Patents by Inventor Nancy Dean
Nancy Dean has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20090294115Abstract: A thermal transfer material is described herein that includes: a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material, and at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component. Methods of forming layered thermal interface materials and thermal transfer materials include: a) providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; b) providing at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component; and c) depositing the at least one solder material onto the bottom surface of the heat spreader component.Type: ApplicationFiled: June 30, 2009Publication date: December 3, 2009Applicant: Honeywell International Inc.Inventors: Mark Fery, Nancy Dean
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Patent number: 7608324Abstract: Layered interface materials described herein comprise at least one crosslinkable thermal interface component and at least one compliant fibrous interface component coupled to the thermal interface component. A method of forming layered interface materials comprises: a) providing a crosslinkable thermal interface component; b) providing a compliant fibrous interface component; and c) physically coupling the thermal interface component and the compliant fibrous interface component. At least one additional layer, including a substrate layer, can be coupled to the layered interface material.Type: GrantFiled: May 30, 2002Date of Patent: October 27, 2009Assignee: Honeywell International Inc.Inventors: My N. Nguyen, Nancy Dean, Kenishiro Fukuyama
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Publication number: 20080029882Abstract: A thermal transfer material is described herein that includes: a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material, and at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component. Methods of forming layered thermal interface materials and thermal transfer materials include: a) providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; b) providing at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component; and c) depositing the at least one solder material onto the bottom surface of the heat spreader component.Type: ApplicationFiled: August 7, 2007Publication date: February 7, 2008Applicant: Honeywell International Inc.Inventors: Mark Fery, Nancy Dean
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Patent number: 7256491Abstract: A thermal transfer material is described herein that includes: a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material, and at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component. Methods of forming layered thermal interface materials and thermal transfer materials include: a) providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; b) providing at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component; and c) depositing the at least one solder material onto the bottom surface of the heat spreader component.Type: GrantFiled: June 4, 2004Date of Patent: August 14, 2007Assignee: Honeywell International Inc.Inventors: Mark Fery, Nancy Dean
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Publication number: 20070164424Abstract: Components and materials, including thermal transfer materials, contemplated herein comprise at least one heat spreader component, at least one thermal interface material and in some contemplated embodiments at least one adhesive material. The heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material. The thermal interface material is directly deposited onto at least part of the bottom surface of the heat spreader component. Methods of forming layered thermal interface materials and thermal transfer materials include: a) providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; b) providing at least one thermal interface material, wherein the thermal interface material is directly deposited onto the bottom surface of the heat spreader component; and c) depositing the at least one thermal interface material onto the bottom surface of the heat spreader component.Type: ApplicationFiled: March 31, 2004Publication date: July 19, 2007Inventors: Nancy Dean, Richard Townsend, Paula Knoll, Colin Edie, My Nguyen, Dan Curran, Ignatius Rasiah
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Publication number: 20070098971Abstract: Layered interlace materials described herein comprise at least one crosslinkable thermal interface component and at least one compliant fibrous interface component coupled to the thermal interface component. A method of forming layered interface materials comprises: a) providing a crosslinkable thermal interface component; b) providing a compliant fibrous interface component; and c) physically coupling the thermal interface component and the compliant fibrous interface component. At least one additional layer, including a substrate layer, can be coupled to the layered interface material.Type: ApplicationFiled: May 30, 2002Publication date: May 3, 2007Inventors: My Nguyen, Nancy Dean, Kenishiro Fukuyama
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Publication number: 20070045839Abstract: The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.Type: ApplicationFiled: November 2, 2006Publication date: March 1, 2007Inventors: Martin Weiser, Nancy Dean, Brett Clark, Michael Bossio, Ronald Fleming, James Flint
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Publication number: 20070045838Abstract: The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.Type: ApplicationFiled: November 2, 2006Publication date: March 1, 2007Inventors: Martin Weiser, Nancy Dean, Brett Clark, Michael Bossio, Ronald Fleming, James Flint
