Abstract: A display device includes: a substrate comprising a display area in which emission areas are arranged and a non-display area around the display area; a circuit layer on the substrate; and an element layer on the circuit layer, wherein the non-display area includes: a dam area where at least one dam portion surrounding the display area is arranged and spaced apart from the display area; and a junction area between an edge of the substrate and the dam area, wherein the circuit layer includes: a barrier layer on the substrate; a buffer layer on the barrier layer; and two or more inorganic insulating layers on the buffer layer and containing an inorganic insulating material, the display device further comprising a groove in a part of the junction area, spaced apart from the dam area and the edge of the substrate, and penetrating the barrier layer and the buffer layer.

Abstract: An organic light emitting diode device can have an enhanced thin film encapsulation layer for preventing moisture from permeating from the outside. The thin film encapsulation layer can have a multilayered structure in which one or more inorganic layers and one or more organic layers are alternately laminated. A barrier can be formed outside of a portion of the substrate on which the organic light emitting diode is formed. The organic layers of the thin film encapsulation layer can be formed inside an area defined by the barrier.

Abstract: A wafer cleaning apparatus of the present invention includes a vacuum chuck unit on which a wafer is mounted, a ring cover unit facing a retainer ring portion of the wafer, an expander module installed to move the ring cover unit and configured to press the retainer ring portion toward the vacuum chuck unit such that a gap between dies of the wafer widens, and a chucking module installed in the vacuum chuck unit to restrain the ring cover unit pressed by the expander module to the vacuum chuck unit.

Abstract: An organic light emitting diode device can have an enhanced thin film encapsulation layer for preventing moisture from permeating from the outside. The thin film encapsulation layer can have a multilayered structure in which one or more inorganic layers and one or more organic layers are alternately laminated. A barrier can be formed outside of a portion of the substrate on which the organic light emitting diode is formed. The organic layers of the thin film encapsulation layer can be formed inside an area defined by the barrier.

Abstract: A wafer cleaning apparatus of the present invention includes a vacuum chuck unit on which a wafer is mounted, a ring cover unit facing a retainer ring portion of the wafer, an expander module installed to move the ring cover unit and configured to press the retainer ring portion toward the vacuum chuck unit such that a gap between dies of the wafer widens, and a chucking module installed in the vacuum chuck unit to restrain the ring cover unit pressed by the expander module to the vacuum chuck unit.

Abstract: A display device includes: a substrate including a display area, a non-display area, and a sub-region, a circuit layer, a light emitting element layer, an encapsulation layer, and a polarization layer. The non-display area includes a dam area apart from the display area and in which at least one dam portion surrounding the display area is arranged, and a junction area surrounding the dam area. The circuit layer includes a semiconductor layer, a first insulating layer, a first conductive layer, a second insulating layer, a second conductive layer, a third insulating layer, a third conductive layer, a fourth insulating layer, and a fourth conductive layer. In the junction area, the encapsulation layer is disposed on the third insulating layer. A thickness of the third insulating layer at a central point of the junction area is substantially the same as a thickness of the third insulating layer in the display area.

Abstract: A vacuum suction head may include a holder including a through hole formed therein, a suction pad surrounding at least a portion of a side surface of the holder, and a packing pad on a lower surface of the holder. The suction pad may protrude below a lower surface of the holder. The packing pad may include a cutout part. The cutout part may allow a space between the suction pad and the packing pad such that the space and the through hole may be in fluid communication with each other.

Abstract: A method for forming through-via metal wiring is disclosed. According to the method, through-via metal wiring can be formed with excellent plating quality without an expensive sputtering process by bonding a metal foil to one side of a substrate having a through-via formed therein and using the foil as a metal seed layer.

Abstract: An organic light emitting diode device can have an enhanced thin film encapsulation layer for preventing moisture from permeating from the outside. The thin film encapsulation layer can have a multilayered structure in which one or more inorganic layers and one or more organic layers are alternately laminated. A barrier can be formed outside of a portion of the substrate on which the organic light emitting diode is formed. The organic layers of the thin film encapsulation layer can be formed inside an area defined by the barrier.

Abstract: An organic light emitting diode device can have an enhanced thin film encapsulation layer for preventing moisture from permeating from the outside. The thin film encapsulation layer can have a multilayered structure in which one or more inorganic layers and one or more organic layers are alternately laminated. A barrier can be formed outside of a portion of the substrate on which the organic light emitting diode is formed. The organic layers of the thin film encapsulation layer can be formed inside an area defined by the barrier.

