Patents by Inventor Nan Soo Kim

Nan Soo Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composition for organic electronic element encapsulant and encapsulant formed using same
    Patent number: 10858517
    Abstract: A composition for an encapsulant according to an exemplary embodiment of the present invention comprises: 1) a first copolymer comprising the first unit represented by Chemical Formula 1, the second unit represented by Chemical Formula 2, and the third unit represented by Chemical Formula 3; 2) a second copolymer comprising the second unit represented by Chemical Formula 2 and the third unit represented by Chemical Formula 3; 3) one or more photoinitiators; and 4) a compound capable of dissolving the photoinitiators.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: December 8, 2020
    Assignee: MOMENTIVE PERFORMANCE MATERIALS KOREA CO., LTD.
    Inventors: Sun Yu, Nan Soo Kim, Minjae Jeong, Jang Hee Lee
  • Composition for organic electronic element encapsulant and encapsulant formed using same
    Patent number: 10836907
    Abstract: The present invention relates to a composition for an organic electronic device encapsulant and an encapsulant formed by using the same. A composition for an encapsulant according to the present invention comprises: 1) a first copolymer comprising the first unit represented by Chemical Formula 1, the second unit represented by Chemical Formula 2, and the third unit represented by Chemical Formula 3; 2) a silicone urethane methacrylate-based polymer comprising the second unit represented by Chemical Formula 2 as a main unit; and 3) one or more photoinitiators.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: November 17, 2020
    Assignee: Momentive Performance Materials Korea Co., Ltd.
    Inventors: Sun Yu, Nan Soo Kim, Minjae Jeong
  • Composition for organic electronic element encapsulant, and encapsulant formed using same
    Patent number: 10822523
    Abstract: The present invention relates to a composition for an organic electronic device encapsulant and an encapsulant formed by using the same. A composition for an encapsulant according to an exemplary embodiment of the present invention includes: 1) a first copolymer including the first unit represented by Chemical Formula 1, the second unit represented by Chemical Formula 2, and the third unit represented by Chemical Formula 3; 2) a second copolymer including the second unit represented by Chemical Formula 2 and the third unit represented by Chemical Formula 3; and 3) one or more photoinitiators.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: November 3, 2020
    Assignee: Momentive Performance Materials Korea Co., Ltd.
    Inventors: Sun Yu, Nan Soo Kim, Minjae Jeong, Sunaga Takeshi
  • Composition for organic electronic device encapsulant and encapsulant formed using same
    Patent number: 10618997
    Abstract: A composition for an encapsulant according to an embodiment of the present application comprises: 1) a silicone resin; 2) one or more moisture absorbents; 3) one or more photoinitiators; and 4) a monomer capable of dissolving the photoinitiators.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: April 14, 2020
    Assignee: Momentive Performance Materials Korea Co., Ltd.
    Inventors: Hyun-Sang Choi, Sun Yu, Nan Soo Kim
  • Composition for organic electronic element encapsulant, and encapsulant formed by using same
    Patent number: 10619048
    Abstract: A composition for an encapsulant according to one embodiment of the present application comprises 1) a silicone resin, 2) one or more types of moisture absorbent, 3) one or more types of photoinitiator, 4) one or more types of fillers, and 5) a reactive silicone oligomer.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: April 14, 2020
    Assignee: Momentive Performance Materials Korea Co., Ltd.
    Inventors: Sun Yu, Hyun-Sang Choi, Nan Soo Kim
  • COMPOSITION FOR ORGANIC ELECTRONIC ELEMENT ENCAPSULANT AND ENCAPSULANT FORMED USING SAME
    Publication number: 20200062962
    Abstract: A composition for an encapsulant according to an exemplary embodiment of the present invention comprises: 1) a first copolymer comprising the first unit represented by Chemical Formula 1, the second unit represented by Chemical Formula 2, and the third unit represented by Chemical Formula 3; 2) a second copolymer comprising the second unit represented by Chemical Formula 2 and the third unit represented by Chemical Formula 3; 3) one or more photoinitiators; and 4) a compound capable of dissolving the photoinitiators.
    Type: Application
    Filed: December 6, 2017
    Publication date: February 27, 2020
    Applicant: Momentive Performance Materials Korea Co., Ltd.
    Inventors: Sun YU, Nan Soo KIM, Minjae JEONG, Jang Hee LEE
  • COMPOSITION FOR ORGANIC ELECTRONIC ELEMENT ENCAPSULANT AND ENCAPSULANT FORMED USING SAME
    Publication number: 20200056041
    Abstract: The present invention relates to a composition for an organic electronic device encapsulant and an encapsulant formed by using the same. A composition for an encapsulant according to the present invention comprises: 1) a first copolymer comprising the first unit represented by Chemical Formula 1, the second unit represented by Chemical Formula 2, and the third unit represented by Chemical Formula 3; 2) a silicone urethane methacrylate-based polymer comprising the second unit represented by Chemical Formula 2 as a main unit; and 3) one or more photoinitiators.
