Abstract: A system is provided, the system including at least one integrated optical circuit (IOC) formed from at least one material, and a support-structure configured to support the at least one IOC to couple light between other components. A performance of the at least one IOC is improved by treatment with at least one selected gas.

Abstract: A stabilized integrated optical circuit is presented. The stabilized integrated optical circuit includes at least one integrated optical chip formed from at least one inorganic material, a stabilizing-polarizable-fill gas, and an enclosure enclosing the at least one integrated optical chip and the stabilizing-polarizable-fill gas. At least one surface of the at least one integrated optical chip is modified by a treatment with at least one treatment gas selected to stabilize defects on the at least one surface. The stabilizing-polarizable-fill gas includes N2O and at least one polarizable material.

Abstract: A composition includes a solvent, a catalyst, a polysiloxane including methyl and phenyl pendant groups, and a crosslinker comprising at least one of a phenylene disilyl group and para-disilyl phenylene group. Exemplary crosslinkers include bis silyl benzene, bis alkoxysilane, 1,3 bistriethoxysilyl benzene, and 1,4 bistriethoxysilyl benzene 2,6-bis(triethoxysilyl)-naphthalene, 9,10-bis(triethoxysilyl)-anthracene, and 1,6-bis(trimethoxysilyl)-pyrene.

Abstract: A stabilized integrated optical circuit is presented. The stabilized integrated optical circuit includes at least one integrated optical chip formed from at least one inorganic material, a stabilizing-polarizable-fill gas, and an enclosure enclosing the at least one integrated optical chip and the stabilizing-polarizable-fill gas. At least one surface of the at least one integrated optical chip is modified by a treatment with at least one treatment gas selected to stabilize defects on the at least one surface. The stabilizing-polarizable-fill gas includes N2O and at least one polarizable material.

Abstract: A system is provided, the system including at least one integrated optical circuit (IOC) formed from at least one material, and a support-structure configured to support the at least one IOC to couple light between other components. A performance of the at least one IOC is improved by treatment with at least one selected gas.

Abstract: Preferred aspects of the present invention provide ammonium nitrate compositions comprising ammonium nitrate and at least a second compound, said second compound being present under conditions and in amounts effective to substantially reduce the detonation sensitivity of the composition and/or to otherwise improve a desired property of the composition. In certain embodiments, the second compound is selected from the group consisting of ammonium sulfate, ammonium phosphate, calcium nitrate, potassium nitrate, magnesium nitrate, ammonium molybdenate, ammonium hexaflouralsilicate, neodymium hydroxynitrate, and combinations of two or more of these. In preferred embodiments, at least a substantial portion of the ammonium nitrate in the composition is in the form of a double salt with one or more of said second compounds. In highly preferred embodiments, the present compositions consist essentially of one or more double salts of ammonium nitrate and a second compound as described herein.

Abstract: Selecting a stationary phase for a fluid analyzer using certain criteria to determine an appropriate material for use in, for instance, a micro fluid analyzer. High absorption of an analyte or sample, low water sorbency and high porosity or permeability of the material may be sought. A selected material may incorporate a toughening agent using a neutral leaving group. A selected material may have a capping agent to promote hydrophobicity. A selected material may be a hydrophobic polymer. The selection of a stationary phase may involve molecular modeling.

Abstract: An assembly having a thermosetting layer pierced by a plurality of conductors is formed on a release sheet and subsequently sandwiched between an IC and a PWB or other supporting surface and subsequently cured. The release sheet is removed either before or during curing of the thermosetting material. Removal prior to curing may be accomplished via peeling. Removal during curing may be by destruction of the layer by the curing process.

Abstract: A polymer/substrate and/or polymer/polymer interface is selected from candidate interfaces using a model that manipulates adhesive characteristics and strain variables, and estimates of their effect on candidate interfaces. The model is preferably used to evaluate properties such as size, shape, and bond geometries. Preferred models involve an atomic level visual representation of a first polymer adhered to either a second polymer or a substrate at the interface by a force, inclusion of strain-related information, and generating data from modeling effects on the interface of strain cycles resulting from intermittently applied force.

