Abstract: An assembly method and a fixing device for an electric motor are provided. The assembly method includes: carrying out preparation, wherein a stator of the electric motor is segmented, in the circumferential direction, into at least two stator segments, and a rotor of the electric motor is segmented, in the circumferential direction, into at least two rotor segments; carrying out pre-assembly, wherein the stator segments and the rotor segments are coaxially fixed to fixing devices to form segment modules, and predetermined gaps are maintained radially between the stator segments and the rotor segments; carrying out adjustment, wherein at least two fixing devices are moved and adjusted such that the stator segment and the rotor segment of the adjacent segment modules are mutually attached and aligned with each other along segmental end faces in the circumferential direction; carrying out assembly; and carrying out dismounting, and dismounting the fixing devices.

Abstract: The present application relates to an electric machine splitting or assembling method, an electric machine assembling method, and an electric machine splitting or assembling device including a sleeving device separating or coaxially sleeving first and second rotary bodies; the first disassembly device fixes the first rotary body and includes at least two first separable portions, and the first rotary body is split into petals in a circumferential direction by disassembling the first separable portions, or its respective petal segments are assembled in the circumferential direction by combining the first separable portions; and the second disassembly device is fixed to the second rotary body and includes at least two second separable portions, and the second rotary body is split into petals in the circumferential direction by disassembling the second separable portions, or its respective petal segments are assembled in the circumferential direction by combining the second separable portions.

Abstract: The present application relates to an electric machine splitting or assembling method, an electric machine assembling method, and an electric machine splitting or assembling device including a sleeving device separating or coaxially sleeving first and second rotary bodies; the first disassembly device fixes the first rotary body and includes at least two first separable portions, and the first rotary body is split into petals in a circumferential direction by disassembling the first separable portions, or its respective petal segments are assembled in the circumferential direction by combining the first separable portions; and the second disassembly device is fixed to the second rotary body and includes at least two second separable portions, and the second rotary body is split into petals in the circumferential direction by disassembling the second separable portions, or its respective petal segments are assembled in the circumferential direction by combining the second separable portions.

Abstract: An assembly method and a fixing device for an electric motor are provided. The assembly method includes: carrying out preparation, wherein a stator of the electric motor is segmented, in the circumferential direction, into at least two stator segments, and a rotor of the electric motor is segmented, in the circumferential direction, into at least two rotor segments; carrying out pre-assembly, wherein the stator segments and the rotor segments are coaxially fixed to fixing devices to form segment modules, and predetermined gaps are maintained radially between the stator segments and the rotor segments; carrying out adjustment, wherein at least two fixing devices are moved and adjusted such that the stator segment and the rotor segment of the adjacent segment modules are mutually attached and aligned with each other along segmental end faces in the circumferential direction; carrying out assembly; and carrying out dismounting, and dismounting the fixing devices.

Abstract: Provided herein is to a method and a system for sharing electronic medical and health records. The method is operated in a serving system with a database. The system provides a software program executed by a terminal device. In the method, the serving system receives a connection request from the terminal device and verifies a user blockchain ID. The system provides one or more medical-health record indexes after the verification. When receiving an instruction for sharing medical-health record from the terminal device, the system generates a trust anchor for the terminal device. The trust anchor is provided for the terminal device to share with a shared recipient. When receiving an authorization message from the shared recipient, the system transmits the medical-health records to be shared to the shared recipient after verifying the blockchain ID and the authorization message.

Abstract: A switch structure connectable with both bare lead and flat-head terminal lead. The switch structure includes a main body formed with at least one cavity. A retainer member and a conductive metal member are arranged in the cavity for pressing the terminal lead into electrical connection with the conductive metal member. A reciprocally movable carrier body is assembled with the retainer member. The carrier body has an arm assembled with an elastic member. A restriction body is disposed in the cavity. The restriction body is formed with a chamber for receiving the arm and the elastic member of the carrier body. The restriction body restricts the moving direction or distance of the carrier body to increase the structural strength of the switch structure and enhance the lead locking ability of the switch structure.