Abstract: A wafer cleaning apparatus of the present invention includes a vacuum chuck unit on which a wafer is mounted, a ring cover unit facing a retainer ring portion of the wafer, an expander module installed to move the ring cover unit and configured to press the retainer ring portion toward the vacuum chuck unit such that a gap between dies of the wafer widens, and a chucking module installed in the vacuum chuck unit to restrain the ring cover unit pressed by the expander module to the vacuum chuck unit.

Abstract: A wafer cleaning apparatus of the present invention includes a vacuum chuck unit on which a wafer is mounted, and an ultrasonic cleaning module configured to spray a cleaning solution onto the wafer and apply ultrasonic waves to the cleaning solution to ultrasonically vibrate the cleaning solution.

Abstract: An electronic device is disclosed. The electronic device comprises a circuit board, a memory part comprising a plurality of first memory chips mounted on the circuit board, a socket part comprising a plurality of terminals electrically connected to a memory module which comprises a plurality of second memory chips, a memory controller for controlling the operation of the plurality of first memory chips and, when the memory module is connected to the socket part, controlling the operation of the plurality of first memory chips and the plurality of second memory chips, a conductive pattern comprising a control line which sequentially connects, from the memory controller, one or more of the plurality of terminals on the socket part and the plurality of first memory chips, and a capacitive element connected to the control line at a preset position between the one or more terminals on the socket part and the memory controller.

Abstract: A flexible display and manufacturing method thereof are disclosed. In one aspect, the flexible display includes a flexible substrate including a bending area, an insulating layer disposed on the flexible substrate, and at least one groove in the insulating layer within the bending area. The flexible display also includes a stress relaxation layer disposed on the at least one groove and a plurality of wires formed over the insulating layer and the stress relaxation layer.

Abstract: A flexible display and manufacturing method thereof are disclosed. In one aspect, the flexible display includes a flexible substrate including a bending area, an insulating layer disposed on the flexible substrate, and at least one groove in the insulating layer within the bending area. The flexible display also includes a stress relaxation layer disposed on the at least one groove and a plurality of wires formed over the insulating layer and the stress relaxation layer.

Abstract: Provided are a display device, a method of fabricating the same, and a polarizing film for a display device. The display device comprises a display panel, and an optical film attached to the display panel, wherein the optical film comprises a plurality of edges, and a side surface of at least one edge of the plurality of edges of the optical film is an acutely inclined surface that has an acute inclination angle with respect to a lower surface of the optical film and an asymmetric shape in a thickness direction of the optical film.

Abstract: A functional polarizing film includes a polarizing layer, at least one moisture-binding layer on a first surface of the polarizing layer, and at least one moisture-blocking layer disposed on a first surface of the moisture-binding layer.

Abstract: An organic light emitting diode device can have an enhanced thin film encapsulation layer for preventing moisture from permeating from the outside. The thin film encapsulation layer can have a multilayered structure in which one or more inorganic layers and one or more organic layers are alternately laminated. A barrier can be formed outside of a portion of the substrate on which the organic light emitting diode is formed. The organic layers of the thin film encapsulation layer can be formed inside an area defined by the barrier.

Abstract: An electronic device is disclosed. The disclosed electronic device comprises at least one camera module, a memory, and a processor electrically connected to the camera module and the memory, wherein the memory stores instructions that, when executed, cause the processor to store a first frame, which is generated using an image inputted through the camera module, as a first image in the memory, and if a degree of similarity between a second frame and a third frame, which are generated using the image inputted through the camera module, is equal to or greater than a predetermined value, cause the processor to generate a second image by synthesizing at least one frame comprising the second frame and the third frame and store the second image in the memory. Other various embodiments are also possible.

Abstract: A method and electronic device are disclosed herein. The electronic device includes a display, a communication unit, a processor and a memory storing instructions. The process executes the instructions to implement the method, including establishing wireless communication with one or more IoT devices, displaying a user interface for managing IoT devices, receiving a user input selecting a group of IoT devices, transmitting first information including user account data to an external server, transmitting second information to another device, the first information also indicating a selected group of IoT devices, and the second information causing the other device to communicatively connect with the first external server.