized metal separators in large quantities using metal plates such as stainless steel by thermoplastic deformation using an incremental and synchronized rubber molding process.

Abstract: A micro USB memory package and method for manufacturing the same, which can meet the USB standard specification, can have a light, thin, short and small configuration, can have various applications, and can simply expand the memory capacity thereof. The micro USB memory package comprises a substrate with a plurality of circuit patterns formed on the top surface thereof, at least one of passive elements connected with the circuit patterns of the substrate, at least one of controllers connected with the circuit patterns of the substrate, at least one of flash memories connected with the circuit patterns of the substrate, and an encapsulation part encapsulating the passive elements, the controllers and the flash memories on the substrate, and at least one of USB lands connected with the circuit patterns by a conducting via are formed on the under surface of one side of the substrate.

Abstract: The present invention provides an apparatus and method for manufacturing a metal separator for a fuel cell, which can manufacture large-sized metal separators in large quantities using metal plates such as stainless steel by thermoplastic deformation using an incremental and synchronized rubber molding process.

Abstract: A deposition apparatus includes a gas inflow tube, a plasma electrode, a substrate support functioning as an opposite electrode to the plasma electrode and mounting a substrate thereon, a plasma connector terminal connected to the plasma electrode, a first voltage application unit connected to the plasma connector terminal to apply a voltage thereto in a continuous mode, and a second voltage application unit connected to the plasma connector terminal to apply a voltage thereto in a pulse mode. The voltage applied by the first voltage application unit is an RF voltage of about 13.56 MHz, and the voltage applied by the second voltage application unit is a VHF voltage ranged from about 27 MHz to about 100 MHz.

Abstract: The present invention relates to a micro USB memory package and a method for manufacturing the same. The object of the present invention is to provide a micro USB memory package and a method for manufacturing the same, which can meet the USB standard specification, can have light, thin, short and small configuration, can have various applications, and can simply expand the memory capacity thereof.