Patents by Inventor Nami Kobori

Nami Kobori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR MANUFACTURING AN IMAGE DISPLAY DEVICE
    Publication number: 20130220511
    Abstract: The present invention provides a method of manufacturing an image display device. The method includes providing a translucent sheet, a pressure-sensitive adhesive sheet, an image display unit and a liquid adhesive. The translucent sheet has a first principal surface, a second principal surface opposite the first principal surface, a first edge part and a second edge part opposite the first edge part. The pressure-sensitive adhesive sheet has a first principal surface and a second principal surface opposite the first principal surface. The image display unit has a display surface.
    Type: Application
    Filed: August 11, 2011
    Publication date: August 29, 2013
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Shunsuke Suzuki, Hikaru Takeda, Nami Kobori, Sotaro Endo
  • Adhesive encapsulating composition and electronic devices made therewith
    Patent number: 8232350
    Abstract: Adhesive encapsulating compositions for use in electronic devices such as organic electroluminescent devices, touch screens, photovoltaic devices, and thin film transistors are disclosed herein. The adhesive encapsulating compositions include pressure sensitive adhesives comprising one or more polyisobutylene resins, in combination with optional multifunctional (meth)acrylate monomers and/or optional tackifiers.
    Type: Grant
    Filed: April 28, 2009
    Date of Patent: July 31, 2012
    Assignee: 3M Innovative Properties Company
    Inventors: Jun Fujita, Nami Kobori, Vivek Bharti, Fred B. McCormick, Serena L. Mollenhauer
  • ADHESIVE ENCAPSULATING COMPOSITION AND ELECTRONIC DEVICES MADE THEREWITH
    Publication number: 20110105637
    Abstract: Adhesive encapsulating compositions for use in electronic devices such as organic electroluminescent devices, touch screens, photovoltaic devices, and thin film transistors are disclosed herein. The adhesive encapsulating compositions include pressure sensitive adhesives comprising one or more polyisobutylene resins, in combination with optional multifunctional (meth)acrylate monomers and/or optional tackifiers.
    Type: Application
    Filed: April 28, 2009
    Publication date: May 5, 2011
    Inventors: Jun Fujita, Nami Kobori, Vivek Bharti, Fred B. Mccormick, Serena L, Mollenhauer
  • ADHESIVE ENCAPSULATING COMPOSITION FILM AND ORGANIC ELECTROLUMINESCENCE DEVICE
    Publication number: 20090026934
    Abstract: An adhesive encapsulating composition and an encapsulating film, which are useful as an encapsulant for an organic electroluminescence device or other electronic devices is provided. The adhesive encapsulating composition includes a hydrogenated cyclic olefin-based polymer and a polyisobutylene resin having a weight average molecular weight of 500,000 or more. Some embodiments of the adhesive encapsulating•composition include a hydrogenated cyclic olefin-based polymer, a polyisobutylene resin having a weight average molecular weight of 500,000 or more, a photocurable resin, and a photopolymerization initiator.
    Type: Application
    Filed: January 23, 2007
    Publication date: January 29, 2009
    Inventors: Jun Fujita, Takashi Yamasaki, Hideki Minami, Nami Kobori