Abstract: A circuit device includes a circuit board having several contacts disposed on a first face of the circuit board and a connector disposed on a second face of the circuit board. The circuit board includes a hollow part, and the hollow part is defined through the circuit board from the first face of the circuit board to the second face of the circuit board. The circuit device includes several cables. One of two ends of each cable is on the first face of the circuit board and is connected to the corresponding contact, and the other end of each cable passes through the hollow part of the circuit board to the second face of the circuit board and extends outwardly.

Abstract: A method for fabricating a memory device includes: forming a first dielectric layer disposed on a substrate, and a first opening in the first dielectric layer; filling a lower portion of the first opening with a first conductive material layer; conformally forming a lining layer over sidewalls of an upper portion of the first opening and a top surface of the first conductive material layer; filling the upper portion of the first opening with a second conductive material layer; etching back the second conductive material layer and the lining layer to form a recess; conformally forming a protection layer on sidewalls and a bottom portion of the recess and a top surface of the first dielectric layer; forming a second opening that penetrates through the protection layer, the second conductive material layer, the lining layer and the first conductive material layer; forming a pair of contacts in the first opening.

Abstract: In an approach for generating a file, a computer provides a selection window associated with a second file, wherein the selection window is at least partially transparent and at least partially overlays an opened first file. The computer identifies content within the opened first file that is overlaid by the provided selection window associated with the second file. The computer transfers a copy of the identified content within the opened first file that is overlaid by the provided selection window associated with the second file, wherein the opened first file does not incorporate changes that are made within the second file.

Abstract: The present invention relates to a manufacturing method and structure of curtain ladder string, the manufacturing method includes the following steps: a. weaving a ladder string body, and weaving one edge ring every certain distance along a side rope of the ladder string body; b. the edge rings on the side rope are provided to knit a mesh tube, a drawstring is provided to pass through inside the mesh tube; the curtain ladder string manufactured by the above steps is provided for assembling curtains to achieve the purpose that the drawstring does not be pulled out, to ensure safety in use and convenience of operation.

Abstract: A method of manufacturing a DRAM includes isolation structures and word line sets are formed in the substrate. A conductive material is formed on the substrate. Conductive material is removed to form first openings in the conductive material. The first openings expose surfaces of the substrate in the first areas and divide the conductive material into conductive layers, thereby the conductive layers are located on surfaces of the substrate in the second areas. A first dielectric material is filled in the first openings so as to form first dielectric layers on the substrate in the first areas. Top surfaces of the conductive layers are lower than top surfaces of the first dielectric layers. Second dielectric layers are formed respectively in the conductive layers. Capacitors are formed respectively on the conductive posts.

Abstract: A sensing method and system includes equipping a vehicle with a first sensor at a forward portion of a side of the vehicle such that a principal axis of the first sensor's zone of sensing is rearward and sideward and at an acute angle relative to the body, and a second sensor at a rearward portion of the side of the vehicle such that a principal axis of the second sensor's zone of sensing is forward and sideward and at an acute angle relative to the body. Data sensed by the sensors when each sensor senses with zone of sensing and an adjusted zone of sensing are communicated to a control, which determines the presence of one or more objects exterior the vehicle and within the zone of sensing and the adjusted zone of sensing of the at least one of the sensors.

Abstract: A buried word line structure including a substrate, an isolation structure, and a buried word line is provided. The isolation structure is located in the substrate to define active regions separated from each other. The active regions extend in a first direction. The buried word line is located in the substrate. The buried word line extends through the isolation structure and the active regions in a second direction. The first direction intersects the second direction. The buried word line and the substrate are isolated from each other. The same buried word line includes a first portion and a second portion. The first portion is located in the active regions. The second portion is located in the isolation structure between two adjacent active regions in the first direction. A width of the first portion is greater than a width of the second portion.

Abstract: The present disclosure relates to a semiconductor switch leg S for a Power Electronic (PE) converter (1). The switch leg comprises a plurality of parallel connected semiconductor devices Sa-d. Each semiconductor device is connected with a positive conductor a-d+ connecting the semiconductor device to a positive terminal of an energy storing device (2) of the converter, and a negative conductor a-d-connecting the semiconductor device to a negative terminal of the energy storing device (2) of the converter, the semiconductor device together with the positive conductor and the negative conductor forming a current path across the energy storing device.

Abstract: An intersection blind-guiding system includes: a blind-guiding terminal, a plurality of blind road sensors, and a processor configured to be coupled to the blind road sensors. The blind-guiding terminal includes a blind-guiding terminal sensor configured to transmit a sensing signal. The blind road sensors include at least one first blind road sensor and at least one second blind road sensor. The blind road sensors are configured to separately receive the sensing signal transmitted by the blind-guiding terminal sensor, and upload corresponding sensing information. The processor is configured to receive the sensing information uploaded by the blind road sensors, locate a current position of a blind person carrying the blind-guiding terminal, determine a direction in which the blind person previously traveled, determine geographic distribution information of the current position of the blind person, and send a command carrying the geographical distribution information.

