Patents by Inventor Nanako Shinoda

Nanako Shinoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240153807
    Abstract: A substrate transfer method includes receiving first and second substrates by a pick of a first transfer device, detecting shift amounts of the first and second substrates, calculating a correction amount of a delivery position of the pick based on the shift amount of the first substrate, and moving the pick to the corrected delivery position to respectively deliver the first and second substrates to a first and second mounting sections, moving a first pick of a second transfer device to a receiving position of the first mounting section to receive the first substrate, calculating a correction amount of a receiving position of a second pick of the second transfer device based on the correction amount of the delivery position and the shift amount of the second substrate; and moving the second pick to the corrected receiving position of the second pick to receive the second substrate.
    Type: Application
    Filed: March 17, 2022
    Publication date: May 9, 2024
    Inventors: Nanako SHINODA, Shinya OKANO
  • Publication number: 20130180448
    Abstract: A substrate transfer device includes a pick which has positioning pins to position a substrate and holds a positioned substrate; a drive unit which drives the pick such that the substrate is loaded/unloaded to/from a vacuum processing unit by using a pick; and a transfer control unit which controls a transfer operation of the substrate using the pick. The transfer control unit obtains in advance information on a reference position of the substrate at room temperature when the substrate is loaded into the vacuum processing unit, calculates a positional deviation from the reference position of the substrate when the substrate is loaded into the vacuum processing unit in actual processing, and controls a drive unit such that the substrate is loaded into the vacuum processing unit by correcting the positional deviation.
    Type: Application
    Filed: July 13, 2012
    Publication date: July 18, 2013
    Applicant: Tokyo Electron Limited
    Inventors: Hiromitsu Sakaue, Masahito Ozawa, Yuichi Furuya, Nanako Shinoda, Katsuhito Hirose, Morihito Inagaki