Patents by Inventor Nancy Cecelia Stoffel

Nancy Cecelia Stoffel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11311225
    Abstract: A system for monitoring medical conditions includes a conformable medical monitoring device that includes a first substrate layer, which includes an electronics module, many signal traces, and at least one electrode, such that one or more of the many signal traces electrically couple the at least one electrode to the electronics module. The conformable medical monitoring device includes a second substrate layer positioned over the electronics module, the first substrate layer, or any combination thereof to insulate the electronics module, the first substrate layer, or any combination thereof. The conformable medical monitoring device also includes a third substrate layer positioned over the second substrate layer, such that the third substrate layer reduces electromagnetic interference caused by a voltage pulse and includes an adjustable system coupled to the first substrate layer and that changes a position of the at least one electrode relative to the electronics module.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: April 26, 2022
    Assignee: General Electric Company
    Inventors: Azar Alizadeh, Andrew A. Burns, Matthew Jeremiah Misner, Ralf Lenigk, Jeffrey Michael Ashe, Obi Aghogho, Nancy Cecelia Stoffel, Juha Virtanen, Otto Pekander, Timo Toivanen, Robert Santala
  • Patent number: 11289444
    Abstract: A sensor assembly includes a die substrate and a metalized layer formed on the die substrate. The metalized layer is formed of a first metal material and includes a bonding pad to facilitate electrically coupling the sensor assembly to a sensor system. A remetalized bump is formed on the bonding pad of a second metal material and is electrically coupled to the metalized layer. An adhesive is applied to the remetalized bump and facilitates mechanically coupling the sensor assembly to the sensor system.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: March 29, 2022
    Assignee: General Electric Company
    Inventors: David Richard Esler, Nancy Cecelia Stoffel
  • Patent number: 11280814
    Abstract: In accordance with the present disclosure, voltage sensing techniques using a voltage sensing device are employed to identify sources of electromagnetic radiation and provide warnings to a user about high levels of electromagnetic radiation. By way of example, the voltage sensing device may be a wearable device and may provide auditory, visual, and tactile alerts to a user.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: March 22, 2022
    Assignee: GENERAL ELECTIC COMPANY
    Inventors: Radislav Alexandrovich Potyrailo, Nancy Cecelia Stoffel, Cheng-Po Chen, Emad Andarawis Andarawis
  • Patent number: 11177204
    Abstract: An electronics package is disclosed herein that includes a glass substrate having an exterior portion surrounding an interior portion thereof, wherein the interior portion has a first thickness and the exterior portion has a second thickness larger than the first thickness. An adhesive layer is formed on a lower surface of the interior portion of the glass substrate. A semiconductor device having an upper surface is coupled to the adhesive layer, the semiconductor device having at least one contact pad disposed on the upper surface thereof. A first metallization layer is coupled to an upper surface of the glass substrate and extends through a first via formed through the first thickness of the glass substrate to couple with the at least one contact pad of the semiconductor device.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: November 16, 2021
    Assignee: General Electric Company
    Inventors: Arun Virupaksha Gowda, Paul Alan McConnelee, Nancy Cecelia Stoffel, Risto Ilkka Tuominen
  • Publication number: 20210318362
    Abstract: In accordance with the present disclosure, voltage sensing techniques using a voltage sensing device are employed to identify sources of electromagnetic radiation and provide warnings to a user about high levels of electromagnetic radiation. By way of example, the voltage sensing device may be a wearable device and may provide auditory, visual, and tactile alerts to a user.
    Type: Application
    Filed: April 8, 2020
    Publication date: October 14, 2021
    Inventors: Radislav Alexandrovich Potyrailo, Nancy Cecelia Stoffel, Cheng-Po Chen, Emad Andarawis Andarawis
  • Publication number: 20210236026
    Abstract: A neuroactivity monitoring system includes a camera configured to acquire image data of a patient positioned on the patient support and a monitoring device in communication with the camera. The monitoring device uses the acquired image data of the camera to identify and track patient landmarks, such as facial and/or posture landmarks, and, based on the tracked movement, characterize patient neuroactivity.
