Abstract: A semiconductor device is provided. The semiconductor device includes an electric field (E-field) suppression layer formed over a termination region. The E-field suppression layer is patterned with openings over metal contact areas. The E-field suppression layer has a thickness such that an electric field strength above the E-field suppression layer is below a dielectric strength of an adjacent material when the semiconductor device is operating at or below a maximum voltage.

Abstract: A neuroactivity monitoring system includes a camera configured to acquire image data of a patient positioned on the patient support and a monitoring device in communication with the camera. The monitoring device uses the acquired image data of the camera to identify and track patient landmarks, such as facial and/or posture landmarks, and, based on the tracked movement, characterize patient neuroactivity.

Abstract: A system for monitoring medical conditions includes a conformable medical monitoring device that includes a first substrate layer, which includes an electronics module, many signal traces, and at least one electrode, such that one or more of the many signal traces electrically couple the at least one electrode to the electronics module. The conformable medical monitoring device includes a second substrate layer positioned over the electronics module, the first substrate layer, or any combination thereof to insulate the electronics module, the first substrate layer, or any combination thereof. The conformable medical monitoring device also includes a third substrate layer positioned over the second substrate layer, such that the third substrate layer reduces electromagnetic interference caused by a voltage pulse and includes an adjustable system coupled to the first substrate layer and that changes a position of the at least one electrode relative to the electronics module.

Abstract: A sensor assembly includes a die substrate and a metalized layer formed on the die substrate. The metalized layer is formed of a first metal material and includes a bonding pad to facilitate electrically coupling the sensor assembly to a sensor system. A remetalized bump is formed on the bonding pad of a second metal material and is electrically coupled to the metalized layer. An adhesive is applied to the remetalized bump and facilitates mechanically coupling the sensor assembly to the sensor system.

Abstract: In accordance with the present disclosure, voltage sensing techniques using a voltage sensing device are employed to identify sources of electromagnetic radiation and provide warnings to a user about high levels of electromagnetic radiation. By way of example, the voltage sensing device may be a wearable device and may provide auditory, visual, and tactile alerts to a user.

Abstract: An electronics package is disclosed herein that includes a glass substrate having an exterior portion surrounding an interior portion thereof, wherein the interior portion has a first thickness and the exterior portion has a second thickness larger than the first thickness. An adhesive layer is formed on a lower surface of the interior portion of the glass substrate. A semiconductor device having an upper surface is coupled to the adhesive layer, the semiconductor device having at least one contact pad disposed on the upper surface thereof. A first metallization layer is coupled to an upper surface of the glass substrate and extends through a first via formed through the first thickness of the glass substrate to couple with the at least one contact pad of the semiconductor device.

Abstract: In accordance with the present disclosure, voltage sensing techniques using a voltage sensing device are employed to identify sources of electromagnetic radiation and provide warnings to a user about high levels of electromagnetic radiation. By way of example, the voltage sensing device may be a wearable device and may provide auditory, visual, and tactile alerts to a user.

Abstract: A neuroactivity monitoring system includes a camera configured to acquire image data of a patient positioned on the patient support and a monitoring device in communication with the camera. The monitoring device uses the acquired image data of the camera to identify and track patient landmarks, such as facial and/or posture landmarks, and, based on the tracked movement, characterize patient neuroactivity.

Abstract: A sensor assembly includes a die substrate and a metalized layer formed on the die substrate. The metalized layer is formed of a first metal material and includes a bonding pad to facilitate electrically coupling the sensor assembly to a sensor system. A re-metalized bump is formed on the bonding pad of a second metal material and is electrically coupled to the metalized layer. An adhesive is applied to the re-metalized bump and facilitates mechanically coupling the sensor assembly to the sensor system.

Abstract: Methods of fabricating a semiconductor device are provided. The method includes providing a plurality of semiconductor devices. The method further includes disposing a dielectric dry film on the plurality of semiconductor devices, wherein the dielectric dry film is patterned such that openings in the patterned dielectric dry film are aligned with conductive pads of each of the plurality of semiconductor devices.

Abstract: A device for detecting proximity to an active alternating current (AC) voltage source is provided. The device includes a housing, at least one antenna configured to generate a signal in response to exposure to electromagnetic radiation, signal processing circuitry configured to process the signal generated by the at least one antenna, a microprocessor configured to determine, from the processed signal, whether the alert device is proximate to the active AC voltage source, a communication device configured to generate a signal in response to a determination that the alert device is proximate the active AC voltage source, and an interference reduction device configured to discharge an accumulated charge on the alert device to reduce electromagnetic interference from sources other than the active AC voltage source.