Abstract: A method of making a sensing unit for a sensing system of a vehicle includes providing a first housing portion, a second housing portion, and a transducer having a piezo element. The transducer is placed in the first housing portion at the closed transducer end of the first housing portion. A dampening ring is disposed in the first housing portion between the closed transducer end and the first open receiving end of the first housing portion. A compression ring is provided and disposed at least partially into the first open receiving end of the first housing portion with wires electrically connecting the piezo element to the pins of the compression ring in the first housing portion. A PCB is disposed in the second housing portion and electrically connected to terminals of a connector portion of the second housing portion. The first housing portion is attached to the second housing portion.

Abstract: Provided is a memory device including a substrate, a plurality of contacts, and a plurality of air gaps. The substrate has a plurality of active areas. The contacts are respectively disposed on ends of the active areas. The air gaps respectively surround the sidewalls of the contacts.

Abstract: The low power wide area network communication mechanism mainly allocates the semi-persistent scheduling (SPS) frames to the terminal devices having network access requirements sequentially by the gateway. The SPS cycle is composed of a plurality of SPS frames and at least one buffering frame. In each SPS cycle, a data reception window is activated by the gateway according to each allocated SPS frames; the SPS frames that the networked terminal devices belong to are activated synchronously within each SPS cycle in order for the networked terminal devices to perform a data transmission with the gateway during each SPS cycle and ensure that the data transmission does not overlap with the data sent by other terminal devices. The scheduling may be re-scheduled at a preset time interval to allocate the SPS frames of terminal devices that are inoperable or out of service area to the terminal devices having network access requirements.

Abstract: A buried word line structure including a substrate, an isolation structure, and a buried word line is provided. The isolation structure is located in the substrate to define active regions separated from each other. The active regions extend in a first direction. The buried word line is located in the substrate. The buried word line extends through the isolation structure and the active regions in a second direction. The first direction intersects the second direction. The buried word line and the substrate are isolated from each other. The same buried word line includes a first portion and a second portion. The first portion is located in the active regions. The second portion is located in the isolation structure between two adjacent active regions in the first direction. A width of the first portion is greater than a width of the second portion.

Abstract: A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes a substrate, a dielectric layer disposed on the substrate, bit lines disposed on the dielectric layer, spacers and a contact. The substrate has active areas arranged in parallel with each other. The bit lines are arranged in parallel with each other. Each bit line is partially overlapped with the corresponding active area. Each bit line has first portions and second portions arranged alternately in an extending direction thereof, and a width of the first portions is smaller than that of the second portions. The spacers are disposed on the sidewalls of each bit line. The contact is disposed between the adjacent bit lines and adjacent to the corresponding first portion of at least one of the adjacent bit lines, penetrates through the dielectric layer, and is in contact with the corresponding active area.

Abstract: An image sensor structure includes a substrate, a first infrared filter, a second infrared filter, a planarization layer, a color filter and a third infrared filter. The substrate has a first sensing region for detecting visible light and a second sensing region neighboring the first sensing region for detecting infrared light. The first infrared filter is disposed on the first sensing region. The second infrared filter is disposed on the second sensing region and neighbors the first infrared filter. The second infrared filter defines one or more openings for penetrating incident light. The planarization layer is over the first infrared filter and the second infrared filter, and fills the one or more openings. The color filter is on the planarization layer and vertically above the first sensing region. The third infrared filter is on the planarization layer and is vertically above the second sensing region.

Abstract: An analog microphone and a control method thereof are disclosed. The analog microphone includes a sensor configured to sense an audio signal and convert the audio signal into an electrical signal; a charge pump configured to provide a bias voltage for the sensor to drive the sensor; a source follower configured to receive the electrical signal and convert the electrical signal into a source follower signal; a gain adjustable amplifier configured to receive the source follower signal, multiply the source follower signal by an amplifying factor, and output an amplified signal; and a detecting module configured to adaptively control the bias voltage of the charge pump and the amplified signal of the gain adjustable amplifier in response to the source follower signal of the source follower.

Abstract: An active stylus pen comprises a touch component and a pressure sensing module. One end of the touch component is disposed at a nib part of the active stylus pen, wherein the touch component is configured to receive an external pressure. The pressure sensing module is connected to the touch component, wherein the pressure sensing module is configured to generate an oscillation signal, wherein the oscillation signal has a first frequency when the touch component receives the external pressure and the external pressure reaches a first threshold value, and wherein the oscillation signal is adjusted to have a second frequency when the touch component receives the external pressure and the external pressure does not reach the first threshold value; wherein a difference of the first frequency and the second frequency is larger than a second threshold value.

Abstract: A three-dimensional (3D) integrated circuit (IC) is provided. In some embodiments, a second IC die is bonded to a first IC die by a first bonding structure. A third IC die is bonded to the second IC die by a second bonding structure. The second bonding structure is arranged between back sides of the second IC die and the third IC die opposite to corresponding interconnect structures and comprises a first TSV (through substrate via) disposed through a second substrate of the second IC die and a second TSV disposed through a third substrate of the third IC die. The second bonding structure further comprises conductive features with oppositely titled sidewalls disposed between the first TSV and the second TSV.

Abstract: Provided is a memory device including a substrate, a plurality of contacts, and a plurality of air gaps. The substrate has a plurality of active areas. The contacts are respectively disposed on ends of the active areas. The air gaps respectively surround the sidewalls of the contacts.