Abstract: A microelectronic component carrier package and method of its manufacture. A non-conducting component carrier having vertical risers and guide channels permits the rapid and accurate routing of microelectronic component leads with respect to the leadframe. Specially shaped perforations in the leadframe adjacent to and aligned with the guide channels receive the leads, strip away the necessary amount of insulation, and sever the leads to the proper length in one manufacturing process step. The leads are joined to the leadframe by an interference fit, conventional bonding technique (such as solder or thermal compression bonding), or other techniques. The perforations further provide for stress relief of the leads in the assembled package, and permit the joints between the leadframe and leads to reside outside of the package, thereby minimizing the overall volume of the package.