Patents by Inventor Nancy Wagner Hannon

Nancy Wagner Hannon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming recessed thin film landing pad structure
    Patent number: 6500751
    Abstract: A multilayer thin film via landing pad structure includes a thin film conductor structure with a recessed landing pad formed between an upper layer of polyimide dielectric and a lower layer of polyimide dielectric. A multilayer thin film via landing pad structure is formed on a lower layer of dielectric having a top surface. A depression is formed in the top surface of the lower layer of dielectric. The depression has a bottom within the lower layer. A recessed landing pad comprising a conductor is formed in the depression on the surface of the lower layer of dielectric. A conductor line is formed on the lower layer of dielectric in contact with the recessed landing pad. An upper layer of dielectric is formed over the lower layer of dielectric, the thin film conductor line and the recessed landing pad. A conductive via is formed extending through the upper layer of dielectric into contact with the recessed landing pad.
    Type: Grant
    Filed: January 29, 2001
    Date of Patent: December 31, 2002
    Assignee: International Business Machines Corporation
    Inventors: Richard Philip Surprenant, Edward Sumner Begle, Nancy Wagner Hannon, Mathias Pierre Jeanneret
  • Recessed thin film landing pad structure
    Publication number: 20020146900
    Abstract: A multilayer thin film via landing pad structure includes a thin film conductor structure with a recessed landing pad formed between an upper layer of polyimide dielectric and a lower layer of polyimide dielectric. A multilayer thin film via landing pad structure is formed on a lower layer of dielectric having a top surface. A depression is formed in the top surface of the lower layer of dielectric. The depression has a bottom within the lower layer. A recessed landing pad comprising a conductor is formed in the depression on the surface of the lower layer of dielectric. A conductor line is formed on the lower layer of dielectric in contact with the recessed landing pad. An upper layer of dielectric is formed over the lower layer of dielectric, the thin film conductor line and the recessed landing pad. A conductive via is formed extending through the upper layer of dielectric into contact with the recessed landing pad.
    Type: Application
    Filed: January 29, 2001
    Publication date: October 10, 2002
    Applicant: International Business Machines Corporation
    Inventors: Richard Philip Surprenant, Edward Sumner Begle, Nancy Wagner Hannon, Mathias Pierre Jeanneret