Abstract: A semiconductor device is provided. The semiconductor device includes an electric field (E-field) suppression layer formed over a termination region. The E-field suppression layer is patterned with openings over metal contact areas. The E-field suppression layer has a thickness such that an electric field strength above the E-field suppression layer is below a dielectric strength of an adjacent material when the semiconductor device is operating at or below a maximum voltage.

Abstract: Methods of fabricating a semiconductor device are provided. The method includes providing a plurality of semiconductor devices. The method further includes disposing a dielectric dry film on the plurality of semiconductor devices, wherein the dielectric dry film is patterned such that openings in the patterned dielectric dry film are aligned with conductive pads of each of the plurality of semiconductor devices.

Abstract: The present approach relates to the fabrication and use of a probe array having multiple individual probes. In one embodiment, the probes of the probe array may be functionalized such that certain of the probes are suitable for electrical sensing (e.g., recording) or stimulation, non-electrical sensing or stimulation (e.g., chemical sensing and/or release of biomolecules when activated), or a combination of electrical and non-electrical sensing or stimulation.

Abstract: A voltage detection device for detecting proximity to an active alternating current (AC) voltage source is provided. The device includes a housing, at least one antenna configured to generate a signal in response to exposure to electromagnetic radiation, signal processing circuitry configured to process the signal generated by the at least one antenna, a processing device embedded in the housing and communicatively coupled to the signal processing circuitry, the processing device configured to determine, from the processed signal, whether the voltage detection device is proximate to the active AC voltage source, and an electronic switch embedded in the housing and one of included within the processing device and communicatively coupled to the processing device, the electronic switch configured to reduce an impact of interference on detection of the active AC voltage source.

Abstract: An electronics package is disclosed herein that includes a glass substrate having an exterior portion surrounding an interior portion thereof, wherein the interior portion has a first thickness and the exterior portion has a second thickness larger than the first thickness. An adhesive layer is formed on a lower surface of the interior portion of the glass substrate. A semiconductor device having an upper surface is coupled to the adhesive layer, the semiconductor device having at least one contact pad disposed on the upper surface thereof. A first metallization layer is coupled to an upper surface of the glass substrate and extends through a first via formed through the first thickness of the glass substrate to couple with the at least one contact pad of the semiconductor device.

Abstract: An electronics package is disclosed herein that includes a glass substrate having an exterior portion surrounding an interior portion thereof, wherein the interior portion has a first thickness and the exterior portion has a second thickness larger than the first thickness. An adhesive layer is formed on a lower surface of the interior portion of the glass substrate. A semiconductor device having an upper surface is coupled to the adhesive layer, the semiconductor device having at least one contact pad disposed on the upper surface thereof. A first metallization layer is coupled to an upper surface of the glass substrate and extends through a first via formed through the first thickness of the glass substrate to couple with the at least one contact pad of the semiconductor device.

Abstract: A voltage detection device for detecting proximity to an active alternating current (AC) voltage source is provided. The device includes a housing, at least one antenna configured to generate a signal in response to exposure to electromagnetic radiation, signal processing circuitry configured to process the signal generated by the at least one antenna, a processing device embedded in the housing and communicatively coupled to the signal processing circuitry, the processing device configured to determine, from the processed signal, whether the voltage detection device is proximate to the active AC voltage source, and an electronic switch embedded in the housing and one of included within the processing device and communicatively coupled to the processing device, the electronic switch configured to reduce an impact of interference on detection of the active AC voltage source.

Abstract: The present approach relates to the fabrication of probes of a probe array device using wire bonding techniques. In certain implementation, a wire bond apparatus bonds ones end of a wire to a region of a probe array substrate. The second end, however, is not bonded to the substrate and instead is either fabricated to be vertical with respect to the substrate or raised from a non-bonded site to be vertical. The process may be repeated to form multiple probes of the probe array.

Abstract: A device for detecting proximity to an active alternating current (AC) voltage source is provided. The device includes a housing, at least one antenna configured to generate a signal in response to exposure to electromagnetic radiation, signal processing circuitry configured to process the signal generated by the at least one antenna, a microprocessor configured to determine, from the processed signal, whether the alert device is proximate to the active AC voltage source, a communication device configured to generate a signal in response to a determination that the alert device is proximate the active AC voltage source, and an interference reduction device configured to discharge an accumulated charge on the alert device to reduce electromagnetic interference from sources other than the active AC voltage source.