Abstract: A switch apparatus, includes: a base module including a base case, and a moving magnet movably mounted in the base case; and a manipulation module including a manipulation case, and a first magnet fixedly mounted in the manipulation case, wherein the moving magnet moves between a hold position and a releasable position, the hold position refers to a position in which the manipulation module is held onto the base module as an attractive force acts between the moving magnet and the first magnet, and the releasable position refers to a position in which the manipulation module is releasable from the base module as a repulsive force acts between the moving magnet and the first magnet.

Abstract: A power module includes an upper substrate and a lower substrate, an upper chip, a lower chip, and a circuit board disposed across a space between the upper substrate and the lower chip and a space between the lower substrate and the upper chip so that the upper substrate and the lower substrate are vertically spaced from each other. The circuit board electrically connects the upper chip to the lower substrate while electrically connecting the lower chip to the upper substrate.

Abstract: An apparatus for predicting performance of a wheel in a vehicle: includes a learning device that generates a latent space for a plurality of two-dimensional (2D) wheel images based on a convolutional autoencoder (CAE), extracts a predetermined number of the plurality of 2D wheel images from the latent space, and learns a dataset having the plurality of 2D wheel images and performance values corresponding to the plurality of 2D wheel images; and a controller that predicts performance for the plurality of 2D wheel images based on a performance prediction model obtained by the learning device.

Abstract: A power module for a vehicle, includes: a first substrate including a first metal circuit disposed on a 1-1st surface, and a first spacer extending from the first metal circuit in a first direction; a second substrate spaced from and facing the first substrate in a second direction, and including a second metal circuit disposed on a 2-1st surface facing the 1-1st surface, and a second spacer extending from the second metal circuit in the second direction; and a semiconductor chip disposed between the first substrate and the second substrate, the first spacer and the second spacer extending toward each other.

Abstract: A power module for a vehicle, includes: a first substrate including a first metal circuit disposed on a 1-1st surface, and a first spacer extending from the first metal circuit in a first direction; a second substrate spaced from and facing the first substrate in a second direction, and including a second metal circuit disposed on a 2-1st surface facing the 1-1st surface, and a second spacer extending from the second metal circuit in the second direction; and a semiconductor chip disposed between the first substrate and the second substrate and including a power pad and a signal pad, the first spacer and the second spacer extending toward each other, and the second spacer including a 2-1st spacer connected to the power pad and a 2-2nd spacer connected to the signal pad.

Abstract: A display device includes a bendable area and non-bendable areas adjacent to the bendable area; a display substrate including transistors and a light emitting element; a sensing layer disposed under the display substrate and including a digitizer; and an adhesive layer disposed between the display substrate and the sensing layer, wherein the adhesive layer includes a first surface facing the sensing layer; and groove patterns recessed from the first surface of the adhesive layer.

Abstract: A display device includes a bendable area and non-bendable areas adjacent to the bendable area; a display substrate including transistors and a light emitting element; a sensing layer disposed under the display substrate and including a digitizer; and an adhesive layer disposed between the display substrate and the sensing layer, wherein the adhesive layer includes a first surface facing the sensing layer; and groove patterns recessed from the first surface of the adhesive layer.

Abstract: A panel bottom sheet and a display device including the same are provided. The panel bottom sheet includes a first base, a first light-absorbing layer disposed on a top surface or a bottom surface of the first base, a top bonding layer disposed above the first base and the first light-absorbing layer, an interlayer bonding layer disposed below the first base and the first light-absorbing layer, and a wiring pattern portion disposed below the interlayer bonding layer and including a plurality of wiring patterns.

Abstract: A panel bottom sheet and a display device including the same are provided. The panel bottom sheet includes a first base, a first light-absorbing layer disposed on a top surface or a bottom surface of the first base, a top bonding layer disposed above the first base and the first light-absorbing layer, an interlayer bonding layer disposed below the first base and the first light-absorbing layer, and a wiring pattern portion disposed below the interlayer bonding layer and including a plurality of wiring patterns.

Abstract: A panel bottom sheet and a display device including the same are provided. The panel bottom sheet includes a first base, a first light-absorbing layer disposed on a top surface or a bottom surface of the first base, a top bonding layer disposed above the first base and the first light-absorbing layer, an interlayer bonding layer disposed below the first base and the first light-absorbing layer, and a wiring pattern portion disposed below the interlayer bonding layer and including a plurality of wiring patterns.

Abstract: A panel bottom sheet and a display device including the same are provided. The panel bottom sheet includes a first base, a first light-absorbing layer disposed on a top surface or a bottom surface of the first base, a top bonding layer disposed above the first base and the first light-absorbing layer, an interlayer bonding layer disposed below the first base and the first light-absorbing layer, and a wiring pattern portion disposed below the interlayer bonding layer and including a plurality of wiring patterns.

Abstract: A bump structure includes a first bump disposed on a substrate, the first bump including a first metal, at least one antioxidant member surrounded by the first bump, the at least one antioxidant member including a second metal having an ionization tendency greater than an ionization tendency of the first metal, and a second bump disposed on the first bump and the at least one antioxidant member.

Abstract: A bump structure includes a first bump disposed on a substrate, the first bump including a first metal, at least one antioxidant member surrounded by the first bump, the at least one antioxidant member including a second metal having an ionization tendency greater than an ionization tendency of the first metal, and a second bump disposed on the first bump and the at least one antioxidant member.

Abstract: There are provided a film of surface Nb-containing La-STO cubic crystal particles that is effective as, for example, a thermoelectric conversion material for use at low temperatures of around room temperature, and an art for producing this film. The production method includes preparing a mixed aqueous solution in which an La-containing compound, an Sr-containing compound, a six-fold coordinated Ti complex compound, and an amphiphilic compound are dissolved; growing cubic-form crystals formed of La-doped STO in the mixed aqueous solution by a hydrothermal synthesis method; obtaining surface Nb-containing La-STO cubic crystal particles by dissolving a niobium-containing compound in this mixed solution and heating; and forming a particle film in which the surface Nb-containing La-STO cubic crystal particles are bonded, by disposing the surface Nb-containing La-STO cubic crystal particles on a substrate and carrying out firing.