Patents by Inventor Nan HOU

Nan HOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240107391
    Abstract: Methods, systems, and devices for wireless communications are disclosed by the present application. A request to establish a call using a first connection may be received, the first connection using a first radio access technology to communicate with a radio access network. During execution of a procedure to establish the call, a command to handover communications from the first connection to a second connection that uses a second radio access technology to communicate with the radio access network may be received. The second connection may be established in response to the command, and a message indicating that the request to establish the call was successfully received may be transmitted over the second connection. Also, a message indicating that an alert of the call is being issued may be transmitted over the second connection.
    Type: Application
    Filed: January 29, 2021
    Publication date: March 28, 2024
    Inventors: Nan ZHANG, Peng WU, Yuyi LI, Yong HOU, Mengling GUAN, Yan ZHANG, Yujie QIU, Jun MA, Yueming TENG, Shailesh MAHESHWARI, Gang Andy XIAO, Vishal DALMIYA, Xiaochen CHEN, Vaishakh RAO
  • Patent number: 11916449
    Abstract: An assembly method and a fixing device for an electric motor are provided. The assembly method includes: carrying out preparation, wherein a stator of the electric motor is segmented, in the circumferential direction, into at least two stator segments, and a rotor of the electric motor is segmented, in the circumferential direction, into at least two rotor segments; carrying out pre-assembly, wherein the stator segments and the rotor segments are coaxially fixed to fixing devices to form segment modules, and predetermined gaps are maintained radially between the stator segments and the rotor segments; carrying out adjustment, wherein at least two fixing devices are moved and adjusted such that the stator segment and the rotor segment of the adjacent segment modules are mutually attached and aligned with each other along segmental end faces in the circumferential direction; carrying out assembly; and carrying out dismounting, and dismounting the fixing devices.
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: February 27, 2024
    Assignee: XINJIANG GOLDWIND SCIENCE & TECHNOLOGY CO., LTD.
    Inventors: Jiuyang Luo, Nan Hou
  • Patent number: 11837924
    Abstract: The present application relates to an electric machine splitting or assembling method, an electric machine assembling method, and an electric machine splitting or assembling device including a sleeving device separating or coaxially sleeving first and second rotary bodies; the first disassembly device fixes the first rotary body and includes at least two first separable portions, and the first rotary body is split into petals in a circumferential direction by disassembling the first separable portions, or its respective petal segments are assembled in the circumferential direction by combining the first separable portions; and the second disassembly device is fixed to the second rotary body and includes at least two second separable portions, and the second rotary body is split into petals in the circumferential direction by disassembling the second separable portions, or its respective petal segments are assembled in the circumferential direction by combining the second separable portions.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: December 5, 2023
    Assignee: XINJIANG GOLDWIND SCIENCE & TECHNOLOGY CO., LTD.
    Inventors: Nan Hou, Jiuyang Luo
  • Publication number: 20230238862
    Abstract: The present application relates to an electric machine splitting or assembling method, an electric machine assembling method, and an electric machine splitting or assembling device including a sleeving device separating or coaxially sleeving first and second rotary bodies; the first disassembly device fixes the first rotary body and includes at least two first separable portions, and the first rotary body is split into petals in a circumferential direction by disassembling the first separable portions, or its respective petal segments are assembled in the circumferential direction by combining the first separable portions; and the second disassembly device is fixed to the second rotary body and includes at least two second separable portions, and the second rotary body is split into petals in the circumferential direction by disassembling the second separable portions, or its respective petal segments are assembled in the circumferential direction by combining the second separable portions.
    Type: Application
    Filed: June 9, 2020
    Publication date: July 27, 2023
    Applicant: Xinjiang Goldwind Science & Technology Co., Ltd.
    Inventors: Nan HOU, Jiuyang LUO
  • Publication number: 20230034019
    Abstract: An assembly method and a fixing device for an electric motor are provided. The assembly method includes: carrying out preparation, wherein a stator of the electric motor is segmented, in the circumferential direction, into at least two stator segments, and a rotor of the electric motor is segmented, in the circumferential direction, into at least two rotor segments; carrying out pre-assembly, wherein the stator segments and the rotor segments are coaxially fixed to fixing devices to form segment modules, and predetermined gaps are maintained radially between the stator segments and the rotor segments; carrying out adjustment, wherein at least two fixing devices are moved and adjusted such that the stator segment and the rotor segment of the adjacent segment modules are mutually attached and aligned with each other along segmental end faces in the circumferential direction; carrying out assembly; and carrying out dismounting, and dismounting the fixing devices.