    Type: Application
    Filed: February 5, 2020
    Publication date: August 5, 2021
    Inventors: Cynthia Elizabeth Landberg Davis, Guangliang Zhao, Tzu-Jen Kao, Aghogho Obi, Nancy Cecelia Stoffel
  • Publication number: 20210183808
    Abstract: A sensor assembly includes a die substrate and a metalized layer formed on the die substrate. The metalized layer is formed of a first metal material and includes a bonding pad to facilitate electrically coupling the sensor assembly to a sensor system. A re-metalized bump is formed on the bonding pad of a second metal material and is electrically coupled to the metalized layer. An adhesive is applied to the re-metalized bump and facilitates mechanically coupling the sensor assembly to the sensor system.
    Type: Application
    Filed: December 13, 2019
    Publication date: June 17, 2021
    Inventors: David Richard Esler, Nancy Cecelia Stoffel
  • Patent number: 10892237
    Abstract: Methods of fabricating a semiconductor device are provided. The method includes providing a plurality of semiconductor devices. The method further includes disposing a dielectric dry film on the plurality of semiconductor devices, wherein the dielectric dry film is patterned such that openings in the patterned dielectric dry film are aligned with conductive pads of each of the plurality of semiconductor devices.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: January 12, 2021
    Assignee: General Electric Company
    Inventors: Stephen Daley Arthur, Liangchun Yu, Nancy Cecelia Stoffel, David Richard Esler, Christopher James Kapusta
  • Patent number: 10798282
    Abstract: A device for detecting proximity to an active alternating current (AC) voltage source is provided. The device includes a housing, at least one antenna configured to generate a signal in response to exposure to electromagnetic radiation, signal processing circuitry configured to process the signal generated by the at least one antenna, a microprocessor configured to determine, from the processed signal, whether the alert device is proximate to the active AC voltage source, a communication device configured to generate a signal in response to a determination that the alert device is proximate the active AC voltage source, and an interference reduction device configured to discharge an accumulated charge on the alert device to reduce electromagnetic interference from sources other than the active AC voltage source.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: October 6, 2020
    Assignee: GE GLOBAL SOURCING LLC
    Inventors: Mark Bradshaw Kraeling, Glenn Robert Shaffer, Emad Andarawis Andarawis, Glen William Brooksby, Christopher Gushee, Jeffrey Mayton, Cheng-Po Chen, Nancy Cecelia Stoffel, Wyatt Smith, Jose Luis R. Virgen, Daniel L. Olson
  • Publication number: 20200194388
    Abstract: Methods of fabricating a semiconductor device are provided. The method includes providing a plurality of semiconductor devices. The method further includes disposing a dielectric dry film on the plurality of semiconductor devices, wherein the dielectric dry film is patterned such that openings in the patterned dielectric dry film are aligned with conductive pads of each of the plurality of semiconductor devices.
    Type: Application
    Filed: December 14, 2018
    Publication date: June 18, 2020
    Inventors: Stephen Daley Arthur, Liangchun Yu, Nancy Cecelia Stoffel, David Richard Esler, Christopher James Kapusta
  • Publication number: 20200194387
    Abstract: A semiconductor device is provided. The semiconductor device includes an electric field (E-field) suppression layer formed over a termination region. The E-field suppression layer is patterned with openings over metal contact areas. The E-field suppression layer has a thickness such that an electric field strength above the E-field suppression layer is below a dielectric strength of an adjacent material when the semiconductor device is operating at or below a maximum voltage.
