Patents by Inventor Nan Ni

Nan Ni has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080189486
    Abstract: USB flash memory devices with an improved cap are described. According to an exemplary embodiment of the invention, a USB flash memory device comprises a flash memory drive, an improved cap, a cap plug and a wire loop. The flash memory drive comprises a core unit and an outer shell structure. The cap comprises a substantially slab-shaped hollow structure with rounded edges and rounded corners, having an open end and a closed end, two opposing side walls, a top surface and a bottom surface. The cap is configured to substantially encase the entire flash memory drive through the open end, when the flash memory drive is in a closed configuration. The cap plug is configured to plug into the cap, when the flash memory drive is in an open configuration. The wire loop is configured to link the flash memory drive and the cap plug together in one location.
    Type: Application
    Filed: October 30, 2007
    Publication date: August 7, 2008
    Applicant: SUPER TALENT ELECTRONICS, INC.
    Inventors: David Nguyen, Nan Nan, Jim Chin-Nan Ni, Charles C. Lee, Ming-Shiang Shen
  • Publication number: 20080185694
    Abstract: Portable electronic storage device (PESD) manufacturing methods utilizing lead frames are described. According to one exemplary embodiment, a process of manufacturing core unit of PESD comprises: producing a processed flash memory IC chip with several metal contact pads and at least one passive component located on top layer; pre-fabricating a lead frame having opposing first and second surfaces, a plurality of metal connectors disposed on the first surface and a cavity through both surfaces; attaching the top layer of the processed flash memory IC chip onto the first surface such that the metal connectors are electrically connected to the respective metal contact pads and the cavity provides an non-conductive space for the at least one passive component; and forming a molded enclosure on both surfaces of the lead frame to form a core unit, the mold enclosure is configured such that the connectors are exposed according to one of the PESD standards.
    Type: Application
    Filed: October 15, 2007
    Publication date: August 7, 2008
    Applicant: SUPER TALENT ELECTRONICS, INC.
    Inventors: Siew Sin Hiew, Jim Chin-Nan Ni, Abraham Chih-Kang Ma, Ming-Shiang Shen
  • Publication number: 20080160802
    Abstract: In one embodiment of the present invention, a universal serial bus (USB) flash drive rotary device is disclosed to include a plastic frame including a USB flash drive and a USB plug connector and a rotary tube at least partially enclosing said plastic frame for deploying said USB plug connector, the USB flash drive is coupled to the USB plug connector, the rotary tube is turned to retract said USB plug connector, the USB flash drive rotary device is for deploying the USB plug connector to couple the USB flash drive to a USB port.
    Type: Application
    Filed: June 28, 2007
    Publication date: July 3, 2008
    Applicant: SUPER TALENT ELECTRONICS, INC.
    Inventors: Jim Chin-Nan Ni, Nan Nan, Charles Chung Lee, David Nguyen
  • Publication number: 20080151487
    Abstract: A memory module assembly includes a heat-sink plate attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The heat-sink plate includes an elongated base structure, a first contact plate extending away from the base structure such that a step-like positioning surface is defined therebetween, and heat-exchange fins extending from the opposite side of the base structure. An optional upper heat-sink plate is secured to a second side of the PCBA by a second adhesive layer, and contacts the lower heat-sink plate to facilitate heat transfer to the heat-exchange fins. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive.
    Type: Application
    Filed: March 4, 2008
    Publication date: June 26, 2008
    Applicant: Super Talent Electronics, Inc.
    Inventors: Jim Chin-Nan Ni, Abraham C. Ma, Paul Hsueh
  • Patent number: 7365699
    Abstract: A dipole array is provided for use as an Ultra Short Pulse (USP) transmitter or receiver in UWB communications systems, which reduces the output pulse dispersion. Instead of having all the dipole elements serially fed by a transmission line, the feeding in the array is made independently through a central point and the radiation is emitted and received broadsided with respect to the array plane. This configuration minimizes the relative time delay between radiating resonance frequencies.
    Type: Grant
    Filed: May 17, 2005
    Date of Patent: April 29, 2008
    Assignee: New Jersey Institute of Technology
    Inventors: Haim Grebel, Nan Ni
  • Publication number: 20080062154
    Abstract: A digital flat panel display includes a case, a display module and an electrical control system. The electrical control system comprises a signal-input terminal to connect with the display module for receiving signals. A signal input/output module is located at the upper area of the signal-input terminal to process the I/O signals. A signal transform module is located at the upper area of the signal-input terminal to convert the analog signals to the digital signals and a power supply module is located at least one upper position of the signal transform module to transform a power source and provide the power source for the signals operation.