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Publication number: 20070045842Abstract: The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.Type: ApplicationFiled: November 2, 2006Publication date: March 1, 2007Inventors: Martin Weiser, Nancy Dean, Brett Clark, Michael Bossio, Ronald Fleming, James Flint
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Publication number: 20070013054Abstract: A thermally conductive material that includes an alloy which includes indium, zinc, magnesium or a combination thereof is described herein. Also, a semiconductor package comprising a thermal interface material which includes solder and particles dispersed throughout the solder, the particles being of thermal conductivity greater than or equal to about 80 W/m-K is described herein. In one described embodiment, a semiconductor package includes a thermal interface material which includes at least one lanthanide element. In yet another embodiment disclosed herein, a solder preform construction includes a solder and a structure within the solder, the solder being of a first composition and the structure being of a second composition which has a lower melting point than the first composition.Type: ApplicationFiled: July 12, 2005Publication date: January 18, 2007Inventors: Brian Ruchert, Martin Weiser, Mark Fery, Nancy Dean, John Lalena
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Publication number: 20060201279Abstract: The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.Type: ApplicationFiled: May 5, 2006Publication date: September 14, 2006Inventors: Martin Weiser, Nancy Dean, Brett Clark, Michael Bossio, Ronald Fleming, James Flint
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Publication number: 20060151873Abstract: A thermal transfer material is described herein that includes: a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material, and at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component. Methods of forming layered thermal interface materials and thermal transfer materials include: a) providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; b) providing at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component; and c) depositing the at least one solder material onto the bottom surface of the heat spreader component.Type: ApplicationFiled: June 4, 2004Publication date: July 13, 2006Inventors: Mark Fery, Nancy Dean
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Publication number: 20060113683Abstract: Lead free solder compositions are described herein that include at least one solder material; at least one dopant material, wherein the dopant is present in the material in an amount of less than about 1000 ppm, and wherein the solder composition is substantially lead free. Several doped solder compositions described herein comprise at least one solder material, at least one phosphorus-based dopant and at least one copper-based dopant. Methods of forming doped solder materials include: a) providing at least one solder material; b) providing at least one phosphorus-based dopant; c) providing at least one copper-based dopant, and d) blending the at least one solder material, the at least one phosphorus-based dopant and the at least one copper-based dopant to form a doped solder material.Type: ApplicationFiled: June 8, 2005Publication date: June 1, 2006Inventors: Nancy Dean, James Flint, John Lalena, Martin Weiser
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Publication number: 20060040112Abstract: Layered thermal components described herein include at least one thermal interface component and at least one heat spreader component coupled to the thermal interface component. A method of forming layered thermal components disclosed herein comprises: a) providing at least one thermal interface component; b) providing at least one heat spreader component; and c) physically coupling the at least one thermal interface component and the at least one heat spreader component. At least one additional layer, including a substrate layer, can be coupled to the layered thermal component.Type: ApplicationFiled: July 15, 2003Publication date: February 23, 2006Inventors: Nancy Dean, Richard Townsend, Paula Knoll, Colin Edie, My Nguyen, Dan Curran
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Publication number: 20050040369Abstract: The invention includes a semiconductor package which comprises a semiconductor substrate and a heat spreader. A thermal interface material thermally connects the substrate to the heat spreader. The thermal interface material consists essentially of In, Zn, and one or more elements selected from the group consisting of Mg, Ca, Nb, Ta, B, Al, Ce, Ti and Zr. The invention also includes a composition consisting essentially of In and Zn. The Zn concentration within the composition is from about 0.5 weight % to about 3 weight %. The invention also includes a composition consisting essentially of In, Zn and one or more of Mg, Ca, Nb, Ta, B, Al, Ce, Ti and Zr.Type: ApplicationFiled: April 23, 2002Publication date: February 24, 2005Inventors: John Lalena, Nancy Dean, Martin Weiser
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Anodes for electroplating operations, and methods of forming materials over semiconductor substrates
Publication number: 20050000821Abstract: The invention includes anodes for electroplating, baths. The anodes have a purity of at least 99.9%, and comprise one or more of silver, gold, nickel, chromium, copper or various solder compositions. The anodes can, for example, comprise at least 99.995% copper/phosphorus alloy, by weight; or at least 99.995% nickel and sulfur, by weight. The invention also includes methods of electroplating, materials over semiconductor substrates.Type: ApplicationFiled: November 16, 2001Publication date: January 6, 2005Inventors: Tamara White, Nancy Dean, Martin Weiser, Michael Pinter