    Type: Application
    Filed: December 14, 2018
    Publication date: June 18, 2020
    Inventors: Stephen Daley Arthur, Liangchun Yu, Nancy Cecelia Stoffel, David Richard Esler, Christopher James Kapusta
  • Patent number: 10602950
    Abstract: The present approach relates to the fabrication and use of a probe array having multiple individual probes. In one embodiment, the probes of the probe array may be functionalized such that certain of the probes are suitable for electrical sensing (e.g., recording) or stimulation, non-electrical sensing or stimulation (e.g., chemical sensing and/or release of biomolecules when activated), or a combination of electrical and non-electrical sensing or stimulation.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: March 31, 2020
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Jeffrey M. Ashe, Kaustubh Ravindra Nagarkar, Christopher Michael Puleo, Christopher Fred Keimel, Craig Patrick Galligan, Yizhen Lin, Nancy Cecelia Stoffel, Richard Vanfleet, Robert Davis, Guohai Chen
  • Patent number: 10488174
    Abstract: A voltage detection device for detecting proximity to an active alternating current (AC) voltage source is provided. The device includes a housing, at least one antenna configured to generate a signal in response to exposure to electromagnetic radiation, signal processing circuitry configured to process the signal generated by the at least one antenna, a processing device embedded in the housing and communicatively coupled to the signal processing circuitry, the processing device configured to determine, from the processed signal, whether the voltage detection device is proximate to the active AC voltage source, and an electronic switch embedded in the housing and one of included within the processing device and communicatively coupled to the processing device, the electronic switch configured to reduce an impact of interference on detection of the active AC voltage source.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: November 26, 2019
    Assignee: General Electric Company
    Inventors: Cheng-Po Chen, Christopher Bruce Gushee, Jose Luis Virgen, Emad Andarawis Andarawis, Glen William Brooksby, Jeffrey Ross Mayton, Nancy Cecelia Stoffel, Wyatt Beale Smith, Daniel Leroy Olson
  • Patent number: 10453786
    Abstract: An electronics package is disclosed herein that includes a glass substrate having an exterior portion surrounding an interior portion thereof, wherein the interior portion has a first thickness and the exterior portion has a second thickness larger than the first thickness. An adhesive layer is formed on a lower surface of the interior portion of the glass substrate. A semiconductor device having an upper surface is coupled to the adhesive layer, the semiconductor device having at least one contact pad disposed on the upper surface thereof. A first metallization layer is coupled to an upper surface of the glass substrate and extends through a first via formed through the first thickness of the glass substrate to couple with the at least one contact pad of the semiconductor device.
    Type: Grant
    Filed: January 19, 2016
    Date of Patent: October 22, 2019
    Assignee: General Electric Company
    Inventors: Arun Virupaksha Gowda, Paul Alan McConnelee, Nancy Cecelia Stoffel, Risto Ilkka Tuominen
  • Publication number: 20190311981
    Abstract: An electronics package is disclosed herein that includes a glass substrate having an exterior portion surrounding an interior portion thereof, wherein the interior portion has a first thickness and the exterior portion has a second thickness larger than the first thickness. An adhesive layer is formed on a lower surface of the interior portion of the glass substrate. A semiconductor device having an upper surface is coupled to the adhesive layer, the semiconductor device having at least one contact pad disposed on the upper surface thereof. A first metallization layer is coupled to an upper surface of the glass substrate and extends through a first via formed through the first thickness of the glass substrate to couple with the at least one contact pad of the semiconductor device.
    Type: Application
    Filed: June 21, 2019
    Publication date: October 10, 2019
    Inventors: Arun Virupaksha Gowda, Paul Alan McConnelee, Nancy Cecelia Stoffel, Risto Ilkka Tuominen
  • Publication number: 20190277617
    Abstract: A voltage detection device for detecting proximity to an active alternating current (AC) voltage source is provided. The device includes a housing, at least one antenna configured to generate a signal in response to exposure to electromagnetic radiation, signal processing circuitry configured to process the signal generated by the at least one antenna, a processing device embedded in the housing and communicatively coupled to the signal processing circuitry, the processing device configured to determine, from the processed signal, whether the voltage detection device is proximate to the active AC voltage source, and an electronic switch embedded in the housing and one of included within the processing device and communicatively coupled to the processing device, the electronic switch configured to reduce an impact of interference on detection of the active AC voltage source.