    Type: Application
    Filed: August 25, 2020
    Publication date: February 2, 2023
    Applicant: Xinjiang Goldwind Science & Technology Co., Ltd.
    Inventors: Jiuyang LUO, Nan HOU
  • Publication number: 20200168306
    Abstract: Provided herein is to a method and a system for sharing electronic medical and health records. The method is operated in a serving system with a database. The system provides a software program executed by a terminal device. In the method, the serving system receives a connection request from the terminal device and verifies a user blockchain ID. The system provides one or more medical-health record indexes after the verification. When receiving an instruction for sharing medical-health record from the terminal device, the system generates a trust anchor for the terminal device. The trust anchor is provided for the terminal device to share with a shared recipient. When receiving an authorization message from the shared recipient, the system transmits the medical-health records to be shared to the shared recipient after verifying the blockchain ID and the authorization message.
    Type: Application
    Filed: November 28, 2019
    Publication date: May 28, 2020
    Inventors: Ray-Jade Chen, Yu-Sheng Lo, Lan-Ying Kang, Hsing-Nan Hou, Wan-Lin Chou
  • Patent number: 9412528
    Abstract: A switch structure connectable with both bare lead and flat-head terminal lead. The switch structure includes a main body formed with at least one cavity. A retainer member and a conductive metal member are arranged in the cavity for pressing the terminal lead into electrical connection with the conductive metal member. A reciprocally movable carrier body is assembled with the retainer member. The carrier body has an arm assembled with an elastic member. A restriction body is disposed in the cavity. The restriction body is formed with a chamber for receiving the arm and the elastic member of the carrier body. The restriction body restricts the moving direction or distance of the carrier body to increase the structural strength of the switch structure and enhance the lead locking ability of the switch structure.
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: August 9, 2016
    Assignees: Switchlab Inc., Switchlab (Shanghai) Co., Ltd.
    Inventors: Chih-Yuan Wu, Sheng-Nan Hou
  • Patent number: 9312325
    Abstract: A method for forming a semiconductor device includes forming a capacitor bottom plate and a metal interconnect feature on a substrate. A dielectric layer having a predetermined thickness is then formed. The dielectric layer has a first portion overlying the capacitor bottom plate and a second portion overlying the metal interconnect feature. A thickness of the first portion of the dielectric layer is adjusted by either reducing the thickness or depositing additional dielectric material. A capacitor top plate is formed over the first portion of the dielectric layer.
    Type: Grant
    Filed: April 6, 2015
    Date of Patent: April 12, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shean-Ren Horng, Kuo-Nan Hou, Feng-Liang Lai
  • Publication number: 20150214290
    Abstract: A method for forming a semiconductor device includes forming a capacitor bottom plate and a metal interconnect feature on a substrate. A dielectric layer having a predetermined thickness is then formed. The dielectric layer has a first portion overlying the capacitor bottom plate and a second portion overlying the metal interconnect feature. A thickness of the first portion of the dielectric layer is adjusted by either reducing the thickness or depositing additional dielectric material. A capacitor top plate is formed over the first portion of the dielectric layer.
    Type: Application
    Filed: April 6, 2015
    Publication date: July 30, 2015
    Inventors: Shean-Ren Horng, Kuo-Nan Hou, Feng-Liang Lai
  • Patent number: 9000562
    Abstract: A method for forming a metal-insulator-metal (MIM) capacitor includes forming a capacitor bottom plate and a metal interconnect feature on a substrate. A dielectric layer having a predetermined thickness is then formed. The dielectric layer has a first portion overlying the capacitor bottom plate and a second portion overlying the metal interconnect feature. The dielectric layer is processed to adjust the thickness of the first portion of the dielectric layer relative the thickness of the second portion of the dielectric layer. Processing can include etching the first portion of the dielectric layer or adding dielectric material to the second portion of the dielectric layer. A capacitor top plate is formed over the first portion of the dielectric layer to complete the MIM structure.