Abstract: A method of designing an electronic component comprises: a) modeling a first material with respect to a characteristic of the first material in a sufficient detail to at least partially account for a first value for the characteristic; b) modeling a second material with respect to a characteristic of the second material in a sufficient detail to at least partially account for a second value for the characteristic; c) modeling an interface between the first material and the second material such that in at least some instances the characteristic of the interface does not have an obvious characteristic or obvious value of between the first value and the second value; and d) generating a set of evaluation data from the modeling of the interface.

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: A polymer/substrate and/or polymer/polymer interface is selected from candidate interfaces using a model that manipulates adhesive characteristics and strain variables, and estimates of their effect on candidate interfaces. The model is preferably used to evaluate properties such as size, shape, and bond geometries. Preferred models involve an atomic level visual representation of a first polymer adhered to either a second polymer or a substrate at the interface by a force, inclusion of strain-related information, and generating data from modeling effects on the interface of strain cycles resulting from intermittently applied force.

Abstract: An assembly having a thermosetting layer pierced by a plurality of conductors is formed on a release sheet and subsequently sandwiched between an IC and a PWB or other supporting surface and subsequently cured. The release sheet is removed either before or during curing of the thermosetting material. Removal prior to curing may be accomplished via peeling. Removal during curing may be by destruction of the layer by the curing process.

Abstract: A method of designing an electronic component comprises: a) modeling a first material with respect to a characteristic of the first material in a sufficient detail to at least partially account for a first value for the characteristic; b) modeling a second material with respect to a characteristic of the second material in a sufficient detail to at least partially account for a second value for the characteristic; c) modeling an interface between the first material and the second material such that in at least some instances the characteristic of the interface does not have an obvious characteristic or obvious value of between the first value and the second value; and d) generating a set of evaluation data from the modeling of the interface.

Abstract: A via fill formulation including electrically and/or thermally conductive particulate filler, or non-conductive, electrically conductive polymer and a resin vehicle.

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: A method is described for decreasing bleed from an organic-based formulation comprising incorporating in the organic-based formulation an anti-bleed composition having (a) a monomer end-to-end distance of less than 12.2 angstroms or greater than 12.6 angstroms; (b) a ratio of formula weight to number of heavy atom bonds of 13 to 16 grams; (c) a ratio of formula weight to end-to-end distance of 18 to 22 grams/angstrom; (d) a ratio of heavy atoms to heavy atom bonds of 1 to 1.1; (e) a ratio of weight fraction of carbon to formula weight of 0.7 to 0.95; (f) a ratio of formula weight to number of carbon to carbon bonds of 14 to 20 grams; and/or (g) 1 to 2 heteroatoms.Also described as an organic-based formulation is disclosed that comprises a filler, a resin and an organic-based formulation an anti-bleed composition having (a) a monomer end-to-end distance of less than 12.2 angstroms or greater than 12.

Abstract: A method is described for determining high performing anti-bleed agents by comparing the structural characteristics of a compound to specified ranges of structurally-based variables. These structurally-based variables are determined by first comparing the structural characteristics of the best performing anti-bleed agents in a first set of computer simulations of anti-bleed agent candidates in a die attach adhesive on a substrate. The effects of other anti-bleed agent candidates are determined by plotting the structurally-based variables against modeled bleed. Predictive ranges are determined by the performance groups of the candidates with the coincidentally lowest bleed. Also disclosed are organic-based formulations suitable for assembling semiconductor devices including die attach adhesive useful for bonding a semiconductor device to a substrate that incorporates selected anti-bleed agents and which may additionally contain a filler.

Abstract: Described is an adhesive composition suitable for bonding a semiconductor device to a substrate comprising about 60-90 wt. % particulate silver; about 10-40 wt. % of an adhesive material comprising at least one nonelectrically conductive organic compound; and a filler comprising at least one electrically conductive organic compound capable of forming a conductivity bridge between silver particles. The adhesive composition may additionally include at least one curing catalyst for the adhesive material, a flexibilizer to render the composition more flexible, a surfactant to facilitate contact with a substrate and/or a material to aid in adjusting the rheology of the composition.