    Type: Application
    Filed: March 6, 2018
    Publication date: September 12, 2019
    Inventors: Cheng-Po Chen, Christopher Bruce Gushee, Jose Luis Virgen, Emad Andarawis Andarawis, Glen William Brooksby, Jeffrey Ross Mayton, Nancy Cecelia Stoffel, Wyatt Beale Smith, Daniel Leroy Olson
  • Publication number: 20190254546
    Abstract: The present approach relates to the fabrication of probes of a probe array device using wire bonding techniques. In certain implementation, a wire bond apparatus bonds ones end of a wire to a region of a probe array substrate. The second end, however, is not bonded to the substrate and instead is either fabricated to be vertical with respect to the substrate or raised from a non-bonded site to be vertical. The process may be repeated to form multiple probes of the probe array.
    Type: Application
    Filed: February 22, 2018
    Publication date: August 22, 2019
    Inventors: Craig Patrick Galligan, Nancy Cecelia Stoffel, Eric Patrick Davis, Kaustubh Ravindra Nagarkar
  • Publication number: 20190149715
    Abstract: A device for detecting proximity to an active alternating current (AC) voltage source is provided. The device includes a housing, at least one antenna configured to generate a signal in response to exposure to electromagnetic radiation, signal processing circuitry configured to process the signal generated by the at least one antenna, a microprocessor configured to determine, from the processed signal, whether the alert device is proximate to the active AC voltage source, a communication device configured to generate a signal in response to a determination that the alert device is proximate the active AC voltage source, and an interference reduction device configured to discharge an accumulated charge on the alert device to reduce electromagnetic interference from sources other than the active AC voltage source.
    Type: Application
    Filed: December 21, 2018
    Publication date: May 16, 2019
    Inventors: Mark Bradshaw Kraeling, Glenn Robert Shaffer, Emad Andarawis Andarawis, Glen William Brooksby, Christopher Gushee, Jeffrey Mayton, Cheng-Po Chen, Nancy Cecelia Stoffel, Wyatt Smith, Jose Luis R. Virgen, Daniel L. Olson
  • Publication number: 20190015008
    Abstract: A system for monitoring medical conditions includes a conformable medical monitoring device that includes a first substrate layer, which includes an electronics module, many signal traces, and at least one electrode, such that one or more of the many signal traces electrically couple the at least one electrode to the electronics module. The conformable medical monitoring device includes a second substrate layer positioned over the electronics module, the first substrate layer, or any combination thereof to insulate the electronics module, the first substrate layer, or any combination thereof. The conformable medical monitoring device also includes a third substrate layer positioned over the second substrate layer, such that the third substrate layer reduces electromagnetic interference caused by a voltage pulse and includes an adjustable system coupled to the first substrate layer and that changes a position of the at least one electrode relative to the electronics module.
    Type: Application
    Filed: July 3, 2018
    Publication date: January 17, 2019
    Inventors: Azar Alizadeh, Andrew A. Burns, Matthew Jeremiah Misner, Ralf Lenigk, Jeffrey Michael Ashe, Obi Aghogho, Nancy Cecelia Stoffel, Juha Virtanen, Otto Pekander, Timo Toivanen, Robert Santala
  • Publication number: 20180235544
    Abstract: A system includes an implantable sensor assembly. The implantable sensor assembly includes a housing. The housing includes a substrate layer comprising an interior surface and an exterior surface, and a cap layer, wherein the substrate layer and the cap layer are coupled to form an enclosed cavity that at least partially encloses the interior surface of the substrate layer within the cavity and wherein both the substrate layer and the cap layer are formed from an insulating material. The implantable sensor assembly also includes one or more electronic components disposed within the cavity of the housing and one or more probes disposed on the exterior surface of the substrate layer and electrically coupled to the one or more electronic components by one or more electrical connections extending through the housing.
    Type: Application
    Filed: June 16, 2017
    Publication date: August 23, 2018
    Inventors: Kaustubh Ravindra Nagarkar, Jeffrey Michael Ashe, Eric Patrick Davis, Nancy Cecelia Stoffel