Abstract: A method for forming a semiconductor device includes forming a capacitor bottom plate and a metal interconnect feature on a substrate. A dielectric layer having a predetermined thickness is then formed. The dielectric layer has a first portion overlying the capacitor bottom plate and a second portion overlying the metal interconnect feature. A thickness of the first portion of the dielectric layer is adjusted by either reducing the thickness or depositing additional dielectric material. A capacitor top plate is formed over the first portion of the dielectric layer.

Abstract: A method for forming a semiconductor device includes forming a capacitor bottom plate and a metal interconnect feature on a substrate. A dielectric layer having a predetermined thickness is then formed. The dielectric layer has a first portion overlying the capacitor bottom plate and a second portion overlying the metal interconnect feature. A thickness of the first portion of the dielectric layer is adjusted by either reducing the thickness or depositing additional dielectric material. A capacitor top plate is formed over the first portion of the dielectric layer.

Abstract: A method for forming a metal-insulator-metal (MIM) capacitor includes forming a capacitor bottom plate and a metal interconnect feature on a substrate. A dielectric layer having a predetermined thickness is then formed. The dielectric layer has a first portion overlying the capacitor bottom plate and a second portion overlying the metal interconnect feature. The dielectric layer is processed to adjust the thickness of the first portion of the dielectric layer relative the thickness of the second portion of the dielectric layer. Processing can include etching the first portion of the dielectric layer or adding dielectric material to the second portion of the dielectric layer. A capacitor top plate is formed over the first portion of the dielectric layer to complete the MIM structure.

Abstract: A switch structure connectable with both bare lead and flat-head terminal lead. The switch structure includes a main body formed with at least one cavity. A retainer member and a conductive metal member are arranged in the cavity for pressing the terminal lead into electrical connection with the conductive metal member. A reciprocally movable carrier body is assembled with the retainer member. The carrier body has an arm assembled with an elastic member. A restriction body is disposed in the cavity. The restriction body is formed with a chamber for receiving the arm and the elastic member of the carrier body. The restriction body restricts the moving direction or distance of the carrier body to increase the structural strength of the switch structure and enhance the lead locking ability of the switch structure.

Abstract: A method for forming a metal-insulator-metal (MIM) capacitor includes forming a capacitor bottom plate and a metal interconnect feature on a substrate. A dielectric layer having a predetermined thickness is then formed. The dielectric layer has a first portion overlying the capacitor bottom plate and a second portion overlying the metal interconnect feature. The dielectric layer is processed to adjust the thickness of the first portion of the dielectric layer relative the thickness of the second portion of the dielectric layer. Processing can include etching the first portion of the dielectric layer or adding dielectric material to the second portion of the dielectric layer. A capacitor top plate is formed over the first portion of the dielectric layer to complete the MIM structure.

Abstract: A method for forming a metal-insulator-metal (MIM) capacitor includes forming a capacitor bottom plate and a metal interconnect feature on a substrate. A dielectric layer having a predetermined thickness is then formed. The dielectric layer has a first portion overlying the capacitor bottom plate and a second portion overlying the metal interconnect feature. The dielectric layer is processed to adjust the thickness of the first portion of the dielectric layer relative the thickness of the second portion of the dielectric layer. Processing can include etching the first portion of the dielectric layer or adding dielectric material to the second portion of the dielectric layer. A capacitor top plate is formed over the first portion of the dielectric layer to complete the MIM structure.

Abstract: A method for forming a metal-insulator-metal (MIM) capacitor includes forming a capacitor bottom plate and a metal interconnect feature on a substrate. A dielectric layer having a predetermined thickness is then formed. The dielectric layer has a first portion overlying the capacitor bottom plate and a second portion overlying the metal interconnect feature. The dielectric layer is processed to adjust the thickness of the first portion of the dielectric layer relative the thickness of the second portion of the dielectric layer. Processing can include etching the first portion of the dielectric layer or adding dielectric material to the second portion of the dielectric layer. A capacitor top plate is formed over the first portion of the dielectric layer to complete the MIM structure.

Abstract: A slide selector switch mechanism for use within slide switches for controlling electrical circuits includes a detent spring centrally connected to a slide actuator member and to opposite ends of a movable bridging contactor. The detent spring provides contact pressure for effecting adequate pressurized electrical engagement of the contactor with underlying fixed terminal contact elements. The detent spring also functions as a separate actuating member for causing pivotal movement of the bridging contactor.