Patents by Inventor Nancy M. Mar

Nancy M. Mar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compliant and hermetic solder seal
    Patent number: 6958446
    Abstract: A solder joint or seal attaching components having dissimilar coefficients of thermal expansion is made thin (e.g., less than 20 ?m and preferably about 5 ?m) and of a solder such as an indium-based solder that has a tendency to creep. The solder is toroidal or otherwise shaped to avoid tensile stress in the solder. Axial shearing stress in the solder causes reversible creep without causing failure of the joint or seal. In one embodiment, a toroidal solder seal has a diameter, a footprint, and a thickness in approximate proportions of 5000:200:1.
    Type: Grant
    Filed: April 17, 2002
    Date of Patent: October 25, 2005
    Assignee: Agilent Technologies, Inc.
    Inventors: Giles Humpston, Yoshikatsu Ichimura, Nancy M. Mar, Daniel J. Miller, Michael J. Nystrom, Heidi L. Reynolds, Gary R. Trott
  • Vented cavity, hermetic solder seal
    Patent number: 6732905
    Abstract: Fluxless soldering processes use pressure variations and vented cavities within large-area solder joints to reduce void volumes and improve the properties of the large-area solder joints. The vents can be sealed after soldering if closed cavities are desired. A cavity can also improve hermeticity of a solder joint by providing an additional solder fillet around the cavity in addition to the solder fillet around the perimeter of the solder joint.
    Type: Grant
    Filed: April 16, 2002
    Date of Patent: May 11, 2004
    Assignee: Agilent Technologies, Inc.
    Inventors: Giles Humpston, Yoshikatsu Ichimura, Nancy M. Mar, Daniel J. Miller, Michael J. Nystrom, Gary R. Trott
  • Compliant and hermetic solder seal
    Publication number: 20030198428
    Abstract: A solder joint or seal attaching components having dissimilar coefficients of thermal expansion is made thin (e.g., less than 20 &mgr;m and preferably about 5 &mgr;m) and of a solder such as an indium-based solder that has a tendency to creep. The solder is toroidal or otherwise shaped to avoid tensile stress in the solder. Axial shearing stress in the solder causes reversible creep without causing failure of the joint or seal. In one embodiment, a toroidal solder seal has a diameter, a footprint, and a thickness in approximate proportions of 5000:200:1.
    Type: Application
    Filed: April 17, 2002
    Publication date: October 23, 2003
    Inventors: Giles Humpston, Yoshikatsu Ichimura, Nancy M. Mar, Daniel J. Miller, Michael J. Nystrom, Heidi L. Reynolds, Gary R. Trott
  • Vented cavity, hermetic solder seal
    Publication number: 20030192942
    Abstract: Fluxless soldering processes use pressure variations and vented cavities within large-area solder joints to reduce void volumes and improve the properties of the large-area solder joints. The vents can be sealed after soldering if closed cavities are desired. A cavity can also improve hermeticity of a solder joint by providing an additional solder fillet around the cavity in addition to the solder fillet around the perimeter of the solder joint.
    Type: Application
    Filed: April 16, 2002
    Publication date: October 16, 2003
    Inventors: Giles Humpston, Yoshikatsu Ichimura, Nancy M. Mar, Daniel J. Miller, Michael J. Nystrom, Gary R. Trott