Abstract: The heating apparatus includes a chamber configured to accommodate an object, a stage on which the object is placed and partitioning an internal space of the chamber into a lower region and an upper region, a heating mechanism configured to heat the object on the stage, and a gas supplier configured to supply gas to the lower region. The chamber has an outlet port being formed in the upper region. The stage includes a gap through which the gas supplied to the lower region by the gas supplier flows from the lower region to the upper region along a wall surface of the chamber. The method includes providing the object in the chamber, supplying the gas such that the gas flows from the lower region to the upper region along a wall surface of the chamber, and effecting a solder joint by increasing a temperature of the object.