Patents by Inventor Nanbo KANG

Nanbo KANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11051393
    Abstract: A mobile terminal includes a circuit board, a heat emitting element disposed on the circuit board, a shielding can, and a middle frame, where the shielding can is connected to the circuit board, and forms a shielding space together with the circuit board; the heat emitting element is accommodated in the shielding space; the circuit board is disposed on one side of the middle frame; the middle frame is provided with an accommodating space; and the shielding can includes a top and a bottom that are disposed opposite to each other, where the bottom is configured to be connected to the circuit board, and the top is located above the heat emitting element and extends to the accommodating space. The present disclosure further provides a heat dissipation and shielding structure. The present disclosure helps make a mobile terminal and a heat dissipation and shielding structure lighter and thinner.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: June 29, 2021
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Zhiguo Zhang, Yingchun Zhang, Haitao Zhen, Nanbo Kang
  • Publication number: 20200205278
    Abstract: A mobile terminal includes a circuit board, a heat emitting element disposed on the circuit board, a shielding can, and a middle frame, where the shielding can is connected to the circuit board, and forms a shielding space together with the circuit board; the heat emitting element is accommodated in the shielding space; the circuit board is disposed on one side of the middle frame; the middle frame is provided with an accommodating space; and the shielding can includes a top and a bottom that are disposed opposite to each other, where the bottom is configured to be connected to the circuit board, and the top is located above the heat emitting element and extends to the accommodating space. The present disclosure further provides a heat dissipation and shielding structure. The present disclosure helps make a mobile terminal and a heat dissipation and shielding structure lighter and thinner.
    Type: Application
    Filed: March 3, 2020
    Publication date: June 25, 2020
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Zhiguo Zhang, Yingchun Zhang, Haitao Zhen, Nanbo Kang
  • Patent number: 10602603
    Abstract: A mobile terminal includes a circuit board, a heat emitting element disposed on the circuit board, a shielding can, and a middle frame, where the shielding can is connected to the circuit board, and forms a shielding space together with the circuit board; the heat emitting element is accommodated in the shielding space; the circuit board is disposed on one side of the middle frame; the middle frame is provided with an accommodating space; and the shielding can includes a top and a bottom that are disposed opposite to each other, where the bottom is configured to be connected to the circuit board, and the top is located above the heat emitting element and extends to the accommodating space. The present disclosure further provides a heat dissipation and shielding structure. The present disclosure helps make a mobile terminal and a heat dissipation and shielding structure lighter and thinner.
    Type: Grant
    Filed: June 4, 2015
    Date of Patent: March 24, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Zhiguo Zhang, Yingchun Zhang, Haitao Zhen, Nanbo Kang
  • Publication number: 20190364221
    Abstract: A camera control method and a terminal the method including starting, by a terminal, a first camera and a second camera, where the first camera and the second camera are located on a same side of the terminal, and where the first camera operates in a first operating state, and switching the first camera from the first operating state to a second operating state in response to an operating parameter of the terminal meeting a preset condition, where the second operating state is a low power consumption state or a closed state.
    Type: Application
    Filed: January 11, 2017
    Publication date: November 28, 2019
    Inventors: Linfang Jin, Siyang Li, Jiaju Liu, Nanbo Kang
  • Patent number: 10130005
    Abstract: An electronic product, including: a housing, where an air vent is disposed on the housing; a PCB board that is located inside the housing, where a positive electrode and a negative electrode of a power supply are disposed on the PCB board; a fan that is located between the PCB board and the housing; and a switch bar that is located between the fan and the housing and is connected to the housing in a sliding manner, where the switch bar has a first state and a second state, where the switch bar includes a conductive area, when the switch bar is set to the first state, the conductive area is electrically connected to the positive electrode and the negative electrode of the power supply on the PCB board, the fan starts to run.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: November 13, 2018
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Lei Zhong, Linfang Jin, Jie Zou, Nanbo Kang
  • Patent number: 10088879
    Abstract: An intelligent terminal heat dissipation apparatus and an intelligent terminal are disclosed. The intelligent terminal heat dissipation apparatus includes at least one flexible heat pipe, where two ends of the flexible heat pipe are condensation ends, the middle of the flexible heat pipe is an evaporation end, the condensation end includes one or more heat pipe rigid parts and one or more heat pipe flexible parts, the one or more heat pipe rigid parts and the one or more heat pipe flexible parts of the condensation end are arranged alternately, the evaporation end includes at least one heat pipe rigid part, and an intelligent terminal body is mounted on the evaporation end. By using the intelligent terminal heat dissipation apparatus, flexible heat dissipation is implemented for a bendable device.
    Type: Grant
    Filed: June 12, 2014
    Date of Patent: October 2, 2018
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Linfang Jin, Nanbo Kang, Jie Zou, Xiaowei Hui
  • Publication number: 20180146539
    Abstract: A mobile terminal includes a circuit board, a heat emitting element disposed on the circuit board, a shielding can, and a middle frame, where the shielding can is connected to the circuit board, and forms a shielding space together with the circuit board; the heat emitting element is accommodated in the shielding space; the circuit board is disposed on one side of the middle frame; the middle frame is provided with an accommodating space; and the shielding can includes a top and a bottom that are disposed opposite to each other, where the bottom is configured to be connected to the circuit board, and the top is located above the heat emitting element and extends to the accommodating space. The present disclosure further provides a heat dissipation and shielding structure. The present disclosure helps make a mobile terminal and a heat dissipation and shielding structure lighter and thinner.
    Type: Application
    Filed: June 4, 2015
    Publication date: May 24, 2018
    Inventors: Zhiguo Zhang, Yingchun Zhang, Haitao Zhen, Nanbo Kang
  • Publication number: 20170290197
    Abstract: An electronic product, including: a housing, where an air vent is disposed on the housing; a PCB board that is located inside the housing, where a positive electrode and a negative electrode of a power supply are disposed on the PCB board; a fan that is located between the PCB board and the housing; and a switch bar that is located between the fan and the housing and is connected to the housing in a sliding manner, where the switch bar has a first state and a second state, where the switch bar includes a conductive area, when the switch bar is set to the first state, the conductive area is electrically connected to the positive electrode and the negative electrode of the power supply on the PCB board, the fan starts to run.
    Type: Application
    Filed: August 29, 2014
    Publication date: October 5, 2017
    Inventors: Lei Zhong, Linfang Jin, Jie Zou, Nanbo Kang
  • Publication number: 20170220082
    Abstract: An intelligent terminal heat dissipation apparatus and an intelligent terminal are disclosed. The intelligent terminal heat dissipation apparatus includes at least one flexible heat pipe, where two ends of the flexible heat pipe are condensation ends, the middle of the flexible heat pipe is an evaporation end, the condensation end includes one or more heat pipe rigid parts and one or more heat pipe flexible parts, the one or more heat pipe rigid parts and the one or more heat pipe flexible parts of the condensation end are arranged alternately, the evaporation end includes at least one heat pipe rigid part, and an intelligent terminal body is mounted on the evaporation end. By using the intelligent terminal heat dissipation apparatus, flexible heat dissipation is implemented for a bendable device.
    Type: Application
    Filed: June 12, 2014
    Publication date: August 3, 2017
    Inventors: Linfang JIN, Nanbo KANG, Jie ZOU, Xiaowei HUI