Patents by Inventor Nancy C. Eickman

Nancy C. Eickman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4732921
    Abstract: A flame-resistant polybutylene terephthalate molding composition has vastly improved fatigue strength and improved melt flow by incorporating therein a halogenated epoxy flame retardant represented by the general formula: ##STR1## wherein an n is the degree of polymerization and the halogenated epoxy resin has a molecular weight of at least about 20,000 to 40,000; X is a chlorine or bromine atom, and i is an integer of from 1-4.
    Type: Grant
    Filed: December 5, 1986
    Date of Patent: March 22, 1988
    Assignee: Hoechst Celanese Corporation
    Inventors: Arie Hochberg, Nancy C. Eickman, Frank Haimbach, IV
  • Patent number: 4720424
    Abstract: An improved thermoplastic molding composition is provided which is particularly suited for use in the impervious void-free encapsulation on a relatively expeditious basis of an electronic component wherein the preformed electronic component is positioned in a mold cavity prior to the introduction of the molding composition via injection molding. The molding composition comprises a melt processable thermotropic liquid crystalline polymer which is of a relatively low weight average molecular weight of approximately 4,000 to 25,000 (e.g. approximately 4,000 to 10,000) and which is substantially incapable of further chain growth upon heating. Uniformly dispersed within the liquid crystalline polymer is approximately 40 to 80 percent by weight (e.g. approximately 50 to 75 percent by weight) of a particulate inorganic material (preferably of silicon dioxide) which serves to advantageously decrease its volumetric coefficient of thermal expansion and to advantageously increase its thermal conductivity.
    Type: Grant
    Filed: June 9, 1986
    Date of Patent: January 19, 1988
    Assignee: Hoebbst Celanese Corporation
    Inventors: Nancy C. Eickman, Charles E. McChesney, Gary E. Williams, Hyun-Nam Yoon
  • Patent number: 4719250
    Abstract: An improved thermoplastic molding composition is provided which is particularly suited for use in the impervious void-free encapsulation on a relatively expeditious basis of an electronic component wherein the preformed electronic component is positioned in a mold cavity prior to the introduction of the molding composition via injection molding. The molding composition comprises a melt processable thermotropic liquid crystalline polymer which is of a relatively low weight average molecular weight of approximately 4,000 to 25,000 (e.g. approximately 4,000 to 10,000) and which is substantially incapable of further chain growth upon heating. Uniformly dispersed within the liquid crystalline polymer is approximately 40 to 80 percent by weight (e.g. approximately 50 to 75 percent by weight) of a particulate inorganic material (preferably of silicon dioxide) which serves to advantageously decrease its volumetric coefficient of thermal expansion and to advantageously increase its thermal conductivity.
    Type: Grant
    Filed: June 9, 1986
    Date of Patent: January 12, 1988
    Assignee: Hoechst Celanese Corporation
    Inventors: Nancy C. Eickman, Charles E. McChesney, Gary E. Williams, Hyun-Nam Yoon
  • Patent number: 4632798
    Abstract: An improved thermoplastic molding composition is provided which is particularly suited for use in the impervious void-free encapsulation on a relatively expeditious basis of an electronic component wherein the preformed electronic component is positioned in a mold cavity prior to the introduction of the molding composition via injection molding. The molding composition comprises a melt processable thermotropic liquid crystalline polymer which is of a relatively low weight average molecular weight of approximately 4,000 to 25,000 (e.g. approximately 4,000 to 10,000) and which is substantially incapable of further chain growth upon heating. Uniformly dispersed within the liquid crystalline polymer is approximately 40 to 80 percent by weight (e.g. approximately 50 to 75 percent by weight) of a particulate inorganic material (preferably of silicon dioxide) which serves to advantageously decrease its volumetric coefficient of thermal expansion and to advantageously increase its thermal conductivity.
    Type: Grant
    Filed: June 18, 1984
    Date of Patent: December 30, 1986
    Assignee: Celanese Corporation
    Inventors: Nancy C. Eickman, Charles E. McChesney, Gary E. Williams, Hyun-Nam Yoon
  • Patent number: 4524101
    Abstract: A process for producing bundles of high modulus polyethylene fibers for reinforcement in composites wherein the matrix is a brittle material such as cement, concrete, plaster of Paris or the like. The process involves passing high modulus polyethylene yarn through high pressure nip rolls to deform the individual filaments and to form a loosely adhering unitary mass or bundle of filaments which is then chopped into short lengths for use as fibrous reinforcement in composites. In a preferred embodiment, the yarn is twisted prior to being passed through the nip rolls.
    Type: Grant
    Filed: July 27, 1984
    Date of Patent: June 18, 1985
    Assignee: Celanese Corporation
    Inventors: Nancy C. Eickman, Walter Fabisiak, Robert Dix
  • Patent number: 4483727
    Abstract: A process for producing bundles of high modulus polyethylene fibers for reinforcement in composites wherein the matrix is a brittle material such as cement, concrete, plaster of Paris or the like. The process involves passing high modulus polyethylene yarn through high pressure nip rolls to deform the individual filaments and to form a loosely adhering unitary mass or bundle of filaments which is then chopped into short lengths for use as fibrous reinforcement in composites. In a preferred embodiment, the yarn is twisted prior to being passed through the nip rolls.
    Type: Grant
    Filed: February 7, 1983
    Date of Patent: November 20, 1984
    Assignee: Celanese Corporation
    Inventors: Nancy C. Eickman, Walter Fabisiak, Robert Dix
  • Patent number: 4458039
    Abstract: A thermotropic liquid crystalline polymer matrix having wollastonite fibers incorporated therein for reinforcement to prepare a molding compound. The wollastonite fibers have an average aspect ratio of greater than 3 to 1, and may be coated on their surface with a coupling agent to produce better bonding between the fibers and the thermotropic liquid crystalline polymer. The surface abrasion of an article produced from a blend of wollastonite with a thermotropic liquid crystalline polymer is reduced as compared to that of unfilled polymer.
    Type: Grant
    Filed: February 7, 1983
    Date of Patent: July 3, 1984
    Assignee: Celanese Corporation
    Inventor: Nancy C. Eickman