    Type: Grant
    Filed: May 25, 2011
    Date of Patent: April 7, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shean-Ren Horng, Kuo-Nan Hou, Feng-Liang Lai
  • Publication number: 20150008108
    Abstract: A switch structure connectable with both bare lead and flat-head terminal lead. The switch structure includes a main body formed with at least one cavity. A retainer member and a conductive metal member are arranged in the cavity for pressing the terminal lead into electrical connection with the conductive metal member. A reciprocally movable carrier body is assembled with the retainer member. The carrier body has an arm assembled with an elastic member. A restriction body is disposed in the cavity. The restriction body is formed with a chamber for receiving the arm and the elastic member of the carrier body. The restriction body restricts the moving direction or distance of the carrier body to increase the structural strength of the switch structure and enhance the lead locking ability of the switch structure.
    Type: Application
    Filed: June 23, 2014
    Publication date: January 8, 2015
    Inventors: CHIH-YUAN WU, SHENG-NAN HOU
  • Publication number: 20110227195
    Abstract: A method for forming a metal-insulator-metal (MIM) capacitor includes forming a capacitor bottom plate and a metal interconnect feature on a substrate. A dielectric layer having a predetermined thickness is then formed. The dielectric layer has a first portion overlying the capacitor bottom plate and a second portion overlying the metal interconnect feature. The dielectric layer is processed to adjust the thickness of the first portion of the dielectric layer relative the thickness of the second portion of the dielectric layer. Processing can include etching the first portion of the dielectric layer or adding dielectric material to the second portion of the dielectric layer. A capacitor top plate is formed over the first portion of the dielectric layer to complete the MIM structure.
    Type: Application
    Filed: May 25, 2011
    Publication date: September 22, 2011
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shean-Ren Horng, Kuo-Nan Hou, Feng-Liang Lai
  • Patent number: 7964470
    Abstract: A method for forming a metal-insulator-metal (MIM) capacitor includes forming a capacitor bottom plate and a metal interconnect feature on a substrate. A dielectric layer having a predetermined thickness is then formed. The dielectric layer has a first portion overlying the capacitor bottom plate and a second portion overlying the metal interconnect feature. The dielectric layer is processed to adjust the thickness of the first portion of the dielectric layer relative the thickness of the second portion of the dielectric layer. Processing can include etching the first portion of the dielectric layer or adding dielectric material to the second portion of the dielectric layer. A capacitor top plate is formed over the first portion of the dielectric layer to complete the MIM structure.
    Type: Grant
    Filed: March 1, 2006
    Date of Patent: June 21, 2011
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shean-Ren Horng, Kuo-Nan Hou, Feng-Liang Lai
  • Publication number: 20070205248
    Abstract: A method for forming a metal-insulator-metal (MIM) capacitor includes forming a capacitor bottom plate and a metal interconnect feature on a substrate. A dielectric layer having a predetermined thickness is then formed. The dielectric layer has a first portion overlying the capacitor bottom plate and a second portion overlying the metal interconnect feature. The dielectric layer is processed to adjust the thickness of the first portion of the dielectric layer relative the thickness of the second portion of the dielectric layer. Processing can include etching the first portion of the dielectric layer or adding dielectric material to the second portion of the dielectric layer. A capacitor top plate is formed over the first portion of the dielectric layer to complete the MIM structure.
    Type: Application
    Filed: March 1, 2006
    Publication date: September 6, 2007
    Inventors: Shean-Ren Horng, Kuo-Nan Hou, Feng-Liang Lai
  • Patent number: 5051552
    Abstract: A slide selector switch mechanism for use within slide switches for controlling electrical circuits includes a detent spring centrally connected to a slide actuator member and to opposite ends of a movable bridging contactor. The detent spring provides contact pressure for effecting adequate pressurized electrical engagement of the contactor with underlying fixed terminal contact elements. The detent spring also functions as a separate actuating member for causing pivotal movement of the bridging contactor.
    Type: Grant
    Filed: July 16, 1990
    Date of Patent: September 24, 1991
    Assignee: Ilinois Tool Works Inc.
    Inventors: Sheng-Nan Hou, Joseph Spedale