    Type: Application
    Filed: November 28, 2017
    Publication date: February 20, 2020
    Inventors: Sun Yu, Nan Soo Kim, Minjae Jeong
  • Encapsulation composition for organic electronic device, and encapsulation formed using same
    Patent number: 10553824
    Abstract: The present invention relates to a composition for an organic electronic device encapsulant and an encapsulant formed by using the same. A composition for an encapsulant according to an exemplary embodiment of the present invention comprises: 1) a first copolymer comprising the first unit represented by Chemical Formula 1, the second unit represented by Chemical Formula 2, and the third unit represented by Chemical Formula 3; 2) a second copolymer comprising the second unit represented by Chemical Formula 2 and the third unit represented by Chemical Formula 3; 3) one or more photoinitiators; 4) a reactive silicone-based oligomer; and 5) a silicone acrylate-based compound.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: February 4, 2020
    Assignee: Momentive Performance Materials Korea Co., Ltd.
    Inventors: Sun Yu, Nan Soo Kim, Minjae Jeong, Sunaga Takeshi
  • ENCAPSULATION COMPOSITION FOR ORGANIC ELECTRONIC DEVICE, AND ENCAPSULATION FORMED USING SAME
    Publication number: 20190341579
    Abstract: The present invention relates to a composition for an organic electronic device encapsulant and an encapsulant formed by using the same. A composition for an encapsulant according to an exemplary embodiment of the present invention comprises: 1) a first copolymer comprising the first unit represented by Chemical Formula 1, the second unit represented by Chemical Formula 2, and the third unit represented by Chemical Formula 3; 2) a second copolymer comprising the second unit represented by Chemical Formula 2 and the third unit represented by Chemical Formula 3; 3) one or more photoinitiators; 4) a reactive silicone-based oligomer; and 5) a silicone acrylate-based compound.
    Type: Application
    Filed: December 20, 2017
    Publication date: November 7, 2019
    Inventors: Sun Yu, Nan Soo Kim, Minjae Jeong, Sunaga Takeshi
  • COMPOSITION FOR ORGANIC ELECTRONIC ELEMENT ENCAPSULANT, AND ENCAPSULANT FORMED USING SAME
    Publication number: 20190194492
    Abstract: The present invention relates to a composition for an organic electronic device encapsulant and an encapsulant formed by using the same. A composition for an encapsulant according to an exemplary embodiment of the present invention includes: 1) a first copolymer including the first unit represented by Chemical Formula 1, the second unit represented by Chemical Formula 2, and the third unit represented by Chemical Formula 3; 2) a second copolymer including the second unit represented by Chemical Formula 2 and the third unit represented by Chemical Formula 3; and 3) one or more photoinitiators.
    Type: Application
    Filed: September 26, 2017
    Publication date: June 27, 2019
    Inventors: Sun Yu, Nan Soo Kim, Minjae Jeong, Sunaga Takeshi
  • COMPOSITION FOR ORGANIC ELECTRONIC DEVICE ENCAPSULANT AND ENCAPSULANT FORMED USING SAME
    Publication number: 20190071531
    Abstract: A composition for an encapsulant according to an embodiment of the present application comprises: 1) a silicone resin; 2) one or more moisture absorbents; 3) one or more photoinitiators; and 4) a monomer capable of dissolving the photoinitiators.
    Type: Application
    Filed: October 19, 2018
    Publication date: March 7, 2019
    Inventors: Hyun-Sang Choi, Sun Yu, Nan Soo Kim
  • COMPOSITION FOR ORGANIC ELECTRONIC ELEMENT ENCAPSULANT, AND ENCAPSULANT FORMED BY USING SAME
    Publication number: 20190058125
    Abstract: A composition for an encapsulant according to one embodiment of the present application comprises 1) a silicone resin, 2) one or more types of moisture absorbent, 3) one or more types of photoinitiator, 4) one or more types of fillers, and 5) a reactive silicone oligomer.
    Type: Application
    Filed: October 19, 2018
    Publication date: February 21, 2019
    Inventors: Sun Yu, Hyun-Sang Choi, Nan Soo Kim
  • COMPOSITION FOR ORGANIC ELECTRONIC ELEMENT ENCAPSULANT, AND ENCAPSULANT FORMED BY USING SAME
    Publication number: 20190048119
    Abstract: A composition for an encapsulant according to one embodiment of the present application comprises 1) a silicone resin, 2) one or more types of moisture absorbent, 3) one or more types of photoinitiator, 4) one or more types of fillers, and 5) a reactive silicone oligomer.
    Type: Application
    Filed: October 19, 2018
    Publication date: February 14, 2019
    Inventors: Sun Yu, Hyun-Sang Choi, Nan Soo Kim
  • COMPOSITION FOR ORGANIC ELECTRONIC DEVICE ENCAPSULANT AND ENCAPSULANT FORMED USING THE SAME
    Publication number: 20170352836
    Abstract: The present application relates to a composition for an encapsulant and an encapsulant formed using the same. The composition for an encapsulant according to one embodiment of the present application includes 1) a silicone resin; 2) one or more types of moisture absorbents; and 3) one or more types of photoinitiators.
    Type: Application
    Filed: July 31, 2017
    Publication date: December 7, 2017
    Inventors: Sun Yu, Hyun-Sang Choi, Nan Soo Kim, Seong-Gi Kim