Abstract: A polyamide composition comprising from 45 wt % to 95 wt % of polyamide polymer and from 5 wt % to 55 wt % of a modifier comprising a C18-44 dimer acid or a C18-44 dimer amine or a combination thereof. A number average molecular weight of the polyamide polymer is less than 30,000 g/mol. The polyamide composition has a chemical resistance, as measured by exposure to HCl (10%) for 14 days at 58° C., resulting in a weight loss of less than 3.0 wt %; and a moisture uptake of less than about 2.0 wt % moisture at 95% RH. A process for preparing the polyamide composition is also disclosed.

Abstract: A heat-stabilized polyamide composition comprising from 25 wt % to 90 wt %% of an amide polymer from 0.01 wt % to 10 wt % of a cerium-based heat stabilizer, a second heat stabilizer, a halide additive, and less than 0.3 wt % of a stearate additive. A weight ratio of halide additive to stearate additive is less than 45.0.