    Type: Application
    Filed: November 3, 2006
    Publication date: March 13, 2008
    Inventors: Chih-hsien Chang, Pai-Nan Ni
  • Patent number: 7297024
    Abstract: A metal-wrapped flash-memory-drive device has an integrated slim Universal-Serial-Bus (USB) connector that fits into a standard USB socket. The slim USB connector has 4 metal contacts on a circuit board that is encapsulated by a plastic case. Components are mounted onto the circuit board. A metal wrap conforms to the general shape of a plastic sub-assembly of the plastic case and a plastic cover that enclose the circuit board. The metal wrap can be bent around the plastic sub-assembly in a forming process, or can be pre-formed into a metal tube that the plastic sub-assembly is inserted into. Alignment holes in the metal wrap can fit over plastic stubs on the plastic sub-assembly, or friction can hold the metal wrap to the plastic sub-assembly. The plastic cover and case can be bonded together by molding, ultrasonically, with adhesive films, or using snaps to form the plastic sub-assembly.
    Type: Grant
    Filed: April 12, 2005
    Date of Patent: November 20, 2007
    Assignee: Super Talent Electronics, Inc.
    Inventors: Jim Chin-Nan Ni, Ren-Kang Chiou
  • Publication number: 20070253334
    Abstract: A computer implemented method, data processing system, and computer usable program code are provided for routing a packet in a switch system. A set of paths through the switch system to a destination address are determined. The set of paths are analyzed to identify a path with a least used link, where the least used link leads to a next stage of the switch system. The routing to the destination address is set through the path with the least used link to form a selected path in order to improve congestion control and load balancing in response to identifying the path with a least used link.
    Type: Application
    Filed: April 26, 2006
    Publication date: November 1, 2007
    Inventors: Chetan Mehta, Nan Ni
  • Patent number: 7094074
    Abstract: A flash-memory-drive card has an integrated slim Universal-Serial-Bus (USB) connector that fits into a standard USB socket. The slim USB connector has 4 metal contacts on a board that is encapsulated by upper and lower plastic cases. Components are mounted onto the board on the side opposite the metal contacts. A thinner portion of the plastic case forms a light window that allows a light-emitting diode on the board to shine through the case. The plastic cases can be bonded together ultrasonically or with adhesive or using snaps and groves. Supporting underside ribs in the lower plastic case opposite the metal contacts allow most of the card to be thinner than the spacing in the standard USB socket. Dividers between the metal contacts are formed between openings in the upper case. The dividers help to fill gaps between the slim USB connector and the standard USB socket.
    Type: Grant
    Filed: October 28, 2004
    Date of Patent: August 22, 2006
    Assignee: Super Talent Electronics, Inc.
    Inventors: Ren-Kang Chiou, Jim Chin-Nan Ni
  • Patent number: 7044802
    Abstract: A flash-memory-drive card has a Universal-Serial-Bus (USB) connector. The card has a printed-circuit board (PCB) that fits into a perimeter frame that surrounds the edges of the PCB. Metal or plastic upper and lower covers are snapped onto the frame to encapsulate the PCB. The USB connector can be a Full USB connector plug that extends from the perimeter frame and has a centerline approximately matching the PCB centerline for a balanced design, or can be a slim or reduced-height USB connector plug that has a frame closure bar that fits inside closure fittings on the perimeter frame. The USB connector can also be made from a frame extension that has four frame slots through the frame. The PCB has four PCB fingers that are inserted through the frame slots during assembly so that the PCB fingers fit within depressions in the frame extension to form the USB connector plug.
    Type: Grant
    Filed: December 27, 2004
    Date of Patent: May 16, 2006
    Assignee: Super Talent Electronics, Inc.
    Inventors: Ren-Kang Chiou, Jim Chin-Nan Ni
  • Publication number: 20050259027
    Abstract: A dipole array is provided for use as an Ultra Short Pulse (USP) transmitter or receiver in UWB communications systems, which reduces the output pulse dispersion. Instead of having all the dipole elements serially fed by a transmission line, the feeding in the array is made independently through a central point and the radiation is emitted and received broadsided with respect to the array plane. This configuration minimizes the relative time delay between radiating resonance frequencies.
    Type: Application
    Filed: May 17, 2005
    Publication date: November 24, 2005
    Inventors: Haim Grebel, Nan Ni