Abstract: This invention relates to electrically programmable photolithography masks and to structures fabricated by such masks. An electrically programmable photolithography mask with memory to retain a programmed pattern after programming is described. The mask comprises: a single, photolithographic mask plate to provide a mechanical support for said mask; an array of pixels each pixel comprising an electrically programmable solid-state electro-opaque structure fabricated on said mask plate; a plurality of row electrodes; a plurality of column electrodes; said row and column electrodes defining said pixels and being configured for addressing individual said electro-opaque pixels for programming said mask to define a pattern of optical modulation by the mask; and a thin film protective covering layer over at least said array of electro-opaque pixels.

Abstract: A silicon substrate is coated with one or more layers of resist. First and second circuit patterns are exposed in sequence, where the second pattern crosses the first pattern. The patterned resist layers are developed to open holes which extend down to the substrate only where the patterns cross over each other. These holes provide a mask suitable for implanting single phosphorous ions in the substrate, for a solid state quantum computer. Further development of the resist layers provides a mask for the deposition of nanoelectronic circuits, such as single electron transistors, aligned to the phosphorous ions.