Abstract: A method of fabricating interconnects in a semiconductor device is provided, which includes forming an interconnect layer with a plurality of first conductive lines formed of a first conductive material in a dielectric layer. At least one via opening is formed over the plurality of first conductive lines and an interconnect via formed of a second conductive material is formed in the via opening, wherein the formed interconnect via has a convex top surface.

Abstract: The invention provides a method and a device for seeing through an obstruction based on smart glasses, and a computer-readable storage medium, the method comprising: acquiring a first image of user's view by smart glasses and recognizing an obstruction image in the first image; acquiring a second image of the user's view by at least one image acquisition device; replacing the obstruction image in the first image with portion of the second image that corresponds to the obstruction image, which are spliced to generate an unobstruction image of the user's view. In the invention, the obstruction image in the first image is replaced with a portion of the second image that corresponds to the obstruction image, which can achieve seeing through an obstruction.

Abstract: A method of fabricating interconnects in a semiconductor device is provided, which includes forming an interconnect layer with a plurality of first conductive lines formed of a first conductive material in a dielectric layer. At least one via opening is formed over the plurality of first conductive lines and an interconnect via formed of a second conductive material is formed in the via opening, wherein the formed interconnect via has a convex top surface.

Abstract: The invention provides a method and a device for seeing through an obstruction based on smart glasses, and a computer-readable storage medium, the method comprising: acquiring a first image of user's view by smart glasses and recognizing an obstruction image in the first image; acquiring a second image of the user's view by at least one image acquisition device; replacing the obstruction image in the first image with portion of the second image that corresponds to the obstruction image, which are spliced to generate an unobstruction image of the user's view. In the invention, the obstruction image in the first image is replaced with a portion of the second image that corresponds to the obstruction image, which can achieve seeing through an obstruction.

Abstract: Disclosed is see-through smart glasses (100) and see-through methods thereof. The see-through smart glasses (100) includes a model storing module (110), an image processing module (130) and an image displaying module (120). The model storing module (110) is used for storing a 3D model of a target; the image processing module (130) is used for identifying target extrinsic marker (210?) of the target (200) based on a user's viewing angle, find out a spatial correlation between the target extrinsic marker (210?) and internal structure (220) based on the 3D model of the target (200), and generating an interior image of the target (200) corresponding to the viewing angle based on the spatial correlation; and the image displaying module (120) is used for displaying the interior image.