Patents by Inventor Namki Cho

Namki Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate processing apparatus
    Patent number: 11600511
    Abstract: A substrate processing apparatus including an electrostatic chuck on which a substrate is mountable; a ring surrounding the electrostatic chuck, the ring including a first coupling groove; and a first floating electrode in the first coupling groove of the ring, the first floating electrode having a ring shape, wherein a top surface of the first floating electrode is exposed at the ring, and the first floating electrode has a tapered shape including an inclined surface that is inclined in a downward direction toward the electrostatic chuck.
    Type: Grant
    Filed: March 2, 2021
    Date of Patent: March 7, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kihong Cho, Kyuchul Shim, Chungho Cho, Jiho Uh, Jinseok Lee, Namki Cho
  • SUBSTRATE PROCESSING APPARATUS
    Publication number: 20210296153
    Abstract: A substrate processing apparatus including an electrostatic chuck on which a substrate is mountable; a ring surrounding the electrostatic chuck, the ring including a first coupling groove; and a first floating electrode in the first coupling groove of the ring, the first floating electrode having a ring shape, wherein a top surface of the first floating electrode is exposed at the ring, and the first floating electrode has a tapered shape including an inclined surface that is inclined in a downward direction toward the electrostatic chuck.
    Type: Application
    Filed: March 2, 2021
    Publication date: September 23, 2021
    Inventors: Kihong CHO, Kyuchul SHIM, Chungho CHO, Jiho UH, Jinseok LEE, Namki CHO
  • High-speed, flexible integrated circuits and methods for making high-speed, flexible integrated circuits
    Patent number: 11109486
    Abstract: The present invention provides flexible devices, such as integrated circuits, having a multilevel electronic device structure including two or more electronic components. The electronic components within the structure are electrically connected by an interconnect structure having multiple interconnect levels. In addition to the multilevel electronic device structure, the flexible devices include an elastomeric material disposed around the interconnect levels, including within the spaces between the interconnect levels.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: August 31, 2021
    Assignee: Wisconsin Alumni Research Foundation
    Inventors: Zhenqiang Ma, Guoxuan Qin, Namki Cho
  • HIGH-SPEED, FLEXIBLE INTEGRATED CIRCUITS AND METHODS FOR MAKING HIGH-SPEED, FLEXIBLE INTEGRATED CIRCUITS
    Publication number: 20200084891
    Abstract: The present invention provides flexible devices, such as integrated circuits, having a multilevel electronic device structure including two or more electronic components. The electronic components within the structure are electrically connected by an interconnect structure having multiple interconnect levels. In addition to the multilevel electronic device structure, the flexible devices include an elastomeric material disposed around the interconnect levels, including within the spaces between the interconnect levels.
    Type: Application
    Filed: October 21, 2019
    Publication date: March 12, 2020
    Inventors: Zhenqiang Ma, Guoxuan Qin, Namki Cho
  • HIGH-SPEED, FLEXIBLE INTEGRATED CIRCUITS AND METHODS FOR MAKING HIGH-SPEED, FLEXIBLE INTEGRATED CIRCUITS
    Publication number: 20130229776
    Abstract: The present invention provides flexible devices, such as integrated circuits, having a multilevel electronic device structure including two or more electronic components. The electronic components within the structure are electrically connected by an interconnect structure having multiple interconnect levels. In addition to the multilevel electronic device structure, the flexible devices include an elastomeric material disposed around the interconnect levels, including within the spaces between the interconnect levels.
    Type: Application
    Filed: December 21, 2012
    Publication date: September 5, 2013
    Applicant: Wisconsin Alumni Research Foundation
    Inventors: Zhenqiang Ma, Guoxuan Qin, Namki Cho