Abstract: A button module with vibration feedback and fingerprint sensing, a fingerprint sensing module for the same, and a control method for the same are provided. The fingerprint sensing module has a fingerprint sensing unit stacked on a vibration unit. When the fingerprint sensing module detects a fingerprint, the control unit or a host of an electronic device determines whether the fingerprint is authenticated. If it is not authenticated, the vibration unit is activated, so that the user realizes that the authentication is not passed in real time through the vibration. Then the user may quickly change another finger or move the finger's position to speed up the authentication process. This can prevent users from waiting to improve user experience.

Abstract: A button module with vibration feedback and fingerprint sensing, a fingerprint sensing module for the same, and a control method for the same are provided. The fingerprint sensing module has a fingerprint sensing unit stacked on a vibration unit. When the fingerprint sensing module detects a fingerprint, the control unit or a host of an electronic device determines whether the fingerprint is authenticated. If it is not authenticated, the vibration unit is activated, so that the user realizes that the authentication is not passed in real time through the vibration. Then the user may quickly change another finger or move the finger's position to speed up the authentication process. This can prevent users from waiting to improve user experience.

Abstract: A pointing stick module comprising: a sensing device; a rank unit; a transmission device and a controller. The transmission device is coupled to the sensing device and the rank unit. Also, the controller is coupled to the transmission device and coupled to the rank unit via the transmission device. The controller obtains a rank signal via detecting the rank unit, and determines a rank of the sensing device according to the rank signal.

Abstract: An electronic system is provided, which includes a mainboard, a pointing stick and a touchpad module, a first transmission path and a second transmission path. The mainboard is disposed with a first connecting unit. The pointing stick is connected to the first connecting unit through a transmission line. The touchpad module includes a circuit board, a second connecting unit and a controller. The circuit board includes a touch sensor. The first transmission path and the second transmission path are connected between the first connecting unit and the second connecting unit. The sensing signal outputted by the pointing stick is transmitted to the controller through the transmission line, the first connecting unit, the first transmission path and the second connecting unit. The output signal of the controller is transmitted to the mainboard through the second connecting unit, the second transmission path and the first connecting unit.

Abstract: An electronic system is provided, which includes a mainboard, a pointing stick and a touchpad module, a first transmission path and a second transmission path. The mainboard is disposed with a first connecting unit. The pointing stick is connected to the first connecting unit through a transmission line. The touchpad module includes a circuit board, a second connecting unit and a controller. The circuit board includes a touch sensor. The first transmission path and the second transmission path are connected between the first connecting unit and the second connecting unit. The sensing signal outputted by the pointing stick is transmitted to the controller through the transmission line, the first connecting unit, the first transmission path and the second connecting unit. The output signal of the controller is transmitted to the mainboard through the second connecting unit, the second transmission path and the first connecting unit.

Abstract: A pointing stick module comprising: a sensing device; a rank unit; a transmission device and a controller. The transmission device is coupled to the sensing device and the rank unit. Also, the controller is coupled to the transmission device and coupled to the rank unit via the transmission device. The controller obtains a rank signal via detecting the rank unit, and determines a rank of the sensing device according to the rank signal.

Abstract: A processing circuit of a reset signal is provided. The processing circuit receives the reset signal via a reset end. The processing circuit includes a multiplexer, an inverter and a switching unit. The multiplexer has an output end, a first input end and a second input end. The multiplexer is utilized for connecting the output end to the first input end or the second input end according to a selection signal. The inverter is coupled to the second input end of the multiplexer. The switching unit is coupled to the reset end for receiving the reset signal and connecting the reset end to the first input end of the multiplexer or the inverter according to the selection signal.

Abstract: A method for manufacturing a capacitive touch panel has steps of providing a substrate, delimiting at least one preset zone on the substrate, forming multiple first-axis sensing units and multiple second-axis sensing units on one of the surfaces of the substrate, forming at least one set of connection circuit and at least one die pad on the other surface of the substrate, forming multiple first conductive vias through the substrate with at least one of the first conductive vias located within the preset zone for the second-axis sensing units to be mutually connected by the first conductive vias to form multiple second-axis sensing lines, and bonding a controller with an LQFP (Low Profile Quad) package or a TQFP (Thin Quad Flat) package on the at least one die pad within the preset zone to ensure enough space available to form the at least one first conductive via on the bottom of the controller.

Abstract: A method for manufacturing a capacitive touch panel has steps of providing a substrate, delimiting at least one preset zone on the substrate, forming multiple first-axis sensing units and multiple second-axis sensing units on one of the surfaces of the substrate, forming at least one set of connection circuit and at least one die pad on the other surface of the substrate, forming multiple first conductive vias through the substrate with at least one of the first conductive vias located within the preset zone for the second-axis sensing units to be mutually connected by the first conductive vias to form multiple second-axis sensing lines, and bonding a controller with an LQFP (Low Profile Quad) package or a TQFP (Thin Quad Flat) package on the at least one die pad within the preset zone to ensure enough space available to form the at least one first conductive via on the bottom of the controller.