Abstract: A Quad Flat Non-leaded (QFN) semiconductor package has a semiconductor die mounted on a die flag of a lead frame. A molded housing with a base and sides covers the die. The package has electrically conductive mounting feet each of which includes an exposed base surface in the base of the housing, an opposite parallel surface covered by the housing, and an exposed end surface in the one of the sides of the housing. The exposed end surface is normal to, and located between, the exposed base surface and the opposite parallel surface. Bond wires selectively electrically connect electrodes of the die to respective ones of the mounting feet. An electrically conductive plating coats the exposed base portion and exposed end surface of the mounting feet.

Abstract: A Quad Flat Non-leaded (QFN) semiconductor die package has a semiconductor die mounted on a die flag of a lead frame. A covers the semiconductor die. The housing has a base and sides. There are electrically conductive mounting feet, each of which has an exposed base portion in the base of the housing and an exposed side portion in the one of the sides of the housing. Bond wires electrically connect electrodes of the semiconductor die to respective ones of the mounting feet.

Abstract: The present invention aims to provide a mechanoluminescent material which is excellent in mechanoluminescent properties and can achieve a mechanoluminescence intensity sufficiently suited to practical use, a raw material composition for producing the mechanoluminescent material, and a method for producing a mechanoluminescent material. The mechanoluminescent material of the present invention includes strontium aluminate as a base material, a Eu ion, and at least one ion selected from the group consisting of Nd, Dy, and Ho. An amount of the Eu ion contained in the mechanoluminescent material is 0.0001 to 0.1 mol per mole of the strontium aluminate. An amount of the at least one ion selected from the group consisting of Nd, Dy, and Ho contained in the mechanoluminescent material is, as the sum of amounts of the three ions Nd, Dy, and Ho, 0.0001 to 0.01 mol per mole of the strontium aluminate.

Abstract: A method for assembling a packaged semiconductor device includes mounting a pressure-sensing die onto a die paddle of a metal lead frame. A pressure-sensitive gel is dispensed into a recess of a lid, and the lead frame is mated with the lid such that the pressure-sensing die is immersed in the pressure-sensitive gel within the recess of the lid.

Abstract: A crystal form I of (S)-4-hydroxy-2-oxo-1-pyrrolidine acetamide, or named (S)-oxiracetam, is provided, which is characterized by a powder x-ray diffraction pattern that exhibits data of d-values versus the relative intensities as: 7.075(M), 5.355(S), 5.092(S), 4.590(M), 4.325(M), 4.259(S), 4.041(VS), 3.808(M), 3.542(M), 3.445(M), 3.393(M), 2.972(M), 2.914(S). A method for preparing a crystal form I of (S)-oxiracetam is also provided, which includes preparing the crude product and crystallizing A use of the crystal form I of (S)-oxiracetam in the manufacture of a medicament for preventing and treating memory dysfunction is also provided. Accordingly, the crystal form I of (S)-oxiracetam prepared by the method has high purity of more than 99.3% based on the percentages of the mass, with better efficacy than (S)-oxiracetam for preventing or treating memory dysfunction.

Abstract: Designs and techniques of Composite Right-Left Handed (CRLH) Metamaterial (MTM) antenna devices, including a CRLH MTM devices that include MTM cells formed on a substrate and a conductive launch stub formed on the substrate to be adjacent to each of the MTM cells and electromagnetically coupled to each of the MTM cells.

Abstract: An apparatus including an antenna having an active element and a parasitic element; and at least one support, where the antenna is at least partially on the at least one support, where the at least one support includes a first section coupled to a second different section, where the active element is at least partially on the first section, and where the first section is at least partially formed with a first manufacturing process and a first material. The parasitic element is at least partially on the second section, and the second section is at least partially formed with a second different manufacturing process and a second different material.

Abstract: An apparatus including an antenna having an active element and a parasitic element; and at least one support, where the antenna is at least partially on the at least one support, where the at least one support includes a first section coupled to a second different section, where the active element is at least partially on the first section, and where the first section is at least partially formed with a first manufacturing process and a first material. The parasitic element is at least partially on the second section, and the second section is at least partially formed with a second different manufacturing process and a second different material.

Abstract: An apparatus including an antenna; a first antenna carrier forming a first support substrate for a first portion of the antenna; and a different second antenna carrier forming a second support substrate for a second portion of the antenna. The first and second antenna carriers are coupled to each other. The antenna extends across a joint between the first and second antenna carriers.

