Patents by Inventor Nancy F. Dean

Nancy F. Dean has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of refining solder materials
    Patent number: 9666547
    Abstract: The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.
    Type: Grant
    Filed: April 28, 2010
    Date of Patent: May 30, 2017
    Assignee: Honeywell International Inc.
    Inventors: Martin W. Weiser, Nancy F. Dean, Brett M. Clark, Michael J. Bossio, Ronald H. Fleming, James P. Flint
  • METHOD OF REFINING SOLDER MATERIALS
    Publication number: 20100206133
    Abstract: The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.
    Type: Application
    Filed: April 28, 2010
    Publication date: August 19, 2010
    Applicant: Honeywell International Inc.
    Inventors: Martin W. Weiser, Nancy F. Dean, Brett M. Clark, Michael J. Bossio, Ronald H. Fleming, James P. Flint
  • Methods of refining lead-containing materials
    Patent number: 7521286
    Abstract: The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.
    Type: Grant
    Filed: May 5, 2006
    Date of Patent: April 21, 2009
    Assignee: Honeywell International Inc.
    Inventors: Martin W. Weiser, Nancy F. Dean, Brett M. Clark, Michael J. Bossio, Ronald H. Fleming, James P. Flint
  • Heat spreader constructions, intergrated circuitry, methods of forming heat spreader constructions, and methods of forming integrated circuitry
    Publication number: 20090027857
    Abstract: The invention includes a heat spreader having a base which has a perimeter surface surrounding a heat-receiving region. A frame portion interfaces the perimeter surface and has an opening traversing a thickness of the frame. The invention includes a method of forming a heat spreader construction by forming a base portion having a perimeter region surrounding a heat-receiving surface. An independent frame portion is joined to the base portion. The invention includes integrated circuitry having a heat spreader construction in thermal communication with a heat-generating device. The heat spreader has a base having a heat-receiving surface and a perimeter surface which interfaces a frame portion. The invention includes methodology for forming integrated circuitry which includes providing an integrated circuitry board having a heat generating device mounted thereon, and providing a multi-part heat spreader in thermal communication with the heat-generating device.
    Type: Application
    Filed: March 29, 2005
    Publication date: January 29, 2009
    Inventors: Nancy F. Dean, Ignatius J. Rasiah
  • Electronic device having fibrous interface
    Patent number: 6740972
    Abstract: Described is an electronic device having a compliant fibrous interface. The interface comprises a free fiber tip structure having flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive and an encapsulant between the portions of the fibers that extend out of the adhesive and the fiber's free tips.
    Type: Grant
    Filed: June 26, 2001
    Date of Patent: May 25, 2004
    Assignee: Honeywell International Inc.
    Inventors: Charles Smith, Michael M. Chau, Roger A. Emigh, Nancy F. Dean
  • Semiconductor packages; lead-containing solders and anodes; and methods of removing alpha-emitters from materials
    Publication number: 20040065954
    Abstract: The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.
    Type: Application
    Filed: September 26, 2003
    Publication date: April 8, 2004
    Inventors: Martin W. Weiser, Nancy F. Dean, Brett M. Clark, Michael J. Bossio, Ronald H. Fleming, James P. Flint
  • Compliant fibrous thermal interface
    Patent number: 6713151
    Abstract: Described is a fibrous thermal interface. The interface comprises flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive. An encapsulant fills spaces between the portions of the fibers that extend out of the adhesive and beneath the free tips of the fibers.
    Type: Grant
    Filed: June 21, 1999
    Date of Patent: March 30, 2004
    Assignee: Honeywell International Inc.
    Inventors: Nancy F. Dean, Roger A. Emigh, Michael R. Pinter, Charles Smith, Timothy R. Knowles, Mani Ahmadi, Brett M. Ellman, Christopher L. Seaman
  • Transferrable compliant fibrous thermal interface
    Patent number: 6676796
    Abstract: Described is a transferrable fibrous thermal interface. The interface comprises flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive. An encapsulant fills spaces between the portions of the fibers that extend out of the adhesive and a release liner is on at least one outer surface of the interface.
    Type: Grant
    Filed: February 26, 2001
    Date of Patent: January 13, 2004
    Assignee: Honeywell International Inc.
    Inventors: Michael R. Pinter, Nancy F. Dean, William B. Willett, Amy Gettings, Charles Smith
  • Electronic device having fibrous interface
    Patent number: 6617199
    Abstract: Described is an electronic device having a compliant fibrous interface. The interface comprises a free fiber tip structure having flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive and an encapsulant between the portions of the fibers that extend out of the adhesive and the fiber's free tips.
    Type: Grant
    Filed: January 31, 2001
    Date of Patent: September 9, 2003
    Assignee: Honeywell International Inc.
    Inventors: Charles Smith, Michael M. Chau, Roger A. Emigh, Nancy F. Dean
  • Transferrable compliant fibrous thermal interface
    Patent number: 6436506
    Abstract: Described is a transferrable fibrous thermal interface. The interface comprises flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive. An encapsulant fills spaces between the portions of the fibers that extend out of the adhesive and a release liner is on at least one outer surface of the interface.
    Type: Grant
    Filed: June 24, 1998
    Date of Patent: August 20, 2002
    Assignee: Honeywell International Inc.
    Inventors: Michael R. Pinter, Nancy F. Dean, William B. Willett, Amy Gettings, Charles Smith
  • Electronic device having fibrous interface
    Publication number: 20010052652
    Abstract: Described is an electronic device having a compliant fibrous interface. The interface comprises a free fiber tip structure having flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive and an encapsulant between the portions of the fibers that extend out of the adhesive and the fiber's free tips.
    Type: Application
    Filed: June 26, 2001
    Publication date: December 20, 2001
    Inventors: Charles Smith, Michael M. Chau, Roger A. Emigh, Nancy F. Dean
  • Electronic device having fibrous interface
    Publication number: 20010023968
    Abstract: Described is an electronic device having a compliant fibrous interface. The interface comprises a free fiber tip structure having flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive and an encapsulant between the portions of the fibers that extend out of the adhesive and the fiber's free tips.
    Type: Application
    Filed: January 31, 2001
    Publication date: September 27, 2001
    Inventors: Charles Smith, Michael M. Chau, Roger A. Emigh, Nancy F. Dean
  • Transferrable compliant fibrous thermal interface
    Publication number: 20010006715
    Abstract: Described is a transferrable fibrous thermal interface. The interface comprises flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive. An encapsulant fills spaces between the portions of the fibers that extend out of the adhesive and a release liner is on at least one outer surface of the interface.
    Type: Application
    Filed: February 26, 2001
    Publication date: July 5, 2001
    Inventors: Michael R. Pinter, Nancy F. Dean, William B. Willett, Amy Gettings, Charles Smith