Abstract: A method for detecting the integrity of a bond of a multi-piece work piece includes capturing a first image of the work piece, stressing the work piece, capturing a stressed image of the work piece, and comparing the first image of the work piece with the stressed image of the work piece to determine the integrity of the bond.

Abstract: A method of assembling semiconductor devices includes placing an array of semiconductor dies on a die support. A cap array structure is provided that has a corresponding array of caps supported by a cap frame structure. The cap array structure and the array of semiconductor dies on the die support are aligned, with the caps extending over corresponding semiconductor dies, in a mold chase. The array of semiconductor dies and the array of caps are encapsulated with a molding compound in the mold chase. The encapsulated units of the semiconductor dies with the corresponding caps are removed from the mold chase and singulated. Singulating the encapsulated units may include removing the cap frame structure from the encapsulated units.

Abstract: A semiconductor device has first and semiconductor dies having active faces presenting electrical contact elements and back faces attached to first and second bonding areas side by side on an electrically conductive die support. A layer of electrically insulating material is applied to the first bonding area of the die support. A layer of electrically insulating adhesive bonding material attaches the back face of the first semiconductor die to the first bonding area of the die support through the layer of electrically insulating material. A layer of electrically conductive adhesive bonding material attaches the back face of the second semiconductor die to the second bonding area of the die support.

Abstract: Antennas for wireless communications based on metamaterial (MTM) structures to arrange one or more antenna sections of an MTM antenna away from one or more other antenna sections of the same MTM antenna so that the antenna sections of the MTM antenna are spatially distributed in a non-planar configuration to provide a compact structure adapted to fit to an allocated space or volume of a wireless communication device, such as a portable wireless communication device.

Abstract: Antenna structures and configurations which incorporate alignment keys and support structures which mate Composite Right and Left Handed (CRLH) metamaterial (MTM) structures formed on two or more substrates.

Abstract: An antenna device, such as composite right and left handed (CRLH) antenna device, is formed on the substrate, including a ground electrode formed on the substrate. In an example, the antenna device includes a cell patch comprising an enclosed conductive portion formed along an exterior edge of the cell patch, leaving an interior portion of the cell patch to partially expose the substrate. A feed structure is electromagnetically coupled to the cell patch, a via line is coupled to the ground electrode, and a via couples the via line to the cell patch.

Abstract: A process for assembling a Chip-On-Lead packaged semiconductor device includes the steps of: mounting and sawing a wafer to provide individual semiconductor dies; performing a first molding operation on a lead frame; depositing epoxy on the lead frame via a screen printing process; attaching one of the singulated dies on the lead frame with the epoxy, where the die attach is done at room temperature; and curing the epoxy in an oven. Throughput improvements may be ascribed to not including a hot die attach process. An optional plasma cleaning step may be performed, which greatly improves wire bonding quality and a second molding quality. In addition, since a first molding operation is performed before the formation of epoxy to avoid the problem of the epoxy hanging in the air, the delamination risk between the epoxy and the die is avoided.

Abstract: An apparatus including an antenna; a first antenna carrier forming a first support substrate for a first portion of the antenna; and a different second antenna carrier forming a second support substrate for a second portion of the antenna. The first and second antenna carriers are coupled to each other. The antenna extends across a joint between the first and second antenna carriers.

Abstract: Metamaterial antennas provide spatially varying electromagnetic coupling that enables impedance matching conditions for different operating frequencies of the MTM antennas so that such antennas can operate at different frequencies for wideband applications, including ultra wideband applications.

Abstract: A method for detecting the integrity of a bond of a multi-piece work piece includes capturing a first image of the work piece, stressing the work piece, capturing a stressed image of the work piece, and comparing the first image of the work piece with the stressed image of the work piece to determine the integrity of the bond.

Abstract: A crystal form I of (S)-4-hydroxy-2-oxo-1-pyrrolidine acetamide, or named (S)-oxiracetam, is provided, which is characterized by a powder x-ray diffraction pattern that exhibits data of d-values versus the relative intensities as: 7.075(M), 5.355(S), 5.092(S), 4.590(M), 4.325(M), 4.259(S), 4.041(VS), 3.808(M), 3.542(M), 3.445(M), 3.393(M), 2.972(M), 2.914(S). A method for preparing a crystal form I of (S)-oxiracetam is also provided, which includes preparing the crude product and crystallizing A use of the crystal form I of (S)-oxiracetam in the manufacture of a medicament for preventing and treating memory dysfunction is also provided. Accordingly, the crystal form I of (S)-oxiracetam prepared by the method has high purity of more than 99.3% based on the percentages of the mass, with better efficacy than (S)-oxiracetam for preventing or treating